4 Layer Flexible FPCB Board Prototype pictures & photos

4 Layer Flexible FPCB Board Prototype

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Price

Purchase Qty. Reference FOB Price

1-999 Pieces US$0.69

1,000-4,999 Pieces US$0.62

5,000-9,999 Pieces US$0.56

10,000+ Pieces US$0.50

Sepcifications

Structure Multilayer FPC
Material Polyimide
Combination Mode Without Adhesive Flexible Plate
Application Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace
Conductive Adhesive Conductive Silver Paste
Flame Retardant Properties HB
Processing Technology Electrolytic Foil
Base Material Aluminum
Insulation Materials Organic Resin
Brand Fastline
Transport Package Vacuum+Carton Packing
Specification UL, SGS, ROHS
Trademark FL
Origin China
Board Material Polyimide
Board Thickness 1.6 mm
Copper Thickness 1 Oz (35um)
Surface Treatment HASL Lead Free

Product Description

Product Description Size of Flexible PCB 41.5X 112.3mm Number of Layers 2 Board Type Flexible PCB Board Thickness 0.15mm Board Material Polyimide (PI) 25µm Board Material Supplier ITEQ Tg Value of Board Material 60ºC PTH Cu thickness ≥20 µm Inner Iayer Cu ...

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Fastline Circuits Co., Limited

Diamond Member Since 2013

Audited Supplier

Business Type Trading Company
Main Products Print Circuit Board, Aluminum PCB, Flexible PCB, Rigid PCB, PCB Prototype
Number of Employees 15
Year of Establishment 2006-09-21
Management System Certification ISO9001:2015, ISO14001:2015, IATF16949
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays

FPCB Comparison

	4 Layer Flexible FPCB Board Prototype Contact Now	China Brand Molex FFC Flexible Flat Cable Contact Now	0.5mm FPC Connector 24p Gold Plated with SMT Type Contact Now	China 0.5mm Pitch FPC Connector Alternative Molex Fci Pin Header Contact Now	Quick View Membrane Circuit Contact Now

Transaction Info
	4 Layer Flexible FPCB Board Prototype Contact Now	China Brand Molex FFC Flexible Flat Cable Contact Now	0.5mm FPC Connector 24p Gold Plated with SMT Type Contact Now	China 0.5mm Pitch FPC Connector Alternative Molex Fci Pin Header Contact Now	Quick View Membrane Circuit Contact Now
Price	US $ 0.50-0.69/ Piece	US $ 0.2/ Piece	US $ 0.8/ Piece	US $ 0.02/ Piece	Negotiable
Min Order	1 Pieces	1000 Pieces	1000 Pieces	1000 Pieces	100 Pieces
Payment Terms	L/C, T/T, Western Union, Paypal	T/T, Western Union, Paypal	T/T, Western Union, Paypal	T/T, Western Union, Paypal, Money Gram	L/C, T/T, Money Gram
Quality Control
Management System Certification	ISO 9001, ISO 14001, IATF16949	-	ISO 9001, ISO 14001, IATF16949	-	ISO 9001
Trade Capacity
Export Markets	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue	-	US$1 Million - US$2.5 Million	US$5 Million - US$10 Million	US$1 Million - US$2.5 Million	-
Business Model	OEM, ODM	OEM, Own Brand(eshine)	OEM, ODM, Own Brand()	OEM, Own Brand(eshine)	OEM, ODM, Own Brand()
Average Lead Time	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: within 15 workdays Peak Season Lead Time: one month	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: within 15 workdays Peak Season Lead Time: one month	Off Season Lead Time: within 15 workdays Peak Season Lead Time: one month
Product Attributes
Specification	Structure: Multilayer FPC; Material: Polyimide; Combination Mode: Without Adhesive Flexible Plate; Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace; Conductive Adhesive: Conductive Silver Paste; Flame Retardant Properties: HB; Processing Technology: Electrolytic Foil; Base Material: Aluminum; Insulation Materials: Organic Resin; Brand: Fastline; Board Material: Polyimide; Board Thickness: 1.6 mm; Copper Thickness: 1 Oz (35um); Surface Treatment: HASL Lead Free;	Structure: Single-Sided FPC; Material: Polyester Film; Combination Mode: Adhesive Flexible Plate; Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace; Conductive Adhesive: Conductive Silver Paste; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Base Material: Aluminum; Insulation Materials: Organic Resin; Brand: Eshine;	Structure: Single-Sided FPC; Material: Polyimide; Combination Mode: Adhesive Flexible Plate; Application: Computer with LCD Screen; Conductive Adhesive: Conductive Silver Paste; Flame Retardant Properties: HB; Processing Technology: Delay Pressure Foil; Base Material: Copper; Insulation Materials: Organic Resin; Brand: Antenk; Number of Positions: 2-100; Compliant with The RoHS Directive: RoHS;	Structure: Double-Sided FPC; Material: Polyimide; Combination Mode: Without Adhesive Flexible Plate; Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace; Conductive Adhesive: Conductive Silver Paste; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Organic Resin; Brand: Eshine;	Structure: Double-Sided FPC; Material: Polyester Film; Combination Mode: Adhesive Flexible Plate; Application: Digital Products, Mobile Phone, Aviation and Aerospace; Conductive Adhesive: Conductive Silver Paste; Processing Technology: Electrolytic Foil; Base Material: Copper; Quality: Top Quality; Environmental Friendly: Raw Material Pass RoHS, SGS Test; Exterior: Good Looking; Touch Feeling: Excellent Touch Feeling;
Supplier Name	Fastline Circuits Co., Limited	ESHINE CORP LIMITED	Antenk Electronics Co., Ltd.	ESHINE CORP LIMITED	TKM (DONGGUAN) MEMBRANE TECHNOLOGY LTD.
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