Juki

US$19,999.00-21,999.00 / Piece

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What is SMT Pick and Place Machine PCBA Assembly Juki Ke-2070m Chip Mounter

Name: SMT Pick and Place Machine PCBA Assembly Juki Ke-2070m Chip Mounter
Uploaded: 2025-02-19T11:02:44+08:00
Description: SMT Pick and Place Machine PCBA assembly Juki Ke-2070m Chip Mounter Product Description Product name SMT Pick and Place Machine Juki Ke-2070m Chip Mounter Condition Used Usage Juki placement machine

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About this Item

Price

Min. Order Reference FOB Price

1 Piece US$19,999.00-21,999.00 / Piece

Sepcifications

After-sales Service 24 Hrs Online
Condition Used
Speed Super High Speed
Precision High Precision
Certification RoHS, ISO, CE
Warranty 6 Months
Automatic Grade Automatic
Type Ultra High-speed Chip Mounter
Transport Package Wooden Case
Specification high accuracy
Trademark Juki
Origin Japan
Chip 13,200cph
Use Air Pressure 0.49+-0.05 MPa
Component Placement Type up to 80 Types (Converted to 8mm Tape)
Work Head One Multi-Nozzle Laser Head (6 Nozzles)
Placement Accuracy Laser Recognition +-0.05mm
Feeder Inputs Max. 80 on 8mm T/F

Product Description

SMT Pick and Place Machine PCBA assembly Juki Ke-2070m Chip Mounter Product Description Product name SMT Pick and Place Machine Juki Ke-2070m Chip Mounter Condition Used Usage Juki placement machine and Spare Part accessories Quality 100% tested Package Wooden case Brand Juki ...

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Guangdong Xinling Industrial Co., Ltd

Diamond Member Since 2021

Audited Supplier

Rating & Reviews: 5.0/5.0

(1 Reviews)

Business Type Trading Company
Main Products Smart Feeder, Dp Motor, SMT Machine
Number of Employees 11
Year of Establishment 2021-01-28
Management System Certification BSCI
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays

Juki Comparison

	SMT Pick and Place Machine PCBA Assembly Juki Ke-2070m Chip Mounter Contact Now	Factory Wholesale Automatic Die Bonder Die Attach for LED Packaging Assemble Contact Now	High Precision Wafer Bonder Flipchip Eutectic Bonding Machine with Die Attach System Contact Now	Vacuum Surface Suction High Precision Eutectic Bonding Die Bonder Contact Now	Flip Chip Die Bonder Machine for Semiconductor Packaging Contact Now

Transaction Info
	SMT Pick and Place Machine PCBA Assembly Juki Ke-2070m Chip Mounter Contact Now	Factory Wholesale Automatic Die Bonder Die Attach for LED Packaging Assemble Contact Now	High Precision Wafer Bonder Flipchip Eutectic Bonding Machine with Die Attach System Contact Now	Vacuum Surface Suction High Precision Eutectic Bonding Die Bonder Contact Now	Flip Chip Die Bonder Machine for Semiconductor Packaging Contact Now
Price	US $ 19,999.00-21,999.00/ Piece	US $ 100,000.00-1,000,000.00/ Piece	US $ 100,000.00-1,000,000.00/ Piece	Negotiable	Negotiable
Min Order	1 Pieces	1 Pieces	1 Pieces	1 Pieces	1 Pieces
Payment Terms	L/C, T/T, D/P, Western Union, Paypal	T/T	T/T	T/T	T/T
Quality Control
Product Certification	RoHS, ISO, CE	ISO	ISO	RoHS, ISO, CE	RoHS, ISO, CE
Management System Certification	BSCI, ASME	ISO 9001	ISO 9001	ISO 9001	ISO 9001
Trade Capacity
Export Markets	-	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue	US$2.5 Million - US$5 Million	Above US$100 Million	Above US$100 Million	Above US$100 Million	Above US$100 Million
Business Model	-	-	-	-	-
Average Lead Time	-	Off Season Lead Time: 1-3 months Peak Season Lead Time: 1-3 months	Off Season Lead Time: 1-3 months Peak Season Lead Time: 1-3 months	Off Season Lead Time: 1-3 months Peak Season Lead Time: 1-3 months	Off Season Lead Time: 1-3 months Peak Season Lead Time: 1-3 months
Product Attributes
Specification	After-sales Service: 24 Hrs Online; Condition: Used; Speed: Super High Speed; Precision: High Precision; Warranty: 6 Months; Automatic Grade: Automatic; Type: Ultra High-speed Chip Mounter; Chip: 13,200cph; Use Air Pressure: 0.49+-0.05 MPa; Component Placement Type: up to 80 Types (Converted to 8mm Tape); Work Head: One Multi-Nozzle Laser Head (6 Nozzles); Placement Accuracy Laser Recognition: +-0.05mm; Feeder Inputs: Max. 80 on 8mm T/F;	After-sales Service: Provided; Condition: New; Speed: High Speed; Precision: High Precision; Warranty: 12 Months; Automatic Grade: Automatic; Product Name: Semiconductor Equipment; Feature 1: Guaranteed Quality; Feature 2: Customized According to Needs; After-Sale Service: Provided;	After-sales Service: Provided; Condition: New; Speed: High Speed; Precision: High Precision; Warranty: 12 Months; Automatic Grade: Automatic; Product Name: Semiconductor Equipment; Feature 1: Guaranteed Quality; Feature 2: Customized According to Needs; After-Sale Service: Provided;	After-sales Service: Provided; Condition: New; Speed: High Speed; Precision: High Precision; Warranty: 12 Months; Automatic Grade: Automatic; Product Name: Semiconductor Equipment; Feature 1: High Precision; Feature 2: High Efficiency; After-Sale Service: Provided;	After-sales Service: Provided; Condition: New; Speed: High Speed; Precision: High Precision; Warranty: 12 Months; Automatic Grade: Automatic; Product Name: Flip Chip Die Bonder; Feature 1: High Precision; Feature 2: High Efficiency; After-Sale Service: Provided;
Supplier Name	Guangdong Xinling Industrial Co., Ltd	Jiangsu Himalaya Semiconductor Co., Ltd.	Jiangsu Himalaya Semiconductor Co., Ltd.	Jiangsu Himalaya Semiconductor Co., Ltd.	Jiangsu Himalaya Semiconductor Co., Ltd.
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