Printed Circuit Board
US$0.12-0.55 / piece
View
  • Recommend for you
  • What is PCB /PCBA /Bom Gerber Files Multilayer PCB/Prototype PCB
  • What is High Tg Fr4 PCB Good Price Fr4 PCB Fr4 94V0 Electronic Products PCB
  • What is 94V0 Multilayer Electronic Fr4 PCB Impedance Controlled Printed Circuit Board with Blind Buried Via

What is 6 Layers High Quality Gold Finger PCB Circuits Board Manufacturing PCB

About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

1-999 piece US$0.55

1,000-9,999 piece US$0.32

10,000+ piece US$0.12

Sepcifications

  • Structure Double-Sided Rigid PCB
  • Dielectric FR-3
  • Material Phenolic Paper Laminate
  • Application Computer
  • Flame Retardant Properties V0
  • Processing Technology Electrolytic Foil
  • Production Process Semi-Additive Process
  • Base Material Fr4
  • Insulation Materials Organic Resin
  • Brand Fastline
  • Transport Package Vacuum Packing
  • Specification IP class -2
  • Trademark Fastline
  • Origin Shenzhen, China
  • Board Material Fr4
  • Layers 1 to 30 Layers
  • Board Thickness 1.6mm
  • Copper Thickness 1oz
  • Solder Mask Green
  • Silk Screen White
  • Surface Treatment HASL Lead Free
  • Test 100%
  • Lead Time 6-8 Working Days
  • Min. Line Width 0.075mm

Product Description

Thick Copper PCB Circuits Board Manufacturering Product Description Fastline PCB's aim Customer Satisfaction is Always Our First Priority! *Quality Policy *Top Quality and high efficiency ...

Learn More

Printed Circuit Board Comparison
Transaction Info
Price US $ 0.12-0.55/ piece US $ 0.10-5.00/ Piece US $ 1.10-1.20/ Piece US $ 1.80-2.00/ Piece US $ 1.80-2.00/ Piece
Min Order 1 piece 1 Pieces 10 Pieces 10 Pieces 10 Pieces
Trade Terms - - - - -
Payment Terms L/C, T/T, Western Union, Paypal L/C, T/T, D/P, Western Union, Paypal, Money Gram T/T T/T, Paypal T/T, Paypal
Quality Control
Management System Certification ISO 9001, ISO 14001, IATF16949 - ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, Europe, Southeast Asia/ Mideast - - -
Annual Export Revenue - - - - -
Business Model OEM, ODM - OEM, ODM OEM, ODM OEM, ODM
Average Lead Time Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
- - - -
Product Attributes
Specification
Structure: Double-Sided Rigid PCB;
Dielectric: FR-3;
Material: Phenolic Paper Laminate;
Application: Computer;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Semi-Additive Process;
Base Material: Fr4;
Insulation Materials: Organic Resin;
Brand: Fastline;
Board Material: Fr4;
Layers: 1 to 30 Layers;
Board Thickness: 1.6mm;
Copper Thickness: 1oz;
Solder Mask: Green;
Silk Screen: White;
Surface Treatment: HASL Lead Free;
Test: 100%;
Lead Time: 6-8 Working Days;
Min. Line Width: 0.075mm;
Structure: Double-Sided Rigid PCB;
Dielectric: FR-4;
Material: Fr4 (140tg, 170tg, 180tg), Fr-406, Fr-408, 370hr;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Copper;
Brand: PS;
Quality Test: Aoi, 100% E-Test;
V- Cut Tolerance: +-10mi;
Bevel Edge: +-5mil;
Hole Location Tolerance: +-2mil;
Hole Diameter Tolerance: +-0.05mm;
Board Thickness Tolerance: +-5%;
Line Width/Space Tolerance: +-10%;
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Computer;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Shengyi, Kb, Nanya, Ilm;
Criteria: Aql II 0.65;
Hole Sizes: 0.25mm;
Bevel Edge: Yes;
Impedance: 50/90/100 Ohm;
Trace Width(Min.): 4mil;
Surfaec Treatment: Enig;
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Shengyi, Kb, Nanya, Ilm;
Criteria: Aql II 0.65;
Hole Sizes: 0.25mm;
Bevel Edge: Yes;
Impedance: 50/90/100 Ohm;
Trace Width(Min.): 4mil;
Surfaec Treatment: Enig;
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Shengyi, Kb, Nanya, Ilm;
Criteria: Aql II 0.65;
Hole Sizes: 0.25mm;
Bevel Edge: Yes;
Impedance: 50/90/100 Ohm;
Trace Width(Min.): 4mil;
Surfaec Treatment: Enig;
Supplier Name

Fastline Circuits Co., Limited

China Supplier - Gold Member Audited Supplier

Ps Electronics Co., Ltd

China Supplier - Diamond Member Audited Supplier

Shenzhen Xinmanda Printed Circuit Board Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Shenzhen Xinmanda Printed Circuit Board Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Shenzhen Xinmanda Printed Circuit Board Co., Ltd.

China Supplier - Diamond Member Audited Supplier