Specification |
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Complex;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
Model: PCB;
Brand: Kevis;
Products Name: PCBA Assembly PCB Electronic Motherboard;
Layer: Single / Double Sided / Multilayer;
Service: PCB/PCBA/PCB Assembly/Electronic Parts;
Other Service: Layout Design,Engineering Support,Testing;
Specialised: Medical,Industrial,Communication,Controlboard,LED;
PCBA QC: X-ray, Aoi Test, Function Test(100% Test),40X Om;
Surface Finishing: HASL, Enig, OSP, Lmmersion Au, AG,Sn;
Copper Thickness: 0.5oz/1oz/2oz/3oz/4oz;
Min.Hole Size: 0.1mm (4 Mil);
Board Thickness: 0.2mm-7mm;
Min.Line Spacing: 0.1mm (4 Mil);
Solder Color: Green, Red, White, Black,Yellow,Blue;
SMT Assembly Line: 10 Lines;
Delivery: PCB: 1-5 Days; PCB Assembly: 1-10 Days;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Surface Finish: Immersion Silver;
Board Material: Fr4;
Pth Cu Thickness: 25.16mm;
Inner Layer Cu Thickness: 1 Oz;
Surface Cu Thickness: 56.7 Um;
Solder Mask Color: Green;
Legend Color: White;
Trace Width (mm): 0.256mm;
Spacing (mm): 0.190 mm;
Test: Electronic Test;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Model: PCB;
Brand: Bicheng;
Surface Finish: Immersion Gold;
Board Thick: 1.58-1.62mm;
Outer Copper Foil: 42.37 Um;
Solder Mask Color: Blue Matt;
Legend Color: White;
Min Line Width (Mil): 6.1 Mil;
Min Line Spacing (Mil): 5.8 Mil;
Electrical Test: 100% PCB Passed;
Forming: V-Cut;
Visual Inspection: Ipc-a-600h&Ipc-6012c;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Board Thickness: 1.6mm;
Copper Thickness: 70um(2oz);
Surface Finish: Lead Free HASL;
Solder Mask: Green;
Legend: White;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Board Thickness: 0.062 Inch;
Metal Weight: 1 Oz Copper;
Surface Finish: Enig (Immersion Gold);
Solder Mask: Lpi Black, Both Sided Per Ipc-Sm-840, Class H;
Silkscreen: White, Both Sides Per Ipc-a-600h, Class 2;
Minimum Conductor Width: 0.0035inch;
Smallest Drill Hole: 0.006 Inch;
Minimum Finished Feature Spacing: 0.005 Pad to Pad, 0.005 Trace to Trace;
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