Silicon Wafer
US$25.00 / pc
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What is Japanese Quality Film Wafer P Type 12 Inch Silicon Wafer

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

50 pc US$25.00 / pc

Sepcifications

  • Transport Package Semi Standard
  • Specification TBD
  • Trademark FSM
  • Origin China
  • Growth Method CZ
  • Crystal Orientation 100
  • Dopant Boron
  • Resistivity 1-100Ω
  • Frront Side Polished
  • Edge Polished

Product Description

Product Description Product Parameters Use reference value Item Specification Diameter 150mm 200mm 300mm Type P/N P/N P/N Notch SEMI/JEIDA Notch/OF Notch Thickness(μm) 675±25/625±25 725±25 725±25 Surface Polished Polished Polished Inside ...

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Silicon Wafer Comparison
Transaction Info
Price US $ 25/ pc US $ 8.72/ Piece US $ 0.01-0.10/ Piece US $ 0.15-15.00/ Piece US $ 0.15-15.00/ Piece
Min Order 50 pc 100 Pieces 5000 Pieces 5000 Pieces 5000 Pieces
Trade Terms - - - - -
Payment Terms T/T, Paypal T/T, Western Union, Paypal L/C, T/T, D/P, Western Union, Paypal, Money Gram L/C, T/T, D/P, Western Union, Paypal, Money Gram L/C, T/T, D/P, Western Union, Paypal, Money Gram
Quality Control
Management System Certification ISO 29001 ISO 9001 ISO 9001 ISO 9001 ISO 9001
Trade Capacity
Export Markets Southeast Asia/ Mideast, East Asia(Japan/ South Korea) North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe Domestic Domestic Domestic
Annual Export Revenue - - - - -
Business Model - Own Brand - - -
Average Lead Time - Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
- - -
Product Attributes
Specification
Growth Method: CZ;
Crystal Orientation: 100;
Dopant: Boron;
Resistivity: 1-100Ω;
Frront Side: Polished;
Edge: Polished;
Growth Method: CZ and Fz;
Orientation: 111 or 100;
Resistivity: 0.0005 to 150;
Surface: Double Side Polished or Single Side Polished;
Dopant: N Type and P Type;
Particles: <30 at 0.3um;
Bow: < 30 Um;
Ttv: <15 Um;
Package Height: 0.7 mm (Max.);
Approximate Weight: 9 Mg;
RoHS: Compatible;
Package for Surface Mount Technology: SMT;
Ni/Au-Plated: Terminals;
Electrostatic Sensitive Device: ESD;
Moisture Sensitivity Level 3: Msl3;
Package Height: 0.7 mm (Max.);
Approximate Weight: 9 Mg;
RoHS: Compatible;
Package for Surface Mount Technology: SMT;
Ni/Au-Plated: Terminals;
Electrostatic Sensitive Device: ESD;
Moisture Sensitivity Level 3: Msl3;
Package Height: 0.7 mm (Max.);
Approximate Weight: 9 Mg;
RoHS: Compatible;
Package for Surface Mount Technology: SMT;
Ni/Au-Plated: Terminals;
Electrostatic Sensitive Device: ESD;
Moisture Sensitivity Level 3: Msl3;
Supplier Name

Fine Silicon Manufacturing(Shanghai)Ltd.

China Supplier - Gold Member Audited Supplier

Jiaozuo Commercial Finewin Co., Ltd.

China Supplier - Gold Member Audited Supplier

Hosoe technology Co.,LTD

China Supplier - Diamond Member Audited Supplier

Hosoe technology Co.,LTD

China Supplier - Diamond Member Audited Supplier

Hosoe technology Co.,LTD

China Supplier - Diamond Member Audited Supplier