LED Flex PCB
US$0.36-0.78 / Piece
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What is Custom Ultra Thin LED Flex PCB Flexible PCB LED Circuit Board

About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

1-999 Pieces US$0.78

1,000-4,999 Pieces US$0.56

5,000-9,999 Pieces US$0.46

10,000+ Pieces US$0.36

Sepcifications

  • Structure Multilayer FPC
  • Material Fiberglass Epoxy, Polyester Film
  • Combination Mode Adhesive Flexible Plate
  • Application Aviation and Aerospace, Consumer Electronics
  • Conductive Adhesive Conductive Silver Paste
  • Flame Retardant Properties V2, V0
  • Processing Technology Delay Pressure Foil, Electrolytic Foil
  • Base Material Copper
  • Insulation Materials Epoxy Resin
  • Transport Package Vacuum+Carton Packing
  • Specification RoHS, ISO9001, UL, SGS
  • Trademark FL
  • Origin Shenzhen, China
  • Type Rigid Circuit Board
  • Mechanical Rigid Rigid
  • Dielectric Fr4 and Polyimide, Fr-4
  • Board Material Fr4 and Polyimide
  • Board Layer 2 Layer Rigide and 2 Layer Flex
  • Copper Thickness 1 Oz
  • Min. Line Space 0.05mm (2mil)
  • Min Conductor Width 0.05mm(2mil)
  • Min.Hole Size 0.075mm (3mil)
  • Solder Mask Any Color
  • Silkscreen Any Color
  • Surface Finishing Enig, Immersion Tin, Immersion Gold. OSP
  • Lead Time 5-6 Working Days
  • PCB Design Customer Provided
  • Board Thickness 0.1mm
  • Min Pad +/-0.1mm (4mil)
  • Outline Machining Accuracy +/-0.1mm (4mil)
  • MOQ 1 PCS

Product Description

Custom Ultra Thin Led Flex PCB Flexible PCB Led circuit Board Fastline could produce 1-26 layers PCB board for electronic products, providing PCB design, PCB fabrication, PCB clone, and PCB assembly services. and we have got the UL, ISO, SGS certifications. Please see our PCB catalog below: ...

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LED Flex PCB Comparison
Transaction Info
Price US $ 0.36-0.78/ Piece US $ 5.00-10.00/ Piece US $ 0.01-0.10/ Piece US $ 0.1/ Piece US $ 0.1/ Piece
Min Order 1 Pieces 1 Pieces 1 Pieces 1000 Pieces 1000 Pieces
Payment Terms L/C, T/T, Western Union, Paypal T/T, Western Union, Paypal, Money Gram L/C, T/T, D/P, Western Union, Paypal, Money Gram T/T, Western Union, Paypal T/T, Western Union, Paypal
Quality Control
Management System Certification ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949 - -
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue - US$10 Million - US$50 Million US$50 Million - US$100 Million US$1 Million - US$2.5 Million US$1 Million - US$2.5 Million
Business Model OEM, ODM OEM OEM OEM, Own Brand(eshine) OEM, Own Brand(eshine)
Average Lead Time Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: one month
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: one month
Product Attributes
Specification
Structure: Multilayer FPC;
Material: Fiberglass Epoxy, Polyester Film;
Combination Mode: Adhesive Flexible Plate;
Application: Aviation and Aerospace, Consumer Electronics;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V2, V0;
Processing Technology: Delay Pressure Foil, Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Type: Rigid Circuit Board;
Mechanical Rigid: Rigid;
Dielectric: Fr4 and Polyimide, Fr-4;
Board Material: Fr4 and Polyimide;
Board Layer: 2 Layer Rigide and 2 Layer Flex;
Copper Thickness: 1 Oz;
Min. Line Space: 0.05mm (2mil);
Min Conductor Width: 0.05mm(2mil);
Min.Hole Size: 0.075mm (3mil);
Solder Mask: Any Color;
Silkscreen: Any Color;
Surface Finishing: Enig, Immersion Tin, Immersion Gold. OSP;
Lead Time: 5-6 Working Days;
PCB Design: Customer Provided;
Board Thickness: 0.1mm;
Min Pad: +/-0.1mm (4mil);
Outline Machining Accuracy: +/-0.1mm (4mil);
MOQ: 1 PCS;
Structure: Multilayer FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Pi+Pi/Fr4 for Stiffener;
Insulation Materials: Organic Resin;
Brand: Exceeding;
Service: 7*24 Hours Online;
Technology: Lead The Industry;
Delivery: 5days;
Keyword: FPC;
Structure: Single-Sided FPC;
Material: Polyimide;
Combination Mode: Without Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Anisotropic Conductive Adhesive;
Flame Retardant Properties: V0;
Processing Technology: Delay Pressure Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Abis;
Test: Flying Probe and Fixture;
Certificates: UL, RoHS, SGS, ISO9001;
Board Thickness: 0.15mm / 0.18mm / Custom;
Custom: OEM;
Copper: 1oz / 36um; 2oz;
Layers: 1 Layer / 2 Layers;
Structure: Double-Sided FPC;
Material: Polyester Film;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Eshine;
Structure: Double-Sided FPC;
Material: Polyester Film;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Eshine;
Supplier Name

Fastline Circuits Co., Limited

Diamond Member Audited Supplier

EXCEEDING ELECTRONICS GROUP LIMITED

Diamond Member Audited Supplier

Abis Circuits Co., Ltd.

Diamond Member Audited Supplier

ESHINE CORP LIMITED

Gold Member

ESHINE CORP LIMITED

Gold Member