How to Make BOPET Self-Adhesive Label Base Film for UV Printing Packing Labels Facestock Material
Price
Purchase Qty. Reference FOB Price
5,000-49,999 Square Meters US$0.0958
50,000-99,999 Square Meters US$0.0712
100,000+ Square Meters US$0.052
Sepcifications
- Adhesive Type Permanent Adhesive
- Adhesivity Sided Tape
- Application Barcode Labeling, Product Labeling, Shipping Labeling, Warning Labeling, Barcode Label
- Backing Paper (For Adhesive) PET
- Label Shape Custom Shape
- Surface Finish Glossy
- Technics Digital Printing, Flexographic Printing, Screen Printing
- Temperature Resistance Room Temperature
- Waterproof Yes
- Transport Package Stretch Film + Foam Cotton + Wooden Pallet & Cover
- Specification 17umX1220mmX6050m
- Trademark Firsta
- Origin China
- Certificate ISO9001:2008 + SGS + MSDS + RoHS
- MOQ 1000kg
- Sample Free Sample
- Delivery Time 7-30 Days
- Transparency Customizable
- Surface Materials Customizable
- Membrane Type PET
- Backing Paper Pet Release Film
Product Description
PET Self Adhesive Label Base Film for UV Printing Packing Labels Material Product description: The high-performance BOPET/BOPP film is prepared by biaxial stretching using three-layer co-extrusion technology. Features: 1. With high applicability and gloss; 2. The material is non-toxic and ...
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BOPP Film Industry Trends and Market Analysis BOPP film (biaxially oriented polypropylene film) is a plastic film widely used in packaging, printing, electronics and other fields. In recent years, with the growth of the global economy and consumption upgrades, the market demand for BOPP film has continued to grow. -
BOPET Release Film Technical Characteristics and Applications BOPET release film is a kind of functional film made of biaxially oriented polyester film (BOPET) as the substrate and coated with release agent (such as silicone, fluorine, etc.), which has the characteristics of high mechanical strength, high temperature resistance, anti-static, and so on. It is widely used in electronics, optics, new energy and other fields. Its structure, process, technical characteristics and applications are described in detail below.