Circuit Board
US$1.27-6.28 / Piece
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What is Shengyi Material Tg180 Impedance Control 16layer Enig Circuit Board PCB for Military Board

About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

100-9,999 Pieces US$6.28

10,000+ Pieces US$1.27

Sepcifications

  • Structure Multilayer Rigid PCB
  • Dielectric FR-4
  • Material Epoxy Paper Laminate
  • Application Consumer Electronics
  • Flame Retardant Properties V0
  • Processing Technology Enig
  • Production Process Additive Process
  • Base Material Copper
  • Insulation Materials Epoxy Resin
  • Brand 1
  • Transport Package Vacuum + Carton Packing
  • Trademark 1
  • Origin Made in China
  • Layer Count up to 64
  • Cu Thickness up to 12oz
  • Board Thickness up to 8mm
  • Min. Hole to Line 8mil
  • Surface Finish Immersiong Gold
  • Other Impedance Control 3mil

Product Description

Company Profile welcome to visit gawinpcba.en.made-in-china.com Shanghai Gawin Electronic Technology Company, a specialized PCB manufacturer with one-stop service from PCB design to PCB manufacture to BOM components procurement to PCB Assembly toFinished Product testing. Ability Show ...

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Circuit Board Comparison
Transaction Info
Price US $ 1.27-6.28/ Piece US $ 1.10-1.20/ Piece US $ 1.25-1.35/ Piece US $ 0.10-5.00/ Piece US $ 1.10-1.20/ Piece
Min Order 100 Pieces 10 Pieces 10 Pieces 1 Pieces 10 Pieces
Trade Terms - - - - -
Payment Terms T/T, Western Union, Paypal T/T T/T L/C, T/T, D/P, Western Union, Paypal, Money Gram T/T
Quality Control
Management System Certification ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949 - ISO 9001, ISO 14001, IATF16949
Trade Capacity
Export Markets North America, Europe, Southeast Asia/ Mideast - - North America, Europe, Southeast Asia/ Mideast -
Annual Export Revenue - - - - -
Business Model OEM, ODM OEM, ODM OEM, ODM - OEM, ODM
Average Lead Time Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
- - - -
Product Attributes
Specification
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Epoxy Paper Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Enig;
Production Process: Additive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: 1;
Layer Count: up to 64;
Cu Thickness: up to 12oz;
Board Thickness: up to 8mm;
Min. Hole to Line: 8mil;
Surface Finish: Immersiong Gold;
Other: Impedance Control 3mil;
Structure: Double-Sided Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Aerospace;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Shengyi, Kb, Nanya, Ilm;
Criteria: Aql II 0.65;
Hole Sizes: 0.25mm;
Bevel Edge: Yes;
Impedance: 50/90/100 Ohm;
Trace Width(Min.): 4mil;
Surfaec Treatment: Enig;
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Computer;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Shengyi, Kb, Nanya, Ilm;
Criteria: Aql II 0.65;
Hole Sizes: 0.25mm;
Bevel Edge: Yes;
Impedance: 50/90/100 Ohm;
Trace Width(Min.): 4mil;
Surfaec Treatment: Enig;
Structure: Double-Sided Rigid PCB;
Dielectric: FR-4;
Material: Fr4 (140tg, 170tg, 180tg), Fr-406, Fr-408, 370hr;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Copper;
Brand: PS;
Quality Test: Aoi, 100% E-Test;
V- Cut Tolerance: +-10mi;
Bevel Edge: +-5mil;
Hole Location Tolerance: +-2mil;
Hole Diameter Tolerance: +-0.05mm;
Board Thickness Tolerance: +-5%;
Line Width/Space Tolerance: +-10%;
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Computer;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Shengyi, Kb, Nanya, Ilm;
Criteria: Aql II 0.65;
Hole Sizes: 0.25mm;
Bevel Edge: Yes;
Impedance: 50/90/100 Ohm;
Trace Width(Min.): 4mil;
Surfaec Treatment: Enig;
Supplier Name

Shanghai Gawin Electronic Technology Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Shenzhen Xinmanda Printed Circuit Board Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Shenzhen Xinmanda Printed Circuit Board Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Ps Electronics Co., Ltd

China Supplier - Diamond Member Audited Supplier

Shenzhen Xinmanda Printed Circuit Board Co., Ltd.

China Supplier - Diamond Member Audited Supplier