6layer Flex-Rigid PCB
US$0.62-3.78 / Piece
View
  • Recommend for you
  • What is Double-Sided Circuit Board Rigid-Flex PCB for Test Equipment
  • What is High Circuit Density Design Multilayer PCB for Microprocessors Controller Asics DTV
  • What is Blue HASL-Lf Multilayer Motherboard Circuit Board PCB

What is 10layer Rigid-Flex PCB Consumer Electronics Module PCB

About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

100-9,999 Pieces US$3.78

10,000+ Pieces US$0.62

Sepcifications

  • Insulation Materials Organic Resin
  • Flame Retardant Properties V0
  • Application Consumer Electronics, Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace
  • Transport Package Vacuum + Carton Packing
  • Origin Made in China
  • Material Polyimide
  • Combination Mode Adhesive Flexible Plate
  • Conductive Adhesive Conductive Silver Paste
  • Structure Multilayer PCB+FPC
  • Processing Technology Enig+OSP
  • Base Material Fr4+Pi+Nfpp

Product Description

6Layer Flex-rigid PCB Number of layers: 6Layers Thickness: 1.6mm+0.12mm Material: FR4+PI+NFPP Min. Drilling Size: 0.2mm Min. Trace width: 0.1mm Min. Space: 0.1mm Surface Finish: Immersion Gold Why is flex-rigid PCB? The flex-rigid PCB is a printed circuit board formed by the clever design ...

Learn More

6layer Flex-Rigid PCB Comparison
Transaction Info
Price US $ 0.62-3.78/ Piece US $ 0.01-150.00/ Piece US $ 0.10-20.00/ Piece US $ 0.78-0.98/ Piece US $ 0.43-0.57/ Piece
Min Order 100 Pieces 1 Pieces 1 Pieces 1 Pieces 1 Pieces
Trade Terms - - - - -
Payment Terms T/T, Western Union, Paypal T/T, Western Union, Paypal L/C, T/T, Paypal L/C, T/T, Western Union, Paypal L/C, T/T, Western Union, Paypal
Quality Control
Management System Certification ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue - - - - -
Business Model OEM, ODM OEM OEM OEM, ODM OEM, ODM
Average Lead Time Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Product Attributes
Specification
Insulation Materials: Organic Resin;
Flame Retardant Properties: V0;
Application: Consumer Electronics, Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Conductive Adhesive: Conductive Silver Paste;
Structure: Multilayer PCB+FPC;
Processing Technology: Enig+OSP;
Base Material: Fr4+Pi+Nfpp;
Insulation Materials: Epoxy Resin;
Flame Retardant Properties: V0;
Application: Consumer Electronics;
Board Thickness: 0.15+2.0 mm;
Others: Pi+Fr4;
Mask: Green;
Silk: Mask;
Insulation Materials: Organic Resin;
Flame Retardant Properties: HB;
Application: Digital Products, LED;
Structure: Multilayer FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Conductive Adhesive: Conductive Silver Paste;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Board Material: Fr4 and Polyimide;
Board Layer: 2 Layer Rigide and 2 Layer Flex;
Copper Thickness: 1 Oz;
Min. Line Space: 0.1mm;
Min.Hole Size: 0.15mm;
Solder Mask: Any Color;
Silkscreen: Any Color;
Surface Finishing: Gold Plate;
Lead Time: 5-6 Working Days;
PCB Design: Custom Design Product;
Dielectric: Fr4 and Polyimide;
Insulation Materials: Epoxy Resin;
Flame Retardant Properties: V0;
Application: Aerospace;
Board Material: Polyimide;
Board Layer: 2;
Board Thickness: 0.1 mm;
Copper Thickness: 1 Oz;
Solser Mask: Yellow;
Silkscreen: White;
Surface Finishing: Enig;
Lead Time: 4-5 Working Days;
Shipping Type: DHL.TNT, EMS, FedEx, UPS etc;
PCB Design: Custom Design Product;
Structure: Double-Sided FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Conductive Adhesive: Conductive Silver Paste;
Processing Technology: Electrolytic Foil;
Supplier Name

Shanghai Gawin Electronic Technology Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Abis Circuits Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Abis Circuits Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Fastline Circuits Co., Limited

China Supplier - Gold Member Audited Supplier

Fastline Circuits Co., Limited

China Supplier - Gold Member Audited Supplier