Specification |
Structure: Multilayer FPC;
Material: Fiberglass Epoxy, Polyester Film;
Combination Mode: Adhesive Flexible Plate;
Application: Aviation and Aerospace, Consumer Electronics;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V2, V0;
Processing Technology: Delay Pressure Foil, Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Type: Rigid Circuit Board;
Mechanical Rigid: Rigid;
Dielectric: Fr4 and Polyimide, Fr-4;
Board Material: Fr2 and Polyimide;
Board Layer: 2 Layer Rigide and 2 Layer Flex;
Copper Thickness: 1 Oz;
Min. Line Space: 0.05mm (2mil);
Min Conductor Width: 0.05mm(2mil);
Min.Hole Size: 0.075mm (3mil);
Solder Mask: Any Color;
Silkscreen: Any Color;
Surface Finishing: Enig, Immersion Tin, Immersion Gold. OSP;
Lead Time: 5-6 Working Days;
PCB Design: Customer Provided;
Board Thickness: 0.1mm;
Min Pad: +/-0.1mm (4mil);
Outline Machining Accuracy: +/-0.1mm (4mil);
MOQ: 1 PCS;
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Structure: Double-Sided FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: UC;
Board Layer: 1;
Board Thickness: 0.15-0.2mm;
Surface Treatment: Enig;
Size: 500*8mm;
Finished Copper Thickness: 35um;
Lead Time: 7 Working Days;
PCB Testing: Flying Probe Testing/E-Testing;
Fast Turn: 3 Working Days;
Ipc Standards: Ipc-Class 2;
Base Material Type: Pi;
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Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: UC;
Layer Count: 1;
Board Thickness: 0.15-0.2mm;
Base Material Type: Pi;
Size: 500*8mm;
Finished Copper Thickness: 35um;
Surface Treatment: Enig;
Solder Mask Color: White/Black;
PCB Testing: Flying Probe Testing/E-Testing;
Ipc Standards: Ipc-Class 2;
Lead Time: 7 Working Days;
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Structure: Double-Sided FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V1;
Processing Technology: Electrolytic Foil;
Base Material: Pi;
Insulation Materials: Metal Composite Materials;
Place of Origin: Guangdong, China;
Copper Thickness: 12um--70um;
Min. Hole Size: 0.1mm;
Min. Line Width: 0.05mm;
Min. Line Spacing: 0.05;
Surface Finishing: OSP,Enig,Immersion Tin;
FPC Material: Polyimide;
Board Thickness: 0.075-6.0mm;
Solder Mask Color: Yellow,Black,White,Green,Red,Blue;
FPCB Thickness: Custom;
Sbccy: Rzngdsb;
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Structure: Double-Sided FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V1;
Processing Technology: Electrolytic Foil;
Base Material: Pi;
Insulation Materials: Metal Composite Materials;
Place of Origin: Guangdong, China;
Copper Thickness: 12um--70um;
Min. Hole Size: 0.1mm;
Min. Line Width: 0.05mm;
Min. Line Spacing: 0.05;
Surface Finishing: OSP,Enig,Immersion Tin;
FPC Material: Polyimide;
Board Thickness: 0.075-6.0mm;
Solder Mask Color: Yellow,Black,White,Green,Red,Blue;
FPCB Thickness: Custom;
Sbccy: Rzngdsb;
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