China PCB Manufacturer
US$0.35-8.80 / Piece
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4layer PCB Enigbga to Line 2.5mil with Impedance Control for Industrial Control PCB Module Video

About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

100-9,999 Pieces US$8.80

10,000+ Pieces US$0.35

Sepcifications

  • Type Rigid Circuit Board
  • Dielectric FR-4
  • Material Paper Phenolic Copper Foil Substrate
  • Application Medical Instruments
  • Flame Retardant Properties V0
  • Mechanical Rigid Rigid
  • Processing Technology Electrolytic Foil
  • Base Material Fr4 Shengyi High Tg170
  • Insulation Materials Epoxy Resin
  • Brand 1
  • Transport Package Vacuum + Carton Packing
  • Specification 1
  • Trademark 1
  • Origin Made in China
  • Layer Count 4-64layer Through Hole Board
  • Surface Finish Immersion Gold
  • Hole Wall Cu Min. 20um
  • Min. Trace Width/Space 3/3mil
  • Standard Ipc II
  • Certificates RoHS CCC ISO

Product Description

Products: 4Layer PCB ENIGBGA to line 2.5mil with Impedance control for Industrial Control PCB Module PCBs Capabilities Max.Board Thickness: 10mm Min. Trace Width/Space: Inner 2.5/2.5mil, Outer 3/3mil Trace Width/Spacing Tolerance:±20%; ±10% for signal trace areas by special ...

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Transaction Info
Price US $ 0.35-8.80/ Piece US $ 2.00-5.00/ Piece US $ 2.00-5.00/ Piece US $ 1/ Piece US $ 1/ Piece
Min Order 100 Pieces 1 Pieces 1 Pieces 1 Pieces 1 Pieces
Trade Terms - - - - -
Payment Terms T/T, Western Union, Paypal T/T, Western Union, Paypal T/T, Western Union, Paypal T/T T/T
Quality Control
Management System Certification ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE - - ISO 9001, ISO 14001 ISO 9001, ISO 14001
Trade Capacity
Export Markets North America, Europe, Southeast Asia/ Mideast North America, Europe, East Asia(Japan/ South Korea) North America, Europe, East Asia(Japan/ South Korea) North America, Eastern Europe, Mid East, Western Europe North America, Eastern Europe, Mid East, Western Europe
Annual Export Revenue - - - - -
Business Model OEM, ODM - - OEM, ODM OEM, ODM
Average Lead Time Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
- - - -
Product Attributes
Specification
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Paper Phenolic Copper Foil Substrate;
Application: Medical Instruments;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4 Shengyi High Tg170;
Insulation Materials: Epoxy Resin;
Brand: 1;
Layer Count: 4-64layer Through Hole Board;
Surface Finish: Immersion Gold;
Hole Wall Cu: Min. 20um;
Min. Trace Width/Space: 3/3mil;
Standard: Ipc II;
Certificates: RoHS CCC ISO;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Finestpcb;
Service: One-Step PCB Service;
Solder Mask Color: Blue.Green.Red.Black.White;
Layer: 1-40layers;
Min BGA Ball Pitch: 0.4mm;
Surface Finishing: HASL\OSP\Immersion Gold;
HASL\OSP\Immersion Gold: Fr4/Rogers/Aluminum/High Tg;
Copper Thickness: 0.5-5oz;
Board Thickness: 1.6 ±0.1mm;
Minimum Hole: Minimum;
Minimum Width: 3/3mil;
Minimum Line: 3/3mil;
Product Name: OEM PCB PCBA Board Assembly;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Finestpcb;
Service: One-Step PCB Service;
Solder Mask Color: Blue.Green.Red.Black.White;
Layer: 1-40layers;
Min BGA Ball Pitch: 0.4mm;
Surface Finishing: HASL\OSP\Immersion Gold;
HASL\OSP\Immersion Gold: Fr4/Rogers/Aluminum/High Tg;
Copper Thickness: 0.5-5oz;
Board Thickness: 1.6 ±0.1mm;
Minimum Hole: Minimum;
Minimum Width: 3/3mil;
Minimum Line: 3/3mil;
Product Name: OEM PCB PCBA Board Assembly;
Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Fexible;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Max Layer Counts: 6 Layer;
Max Copper Thickness: 2oz;
Mininum Line Width: 3mil;
Minimum Line Space: 3mil;
UL Certificate: Yes;
Sample Building: Yes;
Quickturn Service: Yes;
Country of Origin: China;
Packing: Vacuum Packing;
Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Fexible;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Max Layer Counts: 6 Layer;
Max Copper Thickness: 2oz;
Mininum Line Width: 3mil;
Minimum Line Space: 3mil;
UL Certificate: Yes;
Sample Building: Yes;
Quickturn Service: Yes;
Country of Origin: China;
Packing: Vacuum Packing;
Supplier Name

Shanghai Gawin Electronic Technology Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Finest Pcb Assembly Limited

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Finest Pcb Assembly Limited

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Shenzhen Greenstone Technology Limited

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Shenzhen Greenstone Technology Limited

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