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US$0.12-6.65 / Piece

Customize 3.2mm 2oz Copper New Fr4 Multilayer Circuit Board PCB Contronlling Motherboard PCB pictures & photos

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What is Customize 3.2mm 2oz Copper New Fr4 Multilayer Circuit Board PCB Contronlling Motherboard PCB

Name: Customize 3.2mm 2oz Copper New Fr4 Multilayer Circuit Board PCB Contronlling Motherboard PCB
Uploaded: 2025-04-15T09:09:59+08:00
Description: A PCB Weighing Scale PCB Circuit Board Manufacturing PCB Fastline Circuits, which is a leading PCB manufacturer in China,providing PCB fabrication,PCB clone and PCB assembly services, and we have

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Price

Purchase Qty. Reference FOB Price

1-4,999 Pieces US$6.65

5,000-9,999 Pieces US$2.69

10,000+ Pieces US$0.12

Sepcifications

Structure Multilayer Rigid PCB
Dielectric FR-4
Material Polyester Glass Fiber Mat Laminate
Application Consumer Electronics
Flame Retardant Properties V2
Processing Technology Electrolytic Foil
Production Process Additive Process
Base Material Copper
Insulation Materials Organic Resin
Brand FL
Transport Package Vacuum+Carton Packing
Specification RoHS, ISO9001, UL, SGS
Trademark FL
Origin Shenzhen, China
Soldermask Red
Silkscreen Black
Materials Fr4
Surface Enig
MOQ 1PCS
Service Fast Deliver
Board Thickness 3.2
Copper Thickness 2oz
Mini Holes 0.1mm
Mini Track 3mil/3mil
Test 100%
Small Order Accept
Lead Time 5-6days
Package Carton
Delivery DHL/FedEx/UPS

Product Description

A PCB Weighing Scale PCB Circuit Board Manufacturing PCB Fastline Circuits, which is a leading PCB manufacturer in China,providing PCB fabrication,PCB clone and PCB assembly services, and we have got the UL, ISO, SGS certifications. And we also provide 24 hours quick turn PCB prototype ...

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Fastline Circuits Co., Limited

Diamond Member Since 2013

Audited Supplier

Business Type Trading Company
Main Products Print Circuit Board, Aluminum PCB, Flexible PCB, Rigid PCB, PCB Prototype
Number of Employees 15
Year of Establishment 2006-09-21
Management System Certification ISO9001:2015, ISO14001:2015, IATF16949
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays

PCB Comparison

	Customize 3.2mm 2oz Copper New Fr4 Multilayer Circuit Board PCB Contronlling Motherboard PCB Contact Now	Quick View Multilayer 8layer HDI PCB Shengyi S1000h Enig for Automobile GPS Contact Now	Quick View Shengyi Material S1000h 2.0mm HDI PCB Enig for Telecom Servers Contact Now	Quick View Telecom Light Template High Density Interconnect 8layer It180A Plated Gold PCB Contact Now	Quick View Telecom Backplane HDI 16layer S1000h 4.0mm Immersion Sn PCB Contact Now

Transaction Info
	Customize 3.2mm 2oz Copper New Fr4 Multilayer Circuit Board PCB Contronlling Motherboard PCB Contact Now	Quick View Multilayer 8layer HDI PCB Shengyi S1000h Enig for Automobile GPS Contact Now	Quick View Shengyi Material S1000h 2.0mm HDI PCB Enig for Telecom Servers Contact Now	Quick View Telecom Light Template High Density Interconnect 8layer It180A Plated Gold PCB Contact Now	Quick View Telecom Backplane HDI 16layer S1000h 4.0mm Immersion Sn PCB Contact Now
Price	US $ 0.12-6.65/ Piece	US $ 1.95-8.83/ Piece	US $ 1.05-7.63/ Piece	US $ 0.895-5.88/ Piece	US $ 5.39-27.66/ Piece
Min Order	1 Pieces	100 Pieces	100 Pieces	100 Pieces	100 Pieces
Payment Terms	L/C, T/T, D/P, Western Union, Paypal	T/T, Western Union, Paypal	T/T, Western Union, Paypal	T/T, Western Union, Paypal	T/T, Western Union, Paypal
Quality Control
Management System Certification	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE, GMP	ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE, GMP	ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE, GMP	ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE, GMP
Trade Capacity
Export Markets	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue	-	US$50 Million - US$100 Million	US$50 Million - US$100 Million	US$50 Million - US$100 Million	US$50 Million - US$100 Million
Business Model	OEM, ODM	OEM, ODM	OEM, ODM	OEM, ODM	OEM, ODM
Average Lead Time	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays
Product Attributes
Specification	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Polyester Glass Fiber Mat Laminate; Application: Consumer Electronics; Flame Retardant Properties: V2; Processing Technology: Electrolytic Foil; Production Process: Additive Process; Base Material: Copper; Insulation Materials: Organic Resin; Brand: FL; Soldermask: Red; Silkscreen: Black; Materials: Fr4; Surface: Enig; MOQ: 1PCS; Service: Fast Deliver; Board Thickness: 3.2; Copper Thickness: 2oz; Mini Holes: 0.1mm; Mini Track: 3mil/3mil; Test: 100%; Small Order: Accept; Lead Time: 5-6days; Package: Carton; Delivery: DHL/FedEx/UPS;	Structure: HDI PCB; Dielectric: Fr4 Em825 1.2mm; Material: Epoxy Paper Laminate; Application: Consumer Electronics; Flame Retardant Properties: V0; Processing Technology: Enig; Production Process: Blind&Buried Vias; Base Material: Copper; Insulation Materials: Epoxy Resin; Layer Count: 8layer; HDI Structure: 1+N+1 to Any Layer; Min. Trace/Space: 2/2mil; Blind/Buried Vias: 0.1mm Laser Drilling; Other: Resin Plugged;	Structure: Fr4 Shengyi Material; Dielectric: Fr4 S1000h 2.0mm; Material: Epoxy Paper Laminate; Application: Consumer Electronics; Flame Retardant Properties: V0; Processing Technology: Enig; Production Process: Blind&Buried Vias; Base Material: Copper; Insulation Materials: Epoxy Resin; Layer Count: 6layer; HDI Structure: 1+N+1 to Any Layer; Min. Trace/Space: 2/2mil; Blind/Buried Vias: 0.1mm Laser Drilling; Min. Hole Wall Cu: 25um;	Structure: Fr4 Tg180; Dielectric: Fr4 It180A 1.0mm; Material: Epoxy Paper Laminate; Application: Telecom; Flame Retardant Properties: V0; Processing Technology: Enig; Production Process: Blind&Buried Vias; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: 1; Layer Count: 8layer; HDI Structure: 1+N+1 to Any Layer; Min. Trace/Space: 2/2mil; Blind/Buried Vias: 0.1mm Laser Drilling; Specialty: Plated Gold+Gold Fingers;	Structure: Fr4 Tg180; Dielectric: Fr4 S1000h 4.0mm; Material: Epoxy Paper Laminate; Application: Telecom; Flame Retardant Properties: V0; Processing Technology: Immersion Sn; Production Process: Blind&Buried Vias; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: 1; Layer Count: 16layer HDI PCB; HDI Structure: 1+N+1 to Any Layer; Min. Trace/Space: 2/2mil; Blind/Buried Vias: 0.1mm Laser Drilling; Min. Hole Wall: 25um Cu;
Supplier Name	Fastline Circuits Co., Limited	Shanghai Gawin Electronic Technology Co., Ltd.	Shanghai Gawin Electronic Technology Co., Ltd.	Shanghai Gawin Electronic Technology Co., Ltd.	Shanghai Gawin Electronic Technology Co., Ltd.
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