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US$2.10-2.50 / Piece
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What is Ceiling Fan Controller DC Kit Remote PCBA with Wire

About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

3,000-9,999 Pieces US$2.50

10,000-14,999 Pieces US$2.30

15,000+ Pieces US$2.10

Sepcifications

  • Metal Coating Copper
  • Mode of Production SMT
  • Layers Single-Layer
  • Base Material FR-4
  • Customized Customized
  • Condition New
  • Transport Package Bulble Bag
  • Specification DC 12V
  • Trademark SHENGQI
  • Origin Guangdong, China
  • Surface Finishing HASL
  • Copper Thickness 1oz
  • Board Thickness 1.6mm
  • Min. Hole Size 0.25mm
  • Min. Line Width 0.10mm
  • Min. Line Spacing 0.1mm/4mil
  • Max Power 52W
  • Rated Voltage DC 12V
  • Control Mode Foc
  • Power Supply Solar Panel
  • Speed Adjustment Remote Control/Wall Control
  • Transmission IR
  • Current 3.0-3.3AMP
  • Packing 500PCS/Carton
  • Shape Square / Round

Product Description

Product Parameters Product name Dc Ceiling Fan Pcb Max Power 52W Rated Voltage DC 12V control mode FOC Power supply Solar panel Speed adjustment Remote Control/Wall control Transmission IR Current 3.0-3.3AMP Packing 500pcs/carton shape Square / Round 1. Buzzer - We use ...

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PCBA Boards Comparison
Transaction Info
Price US $ 2.10-2.50/ Piece US $ 0.98-5.00/ Piece US $ 0.98-5.00/ Piece US $ 0.89-6.00/ Piece Negotiable
Min Order 3000 Pieces 10 Pieces 10 Pieces 10 Pieces 1 Pieces
Payment Terms L/C, T/T, Paypal, Money Gram, Alipay T/T T/T, D/P, Paypal, Money Gram T/T L/C, 50%T/T
Quality Control
Product Certification - RoHS, CCC, ISO RoHS, CCC, ISO ISO RoHS, ISO, ISO13485,IATF16949
Management System Certification ISO 9001 ISO 9001, IATF16949, ISO 13485 ISO 9001, IATF16949, ISO 13485 ISO 9001, IATF16949, ISO 13485 ISO 9001, IATF16949, ISO 13485
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, Eastern Europe, Southeast Asia, Africa, Oceania, Eastern Asia, Western Europe North America, Eastern Europe, Southeast Asia, Africa, Oceania, Eastern Asia, Western Europe North America, Eastern Europe, Southeast Asia, Africa, Oceania, Eastern Asia, Western Europe North America, Eastern Europe, Southeast Asia, Africa, Oceania, Eastern Asia, Western Europe
Annual Export Revenue US$2.5 Million - US$5 Million US$10 Million - US$50 Million US$10 Million - US$50 Million US$10 Million - US$50 Million US$10 Million - US$50 Million
Business Model OEM, ODM, Own Brand(SHENGQI) OEM, ODM OEM, ODM OEM, ODM OEM, ODM
Average Lead Time Off Season Lead Time: within 15 workdays
Peak Season Lead Time: one month
Off Season Lead Time: one month
Peak Season Lead Time: 1-3 months
Off Season Lead Time: one month
Peak Season Lead Time: 1-3 months
Off Season Lead Time: one month
Peak Season Lead Time: 1-3 months
Off Season Lead Time: one month
Peak Season Lead Time: 1-3 months
Product Attributes
Specification
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Single-Layer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Surface Finishing: HASL;
Copper Thickness: 1oz;
Board Thickness: 1.6mm;
Min. Hole Size: 0.25mm;
Min. Line Width: 0.10mm;
Min. Line Spacing: 0.1mm/4mil;
Max Power: 52W;
Rated Voltage: DC 12V;
Control Mode: Foc;
Power Supply: Solar Panel;
Speed Adjustment: Remote Control/Wall Control;
Transmission: IR;
Current: 3.0-3.3AMP;
Packing: 500PCS/Carton;
Shape: Square / Round;
PCBA-Testing: X-ray, Aoi;
Processing: Electrolytic Foil;
SMT Capacity: >2 Million Points/Day;
DIP Capacity: >100K Parts/Day;
Min. Space of BGA: +/- 0.3mm;
Min.Pin Space of IC: 0.3mm;
Max.Precision of IC Assembly: 0.03mm;
Surface Finishing: Lead-Free HASL;
Number of Layers: 4-10 Layer;
Board Thickness: 1.6mm;
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
PCBA-Testing: X-ray, Aoi;
Processing: Electrolytic Foil;
SMT Capacity: >2 Million Points/Day;
DIP Capacity: >100K Parts/Day;
Min. Space of BGA: +/- 0.3mm;
Min.Pin Space of IC: 0.3mm;
Max.Precision of IC Assembly: 0.03mm;
Surface Finishing: Lead-Free HASL;
Number of Layers: 4-10 Layer;
Board Thickness: 1.6mm;
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-6;
Customized: Customized;
Condition: New;
PCBA-Testing: X-ray, Aoi;
Processing: Electrolytic Foil;
SMT Capacity: >2 Million Points/Day;
DIP Capacity: >100K Parts/Day;
Min. Space of BGA: +/- 0.3mm;
Min.Pin Space of IC: 0.3mm;
Max.Precision of IC Assembly: 0.03mm;
Surface Finishing: Lead-Free HASL;
Number of Layers: 4-10 Layer;
Board Thickness: 1.6mm;
Metal Coating: Tin;
Mode of Production: DIP;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Supplier Name

Guangdong Shunde Sankey Electronic Technology Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Hongzhou Smart Technology Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Hongzhou Smart Technology Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Hongzhou Smart Technology Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Hongzhou Smart Technology Co., Ltd.

Diamond Member Audited Supplier