Specification |
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Communication;
Flame Retardant Properties: V1;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4;
Insulation Materials: Epoxy Resin;
Brand: Fastline;
Board Thickness: 1.6mm;
Copper Thickness: 1oz;
Material Type: Fr4;
Surface Treatment: HASL Lead Free;
Solder Mask: Green, Red, Blue, Black;
Silk Screen Color: White;
Board Layer: 1-50;
Shipping Type: DHL, UPS, TNT, EMS, FedEx etc;
Packing Type: Carton + Vacuum;
Lead Time: 5-7 Days;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: HASL Lf, Plating. Gold, Immersion Gold, Silver;
Base Material: Fr4;
Insulation Materials: Epoxy Resin;
Brand: Not Specified;
Min. Hole Size: 0.2mm;
Min. Line Width&Spacing: 3mil/4mil;
Soldermask: Green, Blue, White, Black, Yellow, Red;
Silkscreen: White, Black, Blue, Yellow;
Shipping: DHL, UPS, TNT, FedEx, etc;
Certificates: UL, RoHS, SGS, ISO9001 ISO14000;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Board Thick: 1.6mm;
Surface Finish: Immersion Gold;
out Layer Copper: 1 Oz;
Final Foil Internal: 1 Oz;
Solder Mask Color: Black;
Silkscreen Color: No;
Minimum Trace and Space: 7.8 Mil / 6.2 Mil;
Minimum / Maximum Holes: 0.5mm /2.2 mm;
Via: Minimum Size 0.5mm.;
Test: 100% Electrical Test Prior Shipment;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Board Thick: 1.6mm;
Surface Finish: Immersion Gold;
out Layer Copper: 1 Oz;
Final Foil Internal: 1 Oz;
Solder Mask Color: Black;
Silkscreen Color: No;
Minimum Trace and Space: 7.8 Mil / 6.2 Mil;
Minimum / Maximum Holes: 0.8mm / 3.2 mm;
Via: Minimum Size 0.8mm.;
Test: 100% Electrical Test Prior Shipment;
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Board Thick: 2.0 mm ±10%;
Surface Finish: Immersion Gold;
out Layer Copper: 1 Oz;
Final Foil Internal: 1 Oz;
Solder Mask Color: Green;
Silkscreen Color: White;
Minimum Trace and Space: 7.8 Mil / 6.2 Mil;
Minimum / Maximum Holes: 0.8mm / 3.2 mm;
Via: Minimum Size 0.8mm.;
Test: 100% Electrical Test Prior Shipment;
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