Min. Hole to Line 7mil Inner Core Material 0.2mm HASL 8layer PCB for Industrial Power Supply Video

Name: Min. Hole to Line 7mil Inner Core Material 0.2mm HASL 8layer PCB for Industrial Power Supply
Uploaded: 2023-07-07T09:31:19+08:00
Description: Company Profile welcome to visit gawinpcba.en.made-in-china.com Shanghai Gawin Electronic Technology Company, a specialized PCB manufacturer with one-stop service from PCB design to PCB manufacture

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Price

Purchase Qty. Reference FOB Price

100-999 Pieces US$3.15

1,000+ Pieces US$0.223

Sepcifications

Structure Multilayer Rigid PCB
Dielectric FR-4
Material Epoxy Paper Laminate
Application Communication
Flame Retardant Properties V0
Processing Technology Immersion Gold
Production Process Additive Process
Base Material Copper
Insulation Materials Epoxy Resin
Brand 1
Transport Package Vacuum + Carton Packing
Trademark 1
Origin Made in China
Layer Count 8L
Min. Hole to Line 7mil
Inner Core Material 0.2mm

Product Description

Company Profile welcome to visit gawinpcba.en.made-in-china.com Shanghai Gawin Electronic Technology Company, a specialized PCB manufacturer with one-stop service from PCB design to PCB manufacture to BOM components procurement to PCB Assembly toFinished Product testing. Ability Show ...

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Shanghai Gawin Electronic Technology Co., Ltd.

Diamond Member Since 2020

Audited Supplier

Business Type Trading Company
Main Products Multilayer PCB; Rigid-Flex PCB; Components Sourcing; High-Frequency PCB; IC Products; EMS; PCB Assembly; SMT; DIP
Number of Employees 7
Year of Establishment 2011-09-22
Management System Certification ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays

Circuit Board Comparison

	Quick View Min. Hole to Line 7mil Inner Core Material 0.2mm HASL 8layer PCB for Industrial Power Supply Contact Now	Quick View Medical Instruments Fr-4 King Field/OEM One Sided Copper Sheets PCB Board Contact Now	Quick View King Field/OEM Copper Vacuum Packaging 100*585 China CCTV PCB Board Contact Now	Quick View ± 8% Electrolytic Foil King Field/OEM Vacuum Packaging Copper Clad Laminate PCB Contact Now	Quick View Fr-4 King Field/OEM Vacuum Packaging Copper Sheet Rigid PCB Circuit Boards Contact Now

Transaction Info
	Quick View Min. Hole to Line 7mil Inner Core Material 0.2mm HASL 8layer PCB for Industrial Power Supply Contact Now	Quick View Medical Instruments Fr-4 King Field/OEM One Sided Copper Sheets PCB Board Contact Now	Quick View King Field/OEM Copper Vacuum Packaging 100*585 China CCTV PCB Board Contact Now	Quick View ± 8% Electrolytic Foil King Field/OEM Vacuum Packaging Copper Clad Laminate PCB Contact Now	Quick View Fr-4 King Field/OEM Vacuum Packaging Copper Sheet Rigid PCB Circuit Boards Contact Now
Price	US $ 0.223-3.15/ Piece	US $ 0.95-2.10/ Piece	US $ 0.95-2.10/ Piece	US $ 0.95-2.10/ Piece	US $ 0.95-2.10/ Piece
Min Order	100 Pieces	100 Pieces	100 Pieces	100 Pieces	100 Pieces
Trade Terms	-	-	-	-	-
Payment Terms	T/T, Western Union, Paypal	L/C, T/T, D/P, Western Union, Paypal	L/C, T/T, D/P, Western Union, Paypal	L/C, T/T, D/P, Western Union, Paypal	L/C, T/T, D/P, Western Union, Paypal
Quality Control
Product Certification	-	ISO9001, ISO16949, RoHS	ISO9001, ISO16949, RoHS	ISO9001, ISO16949, RoHS	ISO9001, ISO16949, RoHS
Management System Certification	ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 14001, IATF16949
Trade Capacity
Export Markets	North America, Europe, Southeast Asia/ Mideast	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue	-	-	-	-	-
Business Model	OEM, ODM	OEM, ODM	OEM, ODM	OEM, ODM	OEM, ODM
Average Lead Time	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)
Product Attributes
Specification	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Epoxy Paper Laminate; Application: Communication; Flame Retardant Properties: V0; Processing Technology: Immersion Gold; Production Process: Additive Process; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: 1; Layer Count: 8L; Min. Hole to Line: 7mil; Inner Core Material: 0.2mm;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Epoxide Woven Glass Fabric Laminate; Application: Medical Instruments; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Production Process: Subtractive Process; Base Material: Copper; Insulation Materials: Epoxy Resin; Surface Treatment: OSP, Immersion Gold, Immersion Tin, Immersion AG; Impedance Control Accuracy: ±8%; Minimum Solder Resist Opening: 1.5mil;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Epoxide Woven Glass Fabric Laminate; Application: Medical Instruments; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Production Process: Subtractive Process; Base Material: Copper; Insulation Materials: Epoxy Resin; Surface Treatment: OSP, Immersion Gold, Immersion Tin, Immersion AG; Impedance Control Accuracy: ±8%; Minimum Solder Resist Opening: 1.5mil;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Epoxide Woven Glass Fabric Laminate; Application: Medical Instruments; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Production Process: Subtractive Process; Base Material: Copper; Insulation Materials: Epoxy Resin; Surface Treatment: OSP, Immersion Gold, Immersion Tin, Immersion AG; Impedance Control Accuracy: ±8%; Minimum Solder Resist Opening: 1.5mil;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Epoxide Woven Glass Fabric Laminate; Application: Medical Instruments; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Production Process: Subtractive Process; Base Material: Copper; Insulation Materials: Epoxy Resin; Surface Treatment: OSP, Immersion Gold, Immersion Tin, Immersion AG; Impedance Control Accuracy: ±8%; Minimum Solder Resist Opening: 1.5mil;
Supplier Name	Shanghai Gawin Electronic Technology Co., Ltd.	King Field Electronic Co., Ltd. (Shenzhen)	King Field Electronic Co., Ltd. (Shenzhen)	King Field Electronic Co., Ltd. (Shenzhen)	King Field Electronic Co., Ltd. (Shenzhen)
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