Fr4 PCB Electronics
US$0.60-0.90 / Piece
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What is Fr4 PCB Design 94V0 Fr4 PCB Fr4 Assembled PCB Fr4 Electronic PCB/PCBA Fabrication

About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

1-999 Pieces US$0.90

1,000-1,999 Pieces US$0.82

2,000-9,999,999 Pieces US$0.71

10,000,000+ Pieces US$0.60

Sepcifications

  • Structure Multilayer Rigid PCB
  • Dielectric FR-4
  • Material Polyester Glass Fiber Mat Laminate
  • Application Communication
  • Flame Retardant Properties V0
  • Processing Technology Electrolytic Foil
  • Production Process Subtractive Process
  • Base Material Fr4
  • Insulation Materials Epoxy Resin
  • Brand Ca
  • Transport Package Vacuum+Carton Packing
  • Specification RoHS, ISO9001, UL, SGS
  • Trademark FL
  • Origin Shenzhen, China
  • Board Thickness 1.6mm
  • Board Layer 2 Layers
  • Copper Thickness 1 Oz
  • Solder Mask Blue
  • Silksreen White
  • Min Pad +/- 0.1mm (4mil)
  • Surface Finihsing HASL-Lf
  • Lead Time 6-8 Working Days
  • Shipping Type DHL, UPS, TNT, EMS, FedEx etc
  • Packing Type Carton + Vacuum
  • Test Fly Probe Testing
  • Min Board Thickness 0.1mm Only for Single and Double Sided
  • Min. Line Width/Space 0.05mm (2mil)
  • Outline Machining Accuracy +/- 0.1mm (4mil)
  • MOQ 1 PCS

Product Description

Fr4 PCB Design 94v0 Fr4 PCB Fr4 Assembled PCB Fr4 Electronic PCB/PCBa Fabrication Fastline could produce 1-26 layers PCB board for electronic products.providing PCB design, PCB fabrication,PCB clone and PCB assembly services. and we have got the UL, ISO, SGS certifications. Pls see our pcb ...

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Fr4 PCB Electronics Comparison
Transaction Info
Price US $ 0.60-0.90/ Piece US $ 0.1/ Piece US $ 0.1/ Piece Negotiable Negotiable
Min Order 1 Pieces 10 Pieces 10 Pieces 10 Pieces 10 Pieces
Payment Terms L/C, T/T, Western Union, Paypal T/T, Western Union, Paypal T/T, Western Union, Paypal L/C, T/T, D/P L/C, T/T, D/P
Quality Control
Management System Certification ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE, GMP ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE, GMP ISO 9001 ISO 9001
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Western Europe North America, South America, Eastern Europe, Western Europe
Annual Export Revenue - US$50 Million - US$100 Million US$50 Million - US$100 Million - -
Business Model OEM, ODM OEM, ODM OEM, ODM OEM OEM
Average Lead Time Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Product Attributes
Specification
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Communication;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Fr4;
Insulation Materials: Epoxy Resin;
Brand: Ca;
Board Thickness: 1.6mm;
Board Layer: 2 Layers;
Copper Thickness: 1 Oz;
Solder Mask: Blue;
Silksreen: White;
Min Pad: +/- 0.1mm (4mil);
Surface Finihsing: HASL-Lf;
Lead Time: 6-8 Working Days;
Shipping Type: DHL, UPS, TNT, EMS, FedEx etc;
Packing Type: Carton + Vacuum;
Test: Fly Probe Testing;
Min Board Thickness: 0.1mm Only for Single and Double Sided;
Min. Line Width/Space: 0.05mm (2mil);
Outline Machining Accuracy: +/- 0.1mm (4mil);
MOQ: 1 PCS;
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Epoxy Paper Laminate;
Application: Military;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Additive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Layer Count: 16L up to 60L;
Board Thickness: 1.89mm up to 8mm;
Min Hole Size: 0.25mm;
Min. Hole Wall Cu: 25um;
Finished Copper: 35um;
Min. Trace/Space: 0.075/0.0905mm;
Surface Finish: Immersion Gold;
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Epoxy Paper Laminate;
Application: Military;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Additive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Layer Count: 12L up to 60L;
Board Thickness: 2mm up to 8mm;
Min Hole Size: 0.25mm;
Min. Hole Wall Cu: 25um;
Finished Copper: 45um;
Min. Trace/Space: 0.129/0.107mm;
Surface Finish: Immersion Gold Au3u";
Structure: Single-Sided Rigid PCB;
Base Material: Aluminum;
Brand: Dejia;
Structure: Single-Sided Rigid PCB;
Base Material: Aluminum;
Brand: Dejia;
Supplier Name

Fastline Circuits Co., Limited

Diamond Member Audited Supplier

Shanghai Gawin Electronic Technology Co., Ltd.

Diamond Member Audited Supplier

Shanghai Gawin Electronic Technology Co., Ltd.

Diamond Member Audited Supplier

Zhejiang Dejia Electronics Technology Co.,Ltd.

Gold Member Audited Supplier

Zhejiang Dejia Electronics Technology Co.,Ltd.

Gold Member Audited Supplier