Fr4 Double Layer PCB SMD/DIP Electronic Heater Power Bank

About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

1-999 Pieces US$0.57

1,000-1,999 Pieces US$0.46

2,000-9,999 Pieces US$0.43

10,000+ Pieces US$0.37

Sepcifications

  • Conductive Type Unipolar Integrated Circuit
  • Integration ULSI
  • Shape DIP
  • Technics Thick Film IC
  • Transport Package Vacuum+Carton Packing
  • Specification RoHS, ISO9001, UL, SGS
  • Trademark FL
  • Origin Shenzhen, China
  • Regular Board Thickness 1.6mm
  • Board Material Fr4, Bt HDI Material
  • Board Layer 4 Layers
  • Surface Finihsing HASL-Lf, Enig, Immersion Gold, Immersion Tin, OSP
  • Copper Thickness 1 Oz
  • Thickness of Copper Foil Wire 8-240 Um(4oz)
  • Min. Hole Size 0.075mm(3mil)
  • Min Pad +/- 0.1mm (4mil)
  • Min Board Thickness 0.1mm Only for Single and Double Sided
  • Min. Line Width/Space 0.05mm (2mil)
  • Outline Machining Accuracy +/- 0.1mm (4mil)
  • Lead Time 6-8 Working Days
  • Silksreen Any You Like
  • Solder Mask Any You Like
  • MOQ 1PCS
  • shape Flat

Product Description

Fr4 Double Layer PCB Smd/Dip Electronic Heater Power Bank Fastline could produce 1-26 layers PCB board for electronic products. providing PCB design, PCB fabrication,PCB clone and PCB assembly services. and we have got the UL, ISO, SGS certifications. Pls see our pcb catalog below: 1. single ...

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PCB Comparison
Transaction Info
Price US $ 0.37-0.57/ Piece US $ 28.00-29.00/ Piece US $ 0.98-1.15/ Piece US $ 6.47-6.50/ Piece US $ 4.35-4.37/ Piece
Min Order 1 Pieces 1 Pieces 10 Pieces 10 Pieces 1 Pieces
Payment Terms L/C, T/T, Western Union, Paypal L/C, T/T, D/P L/C, T/T, D/P, Western Union, Paypal L/C, T/T, D/P, Western Union, Paypal L/C, T/T, D/P, Western Union, Paypal
Quality Control
Management System Certification ISO 9001, ISO 14001, IATF16949 - ISO 9001, ISO 14001 - -
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe Eastern Europe, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue - - Above US$100 Million - -
Business Model OEM, ODM - OEM, ODM, Own Brand(TELEFLY) - -
Average Lead Time Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Product Attributes
Specification
Conductive Type: Unipolar Integrated Circuit;
Integration: ULSI;
Shape: DIP;
Technics: Thick Film IC;
Regular Board Thickness: 1.6mm;
Board Material: Fr4, Bt HDI Material;
Board Layer: 4 Layers;
Surface Finihsing: HASL-Lf, Enig, Immersion Gold, Immersion Tin, OSP;
Copper Thickness: 1 Oz;
Thickness of Copper Foil Wire: 8-240 Um(4oz);
Min. Hole Size: 0.075mm(3mil);
Min Pad: +/- 0.1mm (4mil);
Min Board Thickness: 0.1mm Only for Single and Double Sided;
Min. Line Width/Space: 0.05mm (2mil);
Outline Machining Accuracy: +/- 0.1mm (4mil);
Lead Time: 6-8 Working Days;
Silksreen: Any You Like;
Solder Mask: Any You Like;
MOQ: 1PCS;
shape: Flat;
Conductive Type: Unipolar Integrated Circuit;
Integration: ULSI;
Technics: Thin Film IC;
Manufacturer Product Number: Xc6slx9-2tqg144c;
Product: Xc6slx9;
Package / Case: 144-Lqfp;
Package: Tray;
shape: Flat;
Conductive Type: Unipolar Integrated Circuit;
Integration: SSI;
Technics: Semiconductor IC;
shape: D2pak(to-236);
Category: Electronic Components;
Detailed Description: /;
Description: IC Prog Snsr Cond V-out 16-Tssop;
Subcategory: Shenzhen Electronic;
Brand Name: Original;
Shipping by: DHL\UPS\FedEx\EMS\HK Postdhl\UPS\FedEx\EMS\HK Post;
Product Number: PGA309aipwr;
shape: DIP;
Conductive Type: Unipolar Integrated Circuit;
Integration: GSI;
Technics: Semiconductor IC;
Brand Name: Sg2023j/883b;
Collector Currents: 600mA;
Output Voltages: 50V to 95V;
Detailed Description: High Voltage Mediumcurrent Driver Arrays;
shape: Flat;
Supplier Name

Fastline Circuits Co., Limited

Diamond Member Audited Supplier

Shenzhen Jin Da Peng Technology Co., Ltd.

Diamond Member Audited Supplier

Telefly Telecommunications Equipment Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Jin Da Peng Technology Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Jin Da Peng Technology Co., Ltd.

Diamond Member Audited Supplier