Specification |
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Kevis;
Products Name: PCBA Assembly PCB Electronic Motherboard;
Layer: Single / Double Sided / Multilayer;
Service: PCB/PCBA/PCB Assembly/Electronic Parts;
Other Service: Layout Design,Engineering Support,Testing;
Specialised: Medical,Industrial,Communication,Controlboard,LED;
PCBA QC: X-ray, Aoi Test, Function Test(100% Test),40X Om;
Surface Finishing: HASL, Enig, OSP, Lmmersion Au, AG,Sn;
Copper Thickness: 0.5oz/1oz/2oz/3oz/4oz;
Min.Hole Size: 0.1mm (4 Mil);
Board Thickness: 0.2mm-7mm;
Min.Line Spacing: 0.1mm (4 Mil);
Solder Color: Green, Red, White, Black,Yellow,Blue;
SMT Assembly Line: 10 Lines;
Delivery: PCB: 1-5 Days; PCB Assembly: 1-10 Days;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Medical Instruments;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Outer Copper Foil: 1 Oz;
Inner Copper Thick: 1 Oz;
Board Thickness: 1.6mm;
Surface Treament: Enig;
Solder Mask: Green, Kuang Shun;
Legend: White, Kuang Shun;
Min Line Width (Mil): 5.2 Mil;
Min Line Spacing (Mil): 6.2 Mil;
Visual Inspection: Ipc-a-600h&Ipc-6012c;
Electrical Test: 100% PCB Passed;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Outer Copper Foil: 1oz;
Board Thickness: 1.2mm;
Surface Treament: Gold Finger + HASL Lead Free;
Solder Mask: Green,Lp-4G G-05;
Legend: White,Ijr-4000 MW300;
Min Line Width (Mil): 11.7;
Min Line Spacing (Mil): 5.8;
Electrical Test: 100% PCB Passed;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Medical Instruments;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Outer Copper Foil: 1 Oz;
Board Thickness: 3.2mm;
Surface Treament: HASL Lead Free;
Solder Mask: Blue;
Legend: White;
Min Line Width (Mil): 7.3 Mil;
Min Line Spacing (Mil): 6.2 Mil;
Electrical Test: 100% PCB Passed;
Visual Inspection: Ipc-a-600h&Ipc-6012c;
Forming: V-Cut;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Outer Copper Foil: 1 Oz;
Board Thickness: 1.6mm;
Surface Treament: Enig;
Solder Mask: Green;
Legend Color: White;
Min Line Width (Mil): 6.2 Mil;
Min Line Spacing (Mil): 5.8 Mil;
Electrical Test: 100% PCB Passed;
Visual Inspection: Ipc-a-600h&Ipc-6012c;
Solderability Test: 245 5s 1 Cycle;
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