Flexible PCB
US$0.36-0.78 / Piece
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What is PCB Material Flexible PCB Stiffener Flexible PCB Circuit Board

About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

1-999 Pieces US$0.78

1,000-4,999 Pieces US$0.56

5,000-9,999 Pieces US$0.46

10,000+ Pieces US$0.36

Sepcifications

  • Structure Multilayer FPC
  • Material Fiberglass Epoxy, Polyester Film
  • Combination Mode Adhesive Flexible Plate
  • Application Aviation and Aerospace, Consumer Electronics
  • Conductive Adhesive Conductive Silver Paste
  • Flame Retardant Properties V2, V0
  • Processing Technology Delay Pressure Foil, Electrolytic Foil
  • Base Material Copper
  • Insulation Materials Epoxy Resin
  • Transport Package Vacuum+Carton Packing
  • Specification RoHS, ISO9001, UL, SGS
  • Trademark FL
  • Origin Shenzhen, China
  • Type Rigid Circuit Board
  • Mechanical Rigid Rigid
  • Dielectric Fr4 and Polyimide, Fr-4
  • Board Material Fr2 and Polyimide
  • Board Layer 2 Layer Rigide and 2 Layer Flex
  • Copper Thickness 1 Oz
  • Min. Line Space 0.05mm (2mil)
  • Min Conductor Width 0.05mm(2mil)
  • Min.Hole Size 0.075mm (3mil)
  • Solder Mask Any Color
  • Silkscreen Any Color
  • Surface Finishing Enig, Immersion Tin, Immersion Gold. OSP
  • Lead Time 5-6 Working Days
  • PCB Design Customer Provided
  • Board Thickness 0.1mm
  • Min Pad +/-0.1mm (4mil)
  • Outline Machining Accuracy +/-0.1mm (4mil)
  • MOQ 1 PCS

Product Description

Pi Material Flexible PCB Stiffener Flexible PCB circuit Board Fastline could produce 1-26 layers PCB board for electronic products, providing PCB design, PCB fabrication, PCB clone, and PCB assembly services. and we have got the UL, ISO, SGS certifications. Please see our PCB catalog below: ...

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Flexible PCB Comparison
Transaction Info
Price US $ 0.36-0.78/ Piece US $ 2.30-2.60/ Piece US $ 1.30-1.60/ Piece US $ 1.98-2.88/ Piece US $ 2.00-2.80/ Piece
Min Order 1 Pieces 1 Pieces 1 Pieces 1 Pieces 1 Pieces
Payment Terms L/C, T/T, Western Union, Paypal L/C, T/T, Paypal L/C, T/T, Paypal L/C, T/T L/C, T/T
Quality Control
Management System Certification ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 9000, ISO 14001, ISO 14000, ISO 20000, OHSAS/ OHSMS 18001, IATF16949 ISO 9001, ISO 9000, ISO 14001, ISO 14000, ISO 20000, OHSAS/ OHSMS 18001, IATF16949 ISO 14001, ISO 20000, IATF16949 ISO 14001, ISO 20000, IATF16949
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe North America, Eastern Asia, Western Europe North America, Eastern Asia, Western Europe
Annual Export Revenue - Above US$100 Million Above US$100 Million US$50 Million - US$100 Million US$50 Million - US$100 Million
Business Model OEM, ODM OEM OEM OEM, ODM OEM, ODM
Average Lead Time Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: one month
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: one month
Product Attributes
Specification
Structure: Multilayer FPC;
Material: Fiberglass Epoxy, Polyester Film;
Combination Mode: Adhesive Flexible Plate;
Application: Aviation and Aerospace, Consumer Electronics;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V2, V0;
Processing Technology: Delay Pressure Foil, Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Type: Rigid Circuit Board;
Mechanical Rigid: Rigid;
Dielectric: Fr4 and Polyimide, Fr-4;
Board Material: Fr2 and Polyimide;
Board Layer: 2 Layer Rigide and 2 Layer Flex;
Copper Thickness: 1 Oz;
Min. Line Space: 0.05mm (2mil);
Min Conductor Width: 0.05mm(2mil);
Min.Hole Size: 0.075mm (3mil);
Solder Mask: Any Color;
Silkscreen: Any Color;
Surface Finishing: Enig, Immersion Tin, Immersion Gold. OSP;
Lead Time: 5-6 Working Days;
PCB Design: Customer Provided;
Board Thickness: 0.1mm;
Min Pad: +/-0.1mm (4mil);
Outline Machining Accuracy: +/-0.1mm (4mil);
MOQ: 1 PCS;
Structure: Double-Sided FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: UC;
Board Layer: 1;
Board Thickness: 0.15-0.2mm;
Surface Treatment: Enig;
Size: 500*8mm;
Finished Copper Thickness: 35um;
Lead Time: 7 Working Days;
PCB Testing: Flying Probe Testing/E-Testing;
Fast Turn: 3 Working Days;
Ipc Standards: Ipc-Class 2;
Base Material Type: Pi;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: UC;
Layer Count: 1;
Board Thickness: 0.15-0.2mm;
Base Material Type: Pi;
Size: 500*8mm;
Finished Copper Thickness: 35um;
Surface Treatment: Enig;
Solder Mask Color: White/Black;
PCB Testing: Flying Probe Testing/E-Testing;
Ipc Standards: Ipc-Class 2;
Lead Time: 7 Working Days;
Structure: Double-Sided FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V1;
Processing Technology: Electrolytic Foil;
Base Material: Pi;
Insulation Materials: Metal Composite Materials;
Place of Origin: Guangdong, China;
Copper Thickness: 12um--70um;
Min. Hole Size: 0.1mm;
Min. Line Width: 0.05mm;
Min. Line Spacing: 0.05;
Surface Finishing: OSP,Enig,Immersion Tin;
FPC Material: Polyimide;
Board Thickness: 0.075-6.0mm;
Solder Mask Color: Yellow,Black,White,Green,Red,Blue;
FPCB Thickness: Custom;
Sbccy: Rzngdsb;
Structure: Double-Sided FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V1;
Processing Technology: Electrolytic Foil;
Base Material: Pi;
Insulation Materials: Metal Composite Materials;
Place of Origin: Guangdong, China;
Copper Thickness: 12um--70um;
Min. Hole Size: 0.1mm;
Min. Line Width: 0.05mm;
Min. Line Spacing: 0.05;
Surface Finishing: OSP,Enig,Immersion Tin;
FPC Material: Polyimide;
Board Thickness: 0.075-6.0mm;
Solder Mask Color: Yellow,Black,White,Green,Red,Blue;
FPCB Thickness: Custom;
Sbccy: Rzngdsb;
Supplier Name

Fastline Circuits Co., Limited

Diamond Member Audited Supplier

Ucreate PCB Co., Ltd.

Diamond Member Audited Supplier

Ucreate PCB Co., Ltd.

Diamond Member Audited Supplier

Guangzhou Powerful Environmental Protection Technology Co., Ltd

Diamond Member Audited Supplier

Guangzhou Powerful Environmental Protection Technology Co., Ltd

Diamond Member Audited Supplier