LED Display Screen Printed Circuit Board Mainboard PCB Pitch1.9 pictures & photos

LED Display Screen Printed Circuit Board Mainboard PCB Pitch1.9

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Price

Purchase Qty. Reference FOB Price

100-9,999 Pieces US$9.55

10,000+ Pieces US$4.12

Sepcifications

Structure Multilayer Rigid PCB
Dielectric FR-4
Material Epoxy Paper Laminate
Application Communication
Flame Retardant Properties V0
Processing Technology Electrolytic Foil
Production Process Additive Process
Base Material Copper
Insulation Materials Epoxy Resin
Brand 11
Transport Package Vacuum + Carton Packing
Specification 1
Trademark 1
Origin Made in China
Layer Count 10L up to 64L
Board Thickness 1.6mm up to 15mm
Min Hole Size 0.15mm
Min. Trace/Space 4mil
Finished Copper 1/1 Oz

Product Description

Layers: 10L HDI Thickness: 1.6mm Out Layer Copper Thickness: HOZ Inner Layer Copper Thickness: HOZ Min hole size: 0.15mm Blind&Buried via: 0.1mm Min Line Width/Space: 4mil Surface finish: Immersion Gold Product Application: LED, Display Screen, Display Special: pitch 1.9 ...

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Shanghai Gawin Electronic Technology Co., Ltd.

Diamond Member Since 2020

Audited Supplier

Business Type Manufacturer/Factory, Trading Company
Main Products IC Products, Components Sourcing, EMS/PCB Assembly/SMT, Rigid-Flex PCB, High Speed PCB, High-Frequency PCB, Multilayer PCB/HDI PCB, Flexible PCB/FPC, Semconductor Test-Board, Load Board/Probe Card
Registered Capital 10000000 RMB
Plant Area 3000 square meters
Management System Certification ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays

Display Screen Board Comparison

	LED Display Screen Printed Circuit Board Mainboard PCB Pitch1.9 Contact Now	Quick View Subtractive Process Copper King Field/OEM Vacuum Packaging Solar Inverter PCB Board Contact Now	Quick View Fr-4 Epoxide Woven Glass Fabric Laminate Al Base Ccl Rigid PCB Circuit Boards Contact Now	Quick View King Field/OEM Epoxy Resin Vacuum Packaging PCB LED Circuit Board Contact Now	Quick View ± 8% Subtractive Process One Sided Copper Sheets Rigid Circuit PCB Boards Contact Now

Transaction Info
	LED Display Screen Printed Circuit Board Mainboard PCB Pitch1.9 Contact Now	Quick View Subtractive Process Copper King Field/OEM Vacuum Packaging Solar Inverter PCB Board Contact Now	Quick View Fr-4 Epoxide Woven Glass Fabric Laminate Al Base Ccl Rigid PCB Circuit Boards Contact Now	Quick View King Field/OEM Epoxy Resin Vacuum Packaging PCB LED Circuit Board Contact Now	Quick View ± 8% Subtractive Process One Sided Copper Sheets Rigid Circuit PCB Boards Contact Now
Price	US $ 4.12-9.55/ Piece	US $ 0.95-2.10/ Piece	US $ 0.95-2.10/ Piece	US $ 0.95-2.10/ Piece	US $ 0.95-2.10/ Piece
Min Order	100 Pieces	100 Pieces	100 Pieces	100 Pieces	100 Pieces
Trade Terms	-	-	-	-	-
Payment Terms	T/T, Western Union, Paypal	L/C, T/T, D/P, Western Union, Paypal	L/C, T/T, D/P, Western Union, Paypal	L/C, T/T, D/P, Western Union, Paypal	L/C, T/T, D/P, Western Union, Paypal
Quality Control
Product Certification	-	ISO9001, ISO16949, RoHS	ISO9001, ISO16949, RoHS	ISO9001, ISO16949, RoHS	ISO9001, ISO16949, RoHS
Management System Certification	ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 14001, IATF16949
Trade Capacity
Export Markets	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue	-	-	-	-	-
Business Model	OEM, ODM	OEM, ODM	OEM, ODM	OEM, ODM	OEM, ODM
Average Lead Time	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)
Product Attributes
Specification	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Epoxy Paper Laminate; Application: Communication; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Production Process: Additive Process; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: 11; Layer Count: 10L up to 64L; Board Thickness: 1.6mm up to 15mm; Min Hole Size: 0.15mm; Min. Trace/Space: 4mil; Finished Copper: 1/1 Oz;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Epoxide Woven Glass Fabric Laminate; Application: Medical Instruments; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Production Process: Subtractive Process; Base Material: Copper; Insulation Materials: Epoxy Resin; Surface Treatment: OSP, Immersion Gold, Immersion Tin, Immersion AG; Impedance Control Accuracy: ±8%; Minimum Solder Resist Opening: 1.5mil;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Epoxide Woven Glass Fabric Laminate; Application: Medical Instruments; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Production Process: Subtractive Process; Base Material: Copper; Insulation Materials: Epoxy Resin; Surface Treatment: OSP, Immersion Gold, Immersion Tin, Immersion AG; Impedance Control Accuracy: ±8%; Minimum Solder Resist Opening: 1.5mil;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Epoxide Woven Glass Fabric Laminate; Application: Medical Instruments; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Production Process: Subtractive Process; Base Material: Copper; Insulation Materials: Epoxy Resin; Surface Treatment: OSP, Immersion Gold, Immersion Tin, Immersion AG; Impedance Control Accuracy: ±8%; Minimum Solder Resist Opening: 1.5mil;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Epoxide Woven Glass Fabric Laminate; Application: Medical Instruments; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Production Process: Subtractive Process; Base Material: Copper; Insulation Materials: Epoxy Resin; Surface Treatment: OSP, Immersion Gold, Immersion Tin, Immersion AG; Impedance Control Accuracy: ±8%; Minimum Solder Resist Opening: 1.5mil;
Supplier Name	Shanghai Gawin Electronic Technology Co., Ltd.	King Field Electronic Co., Ltd. (Shenzhen)	King Field Electronic Co., Ltd. (Shenzhen)	King Field Electronic Co., Ltd. (Shenzhen)	King Field Electronic Co., Ltd. (Shenzhen)
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