Specification |
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Finestpcb;
Service: One-Step PCB Service;
Solder Mask Color: Blue.Green.Red.Black.White;
Layer: 1-40layers;
Min BGA Ball Pitch: 0.4mm;
Surface Finishing: HASL\OSP\Immersion Gold;
HASL\OSP\Immersion Gold: Fr4/Rogers/Aluminum/High Tg;
Copper Thickness: 0.5-5oz;
Board Thickness: 1.6 ±0.1mm;
Minimum Hole: Minimum;
Minimum Width: 3/3mil;
Minimum Line: 3/3mil;
Product Name: OEM PCB PCBA Board Assembly;
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Aerospace;
Flame Retardant Properties: V1;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
PCB Layers: 2-18layers;
OEM Assembly: Supply;
DIP Assembly: Flowflow Welding+Hand Welding;
SMT Assembly: 0603-Qfp64;
Test: QC,Aoi,Fct,X-ray;
The Fastest Delivery Time: Sample(3-5/Day);
Electronic Components: Keep a Large Stock of Goods;
IC Program Burning: Supply;
Design: Supply;
Resistor-Capacitor: 01005-1206;
Electrostatic: Comprehensive Protection;
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Aerospace;
Flame Retardant Properties: V1;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
PCB Layers: 2-18layers;
OEM Assembly: Supply;
DIP Assembly: Flowflow Welding+Hand Welding;
SMT Assembly: 0603-Qfp64;
Test: QC,Aoi,Fct,X-ray;
The Fastest Delivery Time: Sample(3-5/Day);
Electronic Components: Keep a Large Stock of Goods;
IC Program Burning: Supply;
Design: Supply;
Resistor-Capacitor: 01005-1206;
Electrostatic: Comprehensive Protection;
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Aerospace;
Flame Retardant Properties: V1;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
PCB Layers: 2-18layers;
OEM Assembly: Supply;
DIP Assembly: Flowflow Welding+Hand Welding;
SMT Assembly: 01005-Qfp64,BGA;
Test: QC,Aoi,Fct,X-ray;
The Fastest Delivery Time: Sample(3-5/Day);
Electronic Components: Keep a Large Stock of Goods;
IC Program Burning: Supply;
Design: Supply;
Resistor-Capacitor: 01005-1206;
Electrostatic: Comprehensive Protection;
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Aerospace;
Flame Retardant Properties: V1;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
PCB Layers: 2-20layers;
OEM Assembly: Supply;
DIP Assembly: Flowflow Welding+Hand Welding;
SMT Assembly: 01005-Qfp64,BGA;
Test: QC,Aoi,Fct,X-ray;
The Fastest Delivery Time: Sample(3-5/Day);
Electronic Components: Keep a Large Stock of Goods;
IC Program Burning: Supply;
Design: Supply;
Resistor-Capacitor: 01005-1206;
Electrostatic: Comprehensive Protection;
|