| Specification |
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Medical Instruments;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
Board Thicknes: 1.6mm;
Copper Thickness: 1oz;
Material Type: Fr4;
Surface Treatment: HASL Lead Free;
Solder Mask: Green, Red, Blue, Black;
Silk Screen Color: White;
Board Layer: 1-50;
Shipping Type: DHL, UPS, TNT, EMS, FedEx etc;
Packing Type: Carton + Vacuum;
Lead Time: 10 Workdays;
Test: 100%;
Mini Hole: 0.1mm;
Mini Trace: 3/3mil;
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Type: Rigid Circuit Board;
Dielectric: Rogers Material;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: RO5880;
Insulation Materials: Epoxy Resin;
Brand: Kxpcba;
Shape: Rectangular, Round, Slots, Cutouts, Complex;
Surface Treatment: HASL, Lf HASL, Enig, OSP, Carbon Oil;
PCB Testing: E-Test, Fly Probe Test, Visual Checking;
Min. Hole Size: 0.1mm(4mil) for HDI / 0.15mm(6mil);
Copper Thickness: 0.5-12oz(18-420um);
Board Thickness: 0.2-6.0mm;
Min. Line Width: 0.075mm(3mil);
Min. Line Spacing: 0.075mm(3mil);
Min Width of Annular Ring: 0.15mm(6mil);
Service: 7*24 Hours Online;
|
Type: Rigid Circuit Board;
Dielectric: Rogers Material;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: RO5880;
Insulation Materials: Epoxy Resin;
Brand: Kxpcba;
Shape: Rectangular, Round, Slots, Cutouts, Complex;
Surface Treatment: HASL, Lf HASL, Enig, OSP, Carbon Oil;
PCB Testing: E-Test, Fly Probe Test, Visual Checking;
Min. Hole Size: 0.1mm(4mil) for HDI / 0.15mm(6mil);
Copper Thickness: 0.5-12oz(18-420um);
Board Thickness: 0.2-6.0mm;
Min. Line Width: 0.075mm(3mil);
Min. Line Spacing: 0.075mm(3mil);
Min Width of Annular Ring: 0.15mm(6mil);
Service: 7*24 Hours Online;
|
Type: Rigid Circuit Board;
Dielectric: Rogers Material;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: RO5880;
Insulation Materials: Epoxy Resin;
Brand: Kxpcba;
Shape: Rectangular, Round, Slots, Cutouts, Complex;
Surface Treatment: HASL, Lf HASL, Enig, OSP, Carbon Oil;
PCB Testing: E-Test, Fly Probe Test, Visual Checking;
Min. Hole Size: 0.1mm(4mil) for HDI / 0.15mm(6mil);
Copper Thickness: 0.5-12oz(18-420um);
Board Thickness: 0.2-6.0mm;
Min. Line Width: 0.075mm(3mil);
Min. Line Spacing: 0.075mm(3mil);
Min Width of Annular Ring: 0.15mm(6mil);
Service: 7*24 Hours Online;
|
Type: Rigid Circuit Board;
Dielectric: Rogers Material;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: RO5880;
Insulation Materials: Epoxy Resin;
Brand: Kxpcba;
Shape: Rectangular, Round, Slots, Cutouts, Complex;
Surface Treatment: HASL, Lf HASL, Enig, OSP, Carbon Oil;
PCB Testing: E-Test, Fly Probe Test, Visual Checking;
Min. Hole Size: 0.1mm(4mil) for HDI / 0.15mm(6mil);
Copper Thickness: 0.5-12oz(18-420um);
Board Thickness: 0.2-6.0mm;
Min. Line Width: 0.075mm(3mil);
Min. Line Spacing: 0.075mm(3mil);
Min Width of Annular Ring: 0.15mm(6mil);
Service: 7*24 Hours Online;
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