Circuit Board

US$0.912-2.49 / Piece

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Lf-HASL Enig Immersion Gold 10layer Printed Circuit Board 10layer PCB pictures & photos

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What is Lf-HASL Enig Immersion Gold 10layer Printed Circuit Board 10layer PCB

Name: Lf-HASL Enig Immersion Gold 10layer Printed Circuit Board 10layer PCB
Uploaded: 2023-07-06T16:07:29+08:00
Description: Company Profile welcome to visit gawinpcba.en.made-in-china.com Shanghai Gawin Electronic Technology Company, a specialized PCB manufacturer with one-stop service from PCB design to PCB manufacture

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About this Item

Price

Purchase Qty. Reference FOB Price

100-999 Pieces US$2.49

1,000+ Pieces US$0.912

Sepcifications

Structure Multilayer Rigid PCB
Dielectric FR-4
Material Epoxy Paper Laminate
Application Communication
Flame Retardant Properties V0
Processing Technology HASL-Lf
Production Process Additive Process
Base Material Copper
Insulation Materials Epoxy Resin
Transport Package Vacuum + Carton Packing
Specification 1
Trademark 1
Origin Made in China
Layer Count 10L
Min. Hole to Line 6mil
Inner Core Material 0.2mm

Product Description

Company Profile welcome to visit gawinpcba.en.made-in-china.com Shanghai Gawin Electronic Technology Company, a specialized PCB manufacturer with one-stop service from PCB design to PCB manufacture to BOM components procurement to PCB Assembly toFinished Product testing. Ability Show ...

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Shanghai Gawin Electronic Technology Co., Ltd.

Diamond Member Since 2020

Audited Supplier

Business Type Manufacturer/Factory, Trading Company
Main Products IC Products, Components Sourcing, EMS/PCB Assembly/SMT, Rigid-Flex PCB, High Speed PCB, High-Frequency PCB, Multilayer PCB/HDI PCB, Flexible PCB/FPC, Semconductor Test-Board, Load Board/Probe Card
Registered Capital 10000000 RMB
Plant Area 3000 square meters
Management System Certification ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays

Circuit Board Comparison

	Quick View Lf-HASL Enig Immersion Gold 10layer Printed Circuit Board 10layer PCB Contact Now	0.8-4.0mm Immersion Gold Fr4 PCB Manufacturing, Electronics Circuit Board PCB Assembly Contact Now	PCB Board with Immersion Gold Enig Surface, PCB Circuit Board, Electronic Component SMT Contact Now	Fr4 Immersion Gold Multilayer PCB Gold Finger 30u′′ Hard Gold PCB Plating Contact Now	12layer Impedance Control Immersion Gold Multilayer PCB Electronics Motherboard Circuit Board Contact Now

Transaction Info
	Quick View Lf-HASL Enig Immersion Gold 10layer Printed Circuit Board 10layer PCB Contact Now	0.8-4.0mm Immersion Gold Fr4 PCB Manufacturing, Electronics Circuit Board PCB Assembly Contact Now	PCB Board with Immersion Gold Enig Surface, PCB Circuit Board, Electronic Component SMT Contact Now	Fr4 Immersion Gold Multilayer PCB Gold Finger 30u′′ Hard Gold PCB Plating Contact Now	12layer Impedance Control Immersion Gold Multilayer PCB Electronics Motherboard Circuit Board Contact Now
Price	US $ 0.912-2.49/ Piece	US $ 0.1/ Piece	US $ 0.1/ Piece	US $ 0.1/ Piece	US $ 0.1/ Piece
Min Order	100 Pieces	1 Pieces	1 Pieces	1 Pieces	1 Pieces
Trade Terms	-	-	-	-	-
Payment Terms	T/T, Western Union, Paypal	L/C, T/T, D/P, Western Union, Paypal, Money Gram	L/C, T/T, D/P, Western Union, Paypal, Money Gram	L/C, T/T, D/P, Western Union, Paypal, Money Gram	L/C, T/T, D/P, Western Union, Paypal, Money Gram
Quality Control
Management System Certification	ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE	ISO 9001	ISO 9001	ISO 9001	ISO 9001
Trade Capacity
Export Markets	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Australia	North America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Australia	North America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Australia	North America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Australia
Annual Export Revenue	-	-	-	-	-
Business Model	OEM, ODM	OEM	OEM	OEM	OEM
Average Lead Time	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)
Product Attributes
Specification	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Epoxy Paper Laminate; Application: Communication; Flame Retardant Properties: V0; Processing Technology: HASL-Lf; Production Process: Additive Process; Base Material: Copper; Insulation Materials: Epoxy Resin; Layer Count: 10L; Min. Hole to Line: 6mil; Inner Core Material: 0.2mm;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Phenolic Paper Laminate; Application: Aerospace; Flame Retardant Properties: V0; Processing Technology: Delay Pressure Foil; Production Process: Semi-Additive Process; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: Zitrok; Quality Assurance: UL, Aoi, RoHS, ISO9001, 100% E-Test; Material Stock: Fr4, Isola, Rogers, Ceramic, Arlon, Pi, Taconic;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Phenolic Paper Laminate; Application: Aerospace; Flame Retardant Properties: V0; Processing Technology: Delay Pressure Foil; Production Process: Semi-Additive Process; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: Zitrok; Quality Assurance: UL, Aoi, RoHS, ISO9001, 100% E-Test; Material Stock: Fr4, Isola, Rogers, Ceramic, Arlon, Pi, Taconic;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Phenolic Paper Laminate; Application: Aerospace; Flame Retardant Properties: V0; Processing Technology: Delay Pressure Foil; Production Process: Semi-Additive Process; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: Zitrok; Quality Assurance: UL, Aoi, RoHS, ISO9001, 100% E-Test; Material Stock: Fr4, Isola, Rogers, Ceramic, Arlon, Pi, Taconic;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Phenolic Paper Laminate; Application: Aerospace; Flame Retardant Properties: V0; Processing Technology: Delay Pressure Foil; Production Process: Semi-Additive Process; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: Zitrok; Quality Assurance: UL, Aoi, RoHS, ISO9001, 100% E-Test; Material Stock: Fr4, Isola, Rogers, Ceramic, Arlon, Pi, Taconic; MOQ: 1PCS Is Okay;
Supplier Name	Shanghai Gawin Electronic Technology Co., Ltd.	Zitrok Electronics Co., Ltd.	Zitrok Electronics Co., Ltd.	Zitrok Electronics Co., Ltd.	Zitrok Electronics Co., Ltd.
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