Specification |
Application: Equipment;
Batch Number: Na;
Manufacturing Technology: Integrated Circuits Device;
Material: Compound Semiconductor;
Model: Custimize;
Package: Semi Standard;
Signal Processing: Na;
Type: P-Type Semiconductor;
Growth Method: CZ;
Crystal Orientation: 100;
Dopant: Boron;
Resistivity: 1-100Ω;
Frront Side: Polished;
Edge: Polished;
Diameter: 300±0.2mm;
Thickness: 775±25μm;
Brand: Fsm;
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Application: Detector, Diode, LCD Display Controller, Power Electronic Components, Radio, Television, Temperature Measurement;
Manufacturing Technology: Discrete Device;
Material: Element Semiconductor;
Model: ST;
Package: SMD;
Signal Processing: Digital;
Type: N-Type Semiconductor;
Package Height: 0.7 mm (Max.);
Approximate Weight: 9 Mg;
RoHS: Compatible;
Package for Surface Mount Technology: SMT;
Ni/Au-Plated: Terminals;
Electrostatic Sensitive Device: ESD;
Moisture Sensitivity Level 3: Msl3;
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Application: Detector, Diode, LCD Display Controller, Power Electronic Components, Radio, Television, Temperature Measurement;
Manufacturing Technology: Discrete Device;
Material: Element Semiconductor;
Model: ST;
Package: SMD;
Signal Processing: Digital;
Type: N-Type Semiconductor;
Package Height: 0.7 mm (Max.);
Approximate Weight: 9 Mg;
RoHS: Compatible;
Package for Surface Mount Technology: SMT;
Ni/Au-Plated: Terminals;
Electrostatic Sensitive Device: ESD;
Moisture Sensitivity Level 3: Msl3;
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Application: Detector, Diode, LCD Display Controller, Power Electronic Components, Radio, Television, Temperature Measurement;
Manufacturing Technology: Discrete Device;
Material: Element Semiconductor;
Model: ST;
Package: SMD;
Signal Processing: Digital;
Type: N-Type Semiconductor;
Package Height: 0.7 mm (Max.);
Approximate Weight: 9 Mg;
RoHS: Compatible;
Package for Surface Mount Technology: SMT;
Ni/Au-Plated: Terminals;
Electrostatic Sensitive Device: ESD;
Moisture Sensitivity Level 3: Msl3;
|
Application: Detector, Diode, LCD Display Controller, Power Electronic Components, Radio, Television, Temperature Measurement;
Manufacturing Technology: Discrete Device;
Material: Element Semiconductor;
Model: ST;
Package: SMD;
Signal Processing: Digital;
Type: N-Type Semiconductor;
Package Height: 0.7 mm (Max.);
Approximate Weight: 9 Mg;
RoHS: Compatible;
Package for Surface Mount Technology: SMT;
Ni/Au-Plated: Terminals;
Electrostatic Sensitive Device: ESD;
Moisture Sensitivity Level 3: Msl3;
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