8 Layer Immesion Gold Multilayer PCB Board for Computer pictures & photos

8 Layer Immesion Gold Multilayer PCB Board for Computer

Contact Now

Get Latest Price

About this Item

Price

Purchase Qty. Reference FOB Price

1-999 Pieces US$0.90

1,000-1,999 Pieces US$0.82

2,000+ Pieces US$0.71

Sepcifications

Type Combining Rigid Circuit Board
Dielectric FR-4
Material Fiberglass Epoxy
Application Medical Instruments
Flame Retardant Properties V0
Mechanical Rigid Rigid
Processing Technology Delay Pressure Foil
Base Material Fr4
Insulation Materials Epoxy Resin
Transport Package Vacuum+Carton Packing
Specification RoHS, ISO9001, UL, SGS
Trademark FL
Origin Shenzhen, China
Board Thickness 1.6mm
Board Layer 8 Layers
Copper Thickness 1 Oz
Solder Mask Green
Silksreen White
Surface Finihsing Immesion Gold
Lead Time 6-8 Working Days
Min.Hole Size 0.15mm
Min. Line Space 0.1mm
Text Flying Probe Text

Product Description

8 Layer Immesion Gold Multilayer PCB Board for Computer Fastline could produce 1-26 layers PCB board for electronic products.providing PCB design, PCB fabrication,PCB clone and PCB assembly services. and we have got the UL, ISO, SGS certifications. Pls see our pcb catalog below: 1. single ...

Learn More

Fastline Circuits Co., Limited

Diamond Member Since 2013

Audited Supplier

Business Type Trading Company
Main Products Print Circuit Board, Aluminum PCB, Flexible PCB, Rigid PCB, PCB Prototype
Number of Employees 15
Year of Establishment 2006-09-21
Management System Certification ISO9001:2015, ISO14001:2015, IATF16949
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays

PCB Board Comparison

	8 Layer Immesion Gold Multilayer PCB Board for Computer Contact Now	Quick View Halogen-Free Matt Black Printed Circuit Board PCB Fabricator Contact Now	Quick View Qualified Digital Pressure Transmitter Electronic Circuit Board PCB PCBA Contact Now	Customized Multilayer HDI PCB Board Immersion Gold Circuits Board with Blind and Buried Vias Contact Now	Quick View Enig Multilayer PCB, HDI Printed Circuit Board with Blind and Buried Vias Contact Now

Transaction Info
	8 Layer Immesion Gold Multilayer PCB Board for Computer Contact Now	Quick View Halogen-Free Matt Black Printed Circuit Board PCB Fabricator Contact Now	Quick View Qualified Digital Pressure Transmitter Electronic Circuit Board PCB PCBA Contact Now	Customized Multilayer HDI PCB Board Immersion Gold Circuits Board with Blind and Buried Vias Contact Now	Quick View Enig Multilayer PCB, HDI Printed Circuit Board with Blind and Buried Vias Contact Now
Price	US$0.71 - 0.90 / Piece	US$0.01 - 30.00 / Piece	US$0.01 - 30.00 / Piece	US$0.01 - 5.00 / pcs	US$0.10 - 15.00 / Piece
Min Order	1 Piece	1 Piece	1 Piece	1 pcs	1 Piece
Payment Terms	LC, T/T, D/P, PayPal, Western Union, Small-amount payment	LC, T/T, PayPal, Western Union	LC, T/T, PayPal, Western Union	LC, T/T, PayPal, Western Union	T/T, D/P, PayPal, Western Union, Money Gram
Quality Control
Management System Certification	-	-	-	-	-
Trade Capacity
Export Markets	North America, South America, Europe, Southeast Asia/ Mideast	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Western Europe
Annual Export Revenue	-	-	-	-	-
Business Model	-	-	-	-	-
Average Lead Time	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays
Product Attributes
Specification	Type: Combining Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Medical Instruments; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Delay Pressure Foil; Base Material: Fr4; Insulation Materials: Epoxy Resin; Board Thickness: 1.6mm; Board Layer: 8 Layers; Copper Thickness: 1 Oz; Solder Mask: Green; Silksreen: White; Surface Finihsing: Immesion Gold; Lead Time: 6-8 Working Days; Min.Hole Size: 0.15mm; Min. Line Space: 0.1mm; Text: Flying Probe Text;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Medical Instruments; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: Kb; Cooper Thickness: 1oz; Surface Finishing: Lead Free HASL; Solder Mask Color: Green; Silkscreen: White; Min Line Width/Space: 0.075mm/0.075mm; Min Hole Diameter: 0.15mm; Finished Board Thickness: 1.6 mm; Layer: 4 Layer;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: Kb; Cooper Thickness: 1oz; Surface Finishing: Lead Free HASL; Solder Mask Color: Green; Silkscreen: White; Min Line Width/Space: 0.2mm/0.2mm; Min Hole Diameter: 0.2mm; Finished Board Thickness: 1.6 mm; Layer: 2 Layer;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Auto; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: Abis; Layer: 1-20 Layers; Raw Material: Fr-4,Cu Base,High Tg Fr-4,PTFE,Rogers,Teflon etc.; Board Thickness: 0.20mm-8.00mm; Minimum Line/ Space: 0.075mm; Impedance Control Tolerance: +/-10%; Surface Finish/Treatment: HASL,Enig,Chem,Tin,Flash Gold, OSP, Gold Finger;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Communication; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Insulation Materials: Epoxy Resin;
Supplier Name	Fastline Circuits Co., Limited	Abis Circuits Co., Ltd.	Abis Circuits Co., Ltd.	Abis Circuits Co., Ltd.	EXCEEDING ELECTRONICS GROUP LIMITED
Select All

Contact Now

Hot Search