Enig+OSP PCB
US$2.39-8.25 / Piece
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What is Enig+OSP 6layer PCB Board for Uav Unmanned Aerial Vehicle Drone Consumer Electronics

About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

100-9,999 Pieces US$8.25

10,000+ Pieces US$2.39

Sepcifications

  • Structure Multilayer Rigid PCB
  • Dielectric FR-4
  • Material Epoxy Paper Laminate
  • Application Consumer Electronics
  • Flame Retardant Properties V0
  • Processing Technology Electrolytic Foil
  • Production Process Additive Process
  • Base Material Copper
  • Insulation Materials Epoxy Resin
  • Brand 1
  • Transport Package Vacuum + Carton Packing
  • Specification 1
  • Trademark 1
  • Origin Made in China
  • Layer Count 6L up to 20L
  • Board Thickness 1.6mm up to 8mm
  • Min Hole Size 0.25mm
  • Min. Trace/Space 4mil
  • Finished Copper 1/1 Oz

Product Description

Layers: 6L ENIG Thickness: 1.6mm Outer Copper Thickness: 1OZ Inner Copper Thickness: 1OZ Min hole size: 0.25mm Min Line Width/Space: 4mil Surface finish: Immersion Gold+Selective OSP Product Application: UAV, Unmanned Aerial Vehicle, Unmanned Aircraft Systems, Drone, Consumer Electronics ...

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Enig+OSP PCB Comparison
Transaction Info
Price US $ 2.39-8.25/ Piece US $ 0.50-10.00/ Piece US $ 0.50-10.00/ Piece US $ 0.50-5.00/ Piece US $ 0.50-10.00/ Piece
Min Order 100 Pieces 1 Pieces 1 Pieces 1 Pieces 1 Pieces
Trade Terms - - - - -
Payment Terms T/T, Western Union, Paypal L/C, T/T, D/P, Western Union, Paypal, Money Gram L/C, T/T, D/P, Western Union, Paypal, Money Gram T/T L/C, T/T, D/P, Western Union, Paypal, Money Gram
Quality Control
Product Certification - RoHS, CCC, ISO, EPA RoHS, CCC, ISO, EPA - RoHS, CCC, ISO, EPA
Management System Certification ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE ISO 9001, ISO 14001, IATF16949, ISO 13485 ISO 9001, ISO 14001, IATF16949, ISO 13485 ISO 9001, ISO 14000, IATF16949, GMP ISO 9001, ISO 14001, IATF16949, ISO 13485
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Mid East, Western Europe North America, South America, Eastern Europe, Southeast Asia, Mid East, Western Europe North America, Eastern Europe, Africa, Mid East, Western Europe North America, South America, Eastern Europe, Southeast Asia, Mid East, Western Europe
Annual Export Revenue - - - - -
Business Model OEM, ODM OEM, ODM, Own Brand OEM, ODM, Own Brand OEM, ODM, Others OEM, ODM, Own Brand
Average Lead Time Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Product Attributes
Specification
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Epoxy Paper Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Additive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: 1;
Layer Count: 6L up to 20L;
Board Thickness: 1.6mm up to 8mm;
Min Hole Size: 0.25mm;
Min. Trace/Space: 4mil;
Finished Copper: 1/1 Oz;
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Epoxy Resin;
Application: Communication;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Immersion Gold;
Base Material: S1000-2m/It180A;
Layers: 18L;
Board Thickness: 1.57mm;
Copper Thickness: 2oz;
Test: Flying Probe & Fixture;
Solder Mask Type: Green;
Silkscreen Type: White;
Min.Line Width/Space: 0.1mm;
Min. Hole Size: 0.1mm;
Surface Finish: Enig 3u";
X-Outs Allowed: Not Allowed;
Standard: Ipcii Class 3;
Customized: Customized;
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Epoxy Resin;
Application: Communication;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Immersion Gold;
Base Material: S1000-2m/It180A;
Layers: 6L;
Board Thickness: 1.6mm;
Copper Thickness: 1.5oz;
Test: Flying Probe & Fixture;
Solder Mask Type: Red;
Silkscreen Type: White;
Min.Line Width/Space: 0.1mm;
Min. Hole Size: 0.25mm;
Surface Finish: Enig 3u";
X-Outs Allowed: Not Allowed;
Standard: Ipcii Class 2;
Customized: Customized;
Structure: Single-Sided Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Aerospace;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Semi-Additive Process;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
Brand: Jingxin;
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Epoxy Resin;
Application: Communication;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Immersion Gold;
Base Material: S1000-2m/It180A;
Layers: 8L;
Board Thickness: 1.6mm;
Copper Thickness: 2oz;
Test: Flying Probe & Fixture;
Solder Mask Type: Green;
Silkscreen Type: White;
Min.Line Width/Space: 0.1mm;
Min. Hole Size: 0.25mm;
Surface Finish: Enig 2u";
X-Outs Allowed: Not Allowed;
Standard: Ipcii Class 3;
Customized: Customized;
Supplier Name

Shanghai Gawin Electronic Technology Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Usun Electronics Limited.,

China Supplier - Gold Member Audited Supplier

Usun Electronics Limited.,

China Supplier - Gold Member Audited Supplier

Shenzhen Jingxin Electronic Technology Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Usun Electronics Limited.,

China Supplier - Gold Member Audited Supplier