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US$0.62-0.89 / Piece

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Shenzhen Laser Welding Machine Custom Multilayer HDI PCB with Copper Enig Circuit Board PCB Fabrication pictures & photos

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What is Shenzhen Laser Welding Machine Custom Multilayer HDI PCB with Copper Enig Circuit Board PCB Fabrication

Name: Shenzhen Laser Welding Machine Custom Multilayer HDI PCB with Copper Enig Circuit Board PCB Fabrication
Uploaded: 2025-01-04T16:02:16+08:00
Description: Circuit Board Pcb Fabrication And Assembly Manufacturing Fastline could produce 1-26 layers PCB board for electronic products.providing PCB design, PCB fabrication,PCB clone and PCB assembly service

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About this Item

Price

Purchase Qty. Reference FOB Price

1-999 Pieces US$0.89

1,000-4,999 Pieces US$0.82

5,000-9,999 Pieces US$0.71

10,000+ Pieces US$0.62

Sepcifications

Type Rigid Circuit Board
Dielectric FR-4
Material Fiberglass Epoxy
Application Communication
Flame Retardant Properties V0
Mechanical Rigid Rigid
Processing Technology Electrolytic Foil
Base Material Fr4
Insulation Materials Epoxy Resin
Brand FL
Transport Package Vacuum+Carton Packing
Specification RoHS, ISO9001, UL, SGS
Trademark FL
Origin Shenzhen, China
Board Material Fr4
Board Layer 4
Board Thickness 1.6mm
Copper Thickness 2 Oz
Max PCB Size 650*650mm
Min Hole 0.15mm
Min Trace 0.15mm
Surface Finishing Enig
Solder Mask Any
Lead Time 4-5 Working Days

Product Description

Circuit Board Pcb Fabrication And Assembly Manufacturing Fastline could produce 1-26 layers PCB board for electronic products.providing PCB design, PCB fabrication,PCB clone and PCB assembly services. and we have got the UL, ISO, SGS certifications. Pls see our pcb catalog below: 1. single ...

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Fastline Circuits Co., Limited

Diamond Member Since 2013

Audited Supplier

Business Type Trading Company
Main Products Print Circuit Board, Aluminum PCB, Flexible PCB, Rigid PCB, PCB Prototype
Number of Employees 15
Year of Establishment 2006-09-21
Management System Certification ISO9001:2015, ISO14001:2015, IATF16949
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays

PCB Board Comparison

	Shenzhen Laser Welding Machine Custom Multilayer HDI PCB with Copper Enig Circuit Board PCB Fabrication Contact Now	Custom PCB Electronics Circuit Board Contact Now	OEM/ODM Service PCB Manufacturing Companies Contact Now	Shenzhen PCB Company, Prototype Printed Circuit Board Contact Now	Quick View Customized Power Supply Module Red Printed Wiring Board, PCB Circuits Contact Now

Transaction Info
	Shenzhen Laser Welding Machine Custom Multilayer HDI PCB with Copper Enig Circuit Board PCB Fabrication Contact Now	Custom PCB Electronics Circuit Board Contact Now	OEM/ODM Service PCB Manufacturing Companies Contact Now	Shenzhen PCB Company, Prototype Printed Circuit Board Contact Now	Quick View Customized Power Supply Module Red Printed Wiring Board, PCB Circuits Contact Now
Price	US $ 0.62-0.89/ Piece	US $ 0.10-80.00/ Piece	US $ 0.10-80.00/ Piece	US $ 0.10-80.00/ Piece	US $ 0.10-80.00/ Piece
Min Order	1 Pieces	1 Pieces	1 Pieces	1 Pieces	1 Pieces
Payment Terms	L/C, T/T, D/P, Western Union, Paypal	T/T, Western Union, Paypal	T/T, Western Union, Paypal	T/T, Western Union, Paypal	L/C, T/T, D/P, Western Union, Paypal, Money Gram
Quality Control
Product Certification	-	UL,ISO9001&ISO14001,SGS,RoHS Report	UL,ISO9001&ISO14001,SGS,RoHS Report	UL,ISO9001&ISO14001,SGS,RoHS Report	UL,ISO9001&ISO14001,SGS,RoHS,Ts16949
Management System Certification	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 14001, IATF16949
Trade Capacity
Export Markets	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue	-	US$50 Million - US$100 Million	US$50 Million - US$100 Million	US$50 Million - US$100 Million	US$50 Million - US$100 Million
Business Model	OEM, ODM	OEM	OEM	OEM	OEM
Average Lead Time	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays
Product Attributes
Specification	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Communication; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Fr4; Insulation Materials: Epoxy Resin; Brand: FL; Board Material: Fr4; Board Layer: 4; Board Thickness: 1.6mm; Copper Thickness: 2 Oz; Max PCB Size: 650650mm;* Min Hole: 0.15mm; Min Trace: 0.15mm; Surface Finishing: Enig; Solder Mask: Any; Lead Time: 4-5 Working Days;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Kb; Insulation Materials: Epoxy Resin; Brand: Abis; Holes Specification: Buried/Blind Vias, Via in Pads, Counter Sink Hole; Board Thickness: 0.2-6mm; Copper Thickness: 0.5-8oz; Layers: 1-20layers; Enig Thickness: 1-3u''; Hard Gold Thickness: 5-50u'';	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Kb; Insulation Materials: Epoxy Resin; Brand: Abis; Holes Specification: Buried/Blind Vias, Via in Pads, Counter Sink Hole; Board Thickness: 0.2-6mm; Copper Thickness: 0.5-8oz; Layers: 1-20layers; Enig Thickness: 1-3u''; Hard Gold Thickness: 5-50u'';	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Kb; Insulation Materials: Epoxy Resin; Brand: Abis; Holes Specification: Buried/Blind Vias, Via in Pads, Counter Sink Hole; Board Thickness: 0.2-6mm; Copper Thickness: 0.5-8oz; Enig Thickness: 1-3u''; Hard Gold Thickness: 5-50u'';	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Kb; Insulation Materials: Epoxy Resin; Brand: Abis; Enig Thickness: 1-3u''; Holes Specification: Buried/Blind Vias, Via in Pads, Counter Sink Hole; Hard Gold Thickness: 5-50u''; Board Thickness: 0.2-6mm; Copper Thickness: 0.5-8oz;
Supplier Name	Fastline Circuits Co., Limited	Abis Circuits Co., Ltd.	Abis Circuits Co., Ltd.	Abis Circuits Co., Ltd.	Abis Circuits Co., Ltd.
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