Circuit Board
US$0.275-3.60 / Piece
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What is Enig Impedance Control PCB BGA to Line 3.5mil 8layer Circuit Board PCB

About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

100-999 Pieces US$3.60

1,000+ Pieces US$0.275

Sepcifications

  • Structure Multilayer Rigid PCB
  • Dielectric FR-4
  • Material Epoxy Paper Laminate
  • Application Communication
  • Flame Retardant Properties V0
  • Processing Technology Immersion Gold
  • Production Process Additive Process
  • Base Material Copper
  • Insulation Materials Epoxy Resin
  • Brand 1
  • Transport Package Vacuum + Carton Packing
  • Specification 1
  • Trademark 1
  • Origin Made in China
  • Layer Count 8L
  • Other Impedance Control
  • BGA to Line 3.5mil

Product Description

Company Profile welcome to visit gawinpcba.en.made-in-china.com Shanghai Gawin Electronic Technology Company, a specialized PCB manufacturer with one-stop service from PCB design to PCB manufacture to BOM components procurement to PCB Assembly toFinished Product testing. Ability Show ...

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Transaction Info
Price US $ 0.275-3.60/ Piece US $ 0.50-10.00/ Piece US $ 0.50-10.00/ Piece US $ 0.50-10.00/ Piece US $ 0.50-10.00/ Piece
Min Order 100 Pieces 1 Pieces 1 Pieces 1 Pieces 1 Pieces
Payment Terms T/T, Western Union, Paypal L/C, T/T, D/P, Western Union, Paypal, Money Gram L/C, T/T, D/P, Western Union, Paypal, Money Gram L/C, T/T, D/P, Western Union, Paypal, Money Gram L/C, T/T, D/P, Western Union, Paypal, Money Gram
Quality Control
Product Certification - RoHS, CCC, ISO, EPA RoHS, CCC, ISO, EPA RoHS, CCC, ISO, EPA RoHS, CCC, ISO, EPA
Management System Certification ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE, GMP ISO 9001, ISO 14001, IATF16949, ISO 13485, PAS 28000 ISO 9001, ISO 14001, IATF16949, ISO 13485, PAS 28000 ISO 9001, ISO 14001, IATF16949, ISO 13485, PAS 28000 ISO 9001, ISO 14001, IATF16949, ISO 13485, PAS 28000
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Mid East, Western Europe North America, South America, Eastern Europe, Southeast Asia, Mid East, Western Europe North America, South America, Eastern Europe, Southeast Asia, Mid East, Western Europe North America, South America, Eastern Europe, Southeast Asia, Mid East, Western Europe
Annual Export Revenue US$50 Million - US$100 Million Above US$100 Million Above US$100 Million Above US$100 Million Above US$100 Million
Business Model OEM, ODM OEM, ODM, Own Brand() OEM, ODM, Own Brand() OEM, ODM, Own Brand() OEM, ODM, Own Brand()
Average Lead Time Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Product Attributes
Specification
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Epoxy Paper Laminate;
Application: Communication;
Flame Retardant Properties: V0;
Processing Technology: Immersion Gold;
Production Process: Additive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: 1;
Layer Count: 8L;
Other: Impedance Control;
BGA to Line: 3.5mil;
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Enig;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Immersion Gold;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: It-933+;
Board Thickness: 1.6mm;
Copper Thickness: 2oz;
Test: Flying Probe & Fixture;
Solder Mask Type: Green;
Min.Line Width/Space: 0.2mm;
Min. Hole Size: 0.4mm;
Customized: Customized;
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Epoxy Resin;
Application: Communication;
Processing Technology: Electrolytic Foil;
Production Process: Immersion Gold;
Base Material: It180A;
Board Thickness: 1.6mm;
Copper Thickness: 2oz;
Test: Flying Probe & Fixture;
Solder Mask Type: Green;
Min.Line Width/Space: 0.1mm;
Min. Hole Size: 0.2mm;
Customized: Customized;
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Epoxy Resin;
Application: Communication;
Processing Technology: Electrolytic Foil;
Production Process: Immersion Gold;
Base Material: It180A;
Board Thickness: 1.6mm;
Copper Thickness: 2oz;
Test: Flying Probe & Fixture;
Solder Mask Type: Green;
Min.Line Width/Space: 0.1mm;
Min. Hole Size: 0.2mm;
Customized: Customized;
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Epoxy Resin;
Application: Communication;
Processing Technology: Electrolytic Foil;
Production Process: Immersion Gold;
Base Material: It180A;
Board Thickness: 1.6mm;
Copper Thickness: 2oz;
Test: Flying Probe & Fixture;
Solder Mask Type: Green;
Min.Line Width/Space: 0.1mm;
Min. Hole Size: 0.2mm;
Customized: Customized;
Supplier Name

Shanghai Gawin Electronic Technology Co., Ltd.

Diamond Member Audited Supplier

Usun Electronics Limited.,

Gold Member Audited Supplier

Usun Electronics Limited.,

Gold Member Audited Supplier

Usun Electronics Limited.,

Gold Member Audited Supplier

Usun Electronics Limited.,

Gold Member Audited Supplier