Polyimide/Polycarbonate Flexible Circuit Board Surface-Mount PCB with 0.012-Inch Hole Size, IMD Logos Available

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$1.28-3.36 / Piece

Sepcifications

  • Type Rigid Circuit Board
  • Dielectric FR-4
  • Material Fiberglass Epoxy Resin + Polyimide Resin
  • Application Medical Instruments
  • Flame Retardant Properties V0
  • Mechanical Rigid Fexible
  • Processing Technology Electrolytic Foil
  • Base Material Fr4
  • Insulation Materials Epoxy Resin
  • Brand Fastline
  • Transport Package Vacuumize
  • Specification UL, TS16949, IPC 600 CLASS 2
  • Trademark Fastline
  • Origin Shenzhen, China
  • Copper Thickness 1oz
  • Board Thickness 1.6mm
  • Lead Time 5-7 Days
  • PCB Assembly Type SMT and DIP
  • Shipping Type DHL, UPS, TNT, EMS, FedEx etc
  • Board Layer 1 - 20 Layers
  • Silk Screen Color Customized
  • Solder Mask Green, Red, Blue, Black
  • Surface Treatment HASL Lead Free
  • Material Type Fr4
  • PCB Service One Stop Service
  • Small Orders 1 PCS Is Ok
  • Testing 100%
  • Packaging Carton + Vacuum
  • Impedance Control V-Scoring ±10%

Product Description

Polyimide/Polycarbonate Flexible Surface-mount PCB with 0.012-inch Hole Size, IMD Logos Available Product description: 1. Single-sided PCB, double side &multi-layer PCB with competitive price, good quality and excellent service. 2. CEM-1, FR-1, FR-4, FR-4 High TG, Aluminum base ...

Learn More

Flexible PCB Comparison
Transaction Info
Price US $ 1.28-3.36/ Piece US $ 0.50-8.00/ pieces US $ 1.00-50.00/ Piece US $ 1.00-50.00/ Piece US $ 1.00-50.00/ Piece
Min Order 1 Pieces 5 pieces 1 Pieces 1 Pieces 1 Pieces
Payment Terms L/C, T/T, Western Union, Paypal T/T, Western Union, Paypal, Wechat/Alipay L/C, T/T, D/P, Paypal L/C, T/T, D/P, Paypal L/C, T/T, D/P, Paypal
Quality Control
Product Certification - RoHS, Is09001:2000 - - -
Management System Certification ISO 9001, ISO 14001, IATF16949 ISO 9001 - - -
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe - North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue - - US$5 Million - US$10 Million US$5 Million - US$10 Million US$5 Million - US$10 Million
Business Model OEM, ODM - OEM, ODM OEM, ODM OEM, ODM
Average Lead Time Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
- Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Product Attributes
Specification
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy Resin + Polyimide Resin;
Application: Medical Instruments;
Flame Retardant Properties: V0;
Mechanical Rigid: Fexible;
Processing Technology: Electrolytic Foil;
Base Material: Fr4;
Insulation Materials: Epoxy Resin;
Brand: Fastline;
Copper Thickness: 1oz;
Board Thickness: 1.6mm;
Lead Time: 5-7 Days;
PCB Assembly Type: SMT and DIP;
Shipping Type: DHL, UPS, TNT, EMS, FedEx etc;
Board Layer: 1 - 20 Layers;
Silk Screen Color: Customized;
Solder Mask: Green, Red, Blue, Black;
Surface Treatment: HASL Lead Free;
Material Type: Fr4;
PCB Service: One Stop Service;
Small Orders: 1 PCS Is Ok;
Testing: 100%;
Packaging: Carton + Vacuum;
Impedance Control V-Scoring: ±10%;
Type: Multilayer PCB;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4,Tg,Cem-1,Aluminium;
Insulation Materials: Organic Resin;
Brand: Smart;
Number of Layers: 2/4/6/8/12/14or Custom;
Copper Thickness: 0.5-6.0oz;
Min.Hole Size: 0.1mm;
Board Size: Custom;
Min.Line Width: 0.15mm;
Board Thickness: 0.2-4.0mm;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy Resin + Polyimide Resin;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Delay Pressure Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Customized;
Surface Finished: HASL, Gold Finger, OSP, Enig, Peelable Mask;
Layer: 1-32;
Outline Profile: Rout/ V-Cut Bridge/ Stamp Hole;
Max Production Size: 600*800mm;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Delay Pressure Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Customized;
Surface Finished: HASL, Gold Finger, OSP, Enig, Peelable Mask;
Layer: 1-32;
Outline Profile: Rout/ V-Cut Bridge/ Stamp Hole;
Max Production Size: 600*800mm;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Delay Pressure Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Customized;
Surface Finished: HASL, Gold Finger, OSP, Enig, Peelable Mask;
Layer: 1-32;
Outline Profile: Rout/ V-Cut Bridge/ Stamp Hole;
Max Production Size: 600*800mm;
Supplier Name

Fastline Circuits Co., Limited

Diamond Member Audited Supplier

Shenzhen Smart Electronics Co., Ltd

Diamond Member Audited Supplier

KTB Jilin Technology Co., Ltd.

Gold Member

KTB Jilin Technology Co., Ltd.

Gold Member

KTB Jilin Technology Co., Ltd.

Gold Member