Telecom HDI PCB

US$2.36-7.89 / Piece

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Telecom Mobile Phone 6layer HDI Em825 Immersion Gold PCB pictures & photos

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What is Telecom Mobile Phone 6layer HDI Em825 Immersion Gold PCB

Name: Telecom Mobile Phone 6layer HDI Em825 Immersion Gold PCB
Uploaded: 2023-07-05T08:58:53+08:00
Description: HDI Layer Count 4L-32L mass production, 34L-64L quick-turn Material High Tg material (Recommend Shengyi Material) Finished Board Thickness 0.8-4.8mm Finished Copper Thickness Hoz-8oz Max. Board Size

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About this Item

Price

Purchase Qty. Reference FOB Price

100-9,999 Pieces US$7.89

10,000+ Pieces US$2.36

Sepcifications

Structure Multilayer Rigid PCB
Dielectric Fr4 Em825 1.0mm
Material Epoxy Paper Laminate
Application Telecom
Flame Retardant Properties V0
Processing Technology Immersion Gold
Production Process Blind&Buried Vias
Base Material Copper
Insulation Materials Epoxy Resin
Transport Package Vacuum + Carton Packing
Origin Made in China
Layer Count 6layer HDI PCB 2+N+2
HDI Structure 1+N+1 to Any Layer
Min. Trace/Space 2/2mil
Blind/Buried Vias 0.1mm Laser Drilling

Product Description

HDI Layer Count 4L-32L mass production, 34L-64L quick-turn Material High Tg material (Recommend Shengyi Material) Finished Board Thickness 0.8-4.8mm Finished Copper Thickness Hoz-8oz Max. Board Size 600X800mm Min. Drilling Size 0.15mm, 0.1mm(laser drilling) Blind/Buried vias depth ratio ...

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Shanghai Gawin Electronic Technology Co., Ltd.

Diamond Member Since 2020

Audited Supplier

Business Type Manufacturer/Factory, Trading Company
Main Products IC Products, Components Sourcing, EMS/PCB Assembly/SMT, Rigid-Flex PCB, High Speed PCB, High-Frequency PCB, Multilayer PCB/HDI PCB, Flexible PCB/FPC, Semconductor Test-Board, Load Board/Probe Card
Registered Capital 10000000 RMB
Plant Area 3000 square meters
Management System Certification ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays

Telecom HDI PCB Comparison

	Quick View Telecom Mobile Phone 6layer HDI Em825 Immersion Gold PCB Contact Now	Quick View Six-Layer High-Density Pad, RF PCB, HDI PCB, High Tg Motherboard PCB Assembly Contact Now	Quick View PCB Circuit Board/ 6 Layers Fr4 1.0mm HASL Lead Free Black Solder Mask Rigid PCB Contact Now	Quick View Electronics Double Layer PCB Manufacturing UL ISO9001 High Quality 2 Layer Rigid Fr4 Green Solder Mask PCB Contact Now	Quick View Green Solder Mask PCB / Double Layers Rigid PCB / Fr4 Circuit Board SMT Assembly Contact Now

Transaction Info
	Quick View Telecom Mobile Phone 6layer HDI Em825 Immersion Gold PCB Contact Now	Quick View Six-Layer High-Density Pad, RF PCB, HDI PCB, High Tg Motherboard PCB Assembly Contact Now	Quick View PCB Circuit Board/ 6 Layers Fr4 1.0mm HASL Lead Free Black Solder Mask Rigid PCB Contact Now	Quick View Electronics Double Layer PCB Manufacturing UL ISO9001 High Quality 2 Layer Rigid Fr4 Green Solder Mask PCB Contact Now	Quick View Green Solder Mask PCB / Double Layers Rigid PCB / Fr4 Circuit Board SMT Assembly Contact Now
Price	US $ 2.36-7.89/ Piece	US $ 0.15-10.00/ Piece	US $ 0.20-20.00/ Piece	US $ 0.10-1.00/ Piece	US $ 0.20-20.00/ Piece
Min Order	100 Pieces	1 Pieces	1 Pieces	1 Pieces	1 Pieces
Trade Terms	-	-	-	-	-
Payment Terms	T/T, Western Union, Paypal	T/T, Western Union, Paypal	T/T, Western Union, Paypal	L/C, T/T, D/P, Western Union, Paypal, Money Gram, 30 days net	T/T, Western Union, Paypal
Quality Control
Management System Certification	ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 14001, IATF16949
Trade Capacity
Export Markets	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue	-	-	-	-	-
Business Model	OEM, ODM	OEM	OEM	OEM	OEM
Average Lead Time	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)
Product Attributes
Specification	Structure: Multilayer Rigid PCB; Dielectric: Fr4 Em825 1.0mm; Material: Epoxy Paper Laminate; Application: Telecom; Flame Retardant Properties: V0; Processing Technology: Immersion Gold; Production Process: Blind&Buried Vias; Base Material: Copper; Insulation Materials: Epoxy Resin; Layer Count: 6layer HDI PCB 2+N+2; HDI Structure: 1+N+1 to Any Layer; Min. Trace/Space: 2/2mil; Blind/Buried Vias: 0.1mm Laser Drilling;	Structure: Double-Sided Rigid PCB; Dielectric: FR-4; Application: Communication; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Production Process: Subtractive Process; Base Material: Fr4; Insulation Materials: Epoxy Resin; Brand: Abis; Copper Thickness: 1 Oz/2oz; Board Layer: 2/4/6 Layers; Board Thickness: 1.6mm; Surface Finish: Gold Plating, Enig; Solder Mask: Purple/Black/Red/Green; Legend: White;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Polyester Glass Fiber Mat Laminate; Application: Communication; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Production Process: Subtractive Process; Base Material: Fr4; Insulation Materials: Epoxy Resin; Brand: Abis; Copper Thickness: 1 Oz; Board Layer: 2/4/6 Layers; Board Thickness: 1.6mm/Custom; Surface Finish: Gold Plating, Enig; Solder Mask: Purple/Black/Red/Green/Custom; Legend: White;	Structure: Double-Sided Rigid PCB; Dielectric: FR-4; Material: Polyester Glass Fiber Mat Laminate; Application: Consumer Electronics; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Production Process: Subtractive Process; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: Abis; Board Thickness: 1.0mm; Copper Thickness: 2oz; Surface Finish: Immersion Gold/Customized; Solder Mask: Green; Legend: White/Customized; Layer: Double-Layer;	Structure: Double-Sided Rigid PCB; Dielectric: FR-4; Material: Polyester Glass Fiber Mat Laminate; Application: Communication; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Production Process: Subtractive Process; Base Material: Fr4; Insulation Materials: Epoxy Resin; Brand: Abis; Copper Thickness: 1 Oz; Board Layer: 2/4/6 Layers; Board Thickness: 1.6mm/Custom; Surface Finish: Gold Plating, Enig; Solder Mask: Purple/Black/Red/Green/Custom; Legend: White;
Supplier Name	Shanghai Gawin Electronic Technology Co., Ltd.	Abis Circuits Co., Ltd.	Abis Circuits Co., Ltd.	Abis Circuits Co., Ltd.	Abis Circuits Co., Ltd.
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