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US$0.087-0.586 / Piece

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What is High Layout Density PCB with High I/O Count and Short Interconnects

Name: High Layout Density PCB with High I/O Count and Short Interconnects
Uploaded: 2025-01-09T19:13:13+08:00
Description: Features: High I/O Count and Short Interconnects High layout density Array type lead free solder bump & Cu pillar bump Build-up technology & Stack via Fine Pattern formation Specification: Package S

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About this Item

Price

Purchase Qty. Reference FOB Price

1,000-99,999 Pieces US$0.586

100,000+ Pieces US$0.087

Sepcifications

Structure Multilayer Rigid PCB
Dielectric FR-4
Material Epoxy Paper Laminate
Application Consumer Electronics
Flame Retardant Properties V0
Processing Technology Enig
Production Process Additive Process
Base Material Copper
Insulation Materials Epoxy Resin
Brand 1
Transport Package Vacuum + Carton Packing
Specification 3x3mm up to 15x15mm
Trademark 1
Origin Made in China
Layer Count up to 64
Cu Thickness up to 12oz
Board Thickness 90um for MP, 80um Under Development
Fine Line/Space 15/15um
Other Bump Pitch Down to 100 Um

Product Description

Features: High I/O Count and Short Interconnects High layout density Array type lead free solder bump &Cu pillar bump Build-up technology &Stack via Fine Pattern formation Specification: Package Size:3x3mm up to 15x15mm Line&Space 15/15um Bump Pitch down to 100 um ETS, Coreless ...

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Shanghai Gawin Electronic Technology Co., Ltd.

Diamond Member Since 2020

Audited Supplier

Business Type Manufacturer/Factory & Trading Company
Main Products IC Products, Components Sourcing, EMS/PCB Assembly/SMT, Rigid-Flex PCB, High Speed PCB, High-Frequency PCB, Multilayer PCB/HDI PCB, Flexible PCB/FPC, Semconductor Test-Board, Load Board/Probe Card
Year of Establishment 2011-09-22
Management System Certification ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE, GMP
Terms of Payment LC, T/T, D/P, PayPal, Western Union
OEM/ODM Availability Yes

Circuit Board Comparison

	High Layout Density PCB with High I/O Count and Short Interconnects Contact Now	Professional High-Quality Customize PCB&PCBA Design & Manufacture for Electronic Projects Contact Now	Quick View Phenolic Paper Xpc Ccl Copper Clad Laminate Sheet for PCB Contact Now	Quick View 2022 Hot Sale Brown Phenolic Paper Fr2 Ccl Copper Clad Laminate Sheet Contact Now	Quick View 1.0mm Phenolic Paper Fr1 Ccl Copper Clad Laminate Sheet for PCB Contact Now

Transaction Info
	High Layout Density PCB with High I/O Count and Short Interconnects Contact Now	Professional High-Quality Customize PCB&PCBA Design & Manufacture for Electronic Projects Contact Now	Quick View Phenolic Paper Xpc Ccl Copper Clad Laminate Sheet for PCB Contact Now	Quick View 2022 Hot Sale Brown Phenolic Paper Fr2 Ccl Copper Clad Laminate Sheet Contact Now	Quick View 1.0mm Phenolic Paper Fr1 Ccl Copper Clad Laminate Sheet for PCB Contact Now
Price	US $ 0.087-0.586/ Piece	US $ 0.01-100.00/ Piece	US $ 8.00-14.00/ sheet	US $ 8.00-16.00/ sheet	US $ 8.00-14.00/ sheet
Min Order	1000 Pieces	1 Pieces	500 sheet	500 sheet	500 sheet
Payment Terms	T/T, Western Union, Paypal	L/C, T/T, D/P, Western Union, Paypal, Money Gram, 30 days net	L/C, T/T, D/P	L/C, T/T, D/P	L/C, T/T, D/P
Quality Control
Management System Certification	ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE, GMP	ISO 9001, ISO 14001, IATF16949	ISO 9001	ISO 9001	ISO 9001
Trade Capacity
Export Markets	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Southeast Asia, Africa, Western Europe	North America, South America, Southeast Asia, Africa, Western Europe	North America, South America, Southeast Asia, Africa, Western Europe
Annual Export Revenue	US$50 Million - US$100 Million	US$50 Million - US$100 Million	US$10 Million - US$50 Million	US$10 Million - US$50 Million	US$10 Million - US$50 Million
Business Model	OEM, ODM	OEM	Own Brand()	Own Brand()	Own Brand()
Average Lead Time	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: within 15 workdays Peak Season Lead Time: one month	Off Season Lead Time: within 15 workdays Peak Season Lead Time: one month	Off Season Lead Time: within 15 workdays Peak Season Lead Time: one month
Product Attributes
Specification	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Epoxy Paper Laminate; Application: Consumer Electronics; Flame Retardant Properties: V0; Processing Technology: Enig; Production Process: Additive Process; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: 1; Layer Count: up to 64; Cu Thickness: up to 12oz; Board Thickness: 90um for MP, 80um Under Development; Fine Line/Space: 15/15um; Other: Bump Pitch Down to 100 Um;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Polyester Glass Fiber Mat Laminate; Application: Aerospace; Flame Retardant Properties: V2; Processing Technology: Electrolytic Foil; Production Process: Subtractive Process; Base Material: Copper; Insulation Materials: Organic Resin; Brand: Abis; Layer Counts: 1-30 Layers; Board Thickness: 0.20mm-8.00mm; Maximum Size: 600mmx1200mm; Insulation Layer Thickness: 0.075mm--5.00mm; Minimum Line: 0.075mm; Minimum Space: 0.075mm; out Layer Copper Thickness: 18um--350um; Inner Layer Copper Thickness: 17um--175um; Diameter Tolerance(Mechanical): 0.05mm;	Structure: Single-Sided Rigid PCB; Dielectric: Xpc; Material: Phenolic Paper Laminate; Application: Consumer Electronics; Flame Retardant Properties: HB; Processing Technology: Electrolytic Foil; Production Process: Additive Process; Base Material: Phenolic Paper; Insulation Materials: Phenolic Resin; Brand: Hjh; Sheet Thckness: 0.8-1.6mm; Copper Thickness: 18um, 25um, 35um, Others; Color: Brown; Market: Euro, Asia, Central and South America;	Structure: Single-Sided Rigid PCB; Dielectric: FR-2; Material: Phenolic Paper Laminate; Application: Consumer Electronics; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Production Process: Additive Process; Base Material: Phenolic Paper; Insulation Materials: Phenolic Resin; Brand: Hjh; Sheet Thickness: 0.8~1.6mm; Copper Thickness: 18um, 35um, Others; Color: Brown; Market: Euro, Asia, Central and South America;	Structure: Single-Sided Rigid PCB; Dielectric: FR-1; Material: Phenolic Paper Laminate; Application: Consumer Electronics; Flame Retardant Properties: HB; Processing Technology: Electrolytic Foil; Production Process: Additive Process; Base Material: Phenolic Paper; Insulation Materials: Phenolic Resin; Brand: Hjh; Sheet Thickness: 0.8-1.6mm; Copper Thickness: 18um, 25um, 35um, Others; Color: Brown; Market: Euro, Asia, Central and South America;
Supplier Name	Shanghai Gawin Electronic Technology Co., Ltd.	Abis Circuits Co., Ltd.	Haikou Haojinghui Industrial Co., Ltd.	Haikou Haojinghui Industrial Co., Ltd.	Haikou Haojinghui Industrial Co., Ltd.
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