Specification |
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Kevis;
Products Name: PCBA Assembly PCB Electronic Motherboard;
Layer: Single / Double Sided / Multilayer;
Service: PCB/PCBA/PCB Assembly/Electronic Parts;
Other Service: Layout Design,Engineering Support,Testing;
Specialised: Medical,Industrial,Communication,Controlboard,LED;
PCBA QC: X-ray, Aoi Test, Function Test(100% Test),40X Om;
Surface Finishing: HASL, Enig, OSP, Lmmersion Au, AG,Sn;
Copper Thickness: 0.5oz/1oz/2oz/3oz/4oz;
Min.Hole Size: 0.1mm (4 Mil);
Board Thickness: 0.2mm-7mm;
Min.Line Spacing: 0.1mm (4 Mil);
Solder Color: Green, Red, White, Black,Yellow,Blue;
SMT Assembly Line: 10 Lines;
Delivery: PCB: 1-5 Days; PCB Assembly: 1-10 Days;
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Type: Rigid Circuit Board;
Dielectric: Rt/Duroid 5880lz;
Material: PTFE;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Final Foil External: 1 Oz;
Surface Finish: Immersion Gold;
Minimumtrace and Space: 4 Mil/4 Mil;
Minimum / Maximum Holes: 0.3/4.2mm;
Via: Plated Through Hole(Pth), Via Tented. Blind Via F;
Test: 100% Electrical Test Prior Shipment;
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Type: Rigid Circuit Board;
Dielectric: Tlx-8;
Material: PTFE;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Glass Reinforced Hydrocarbon and Epoxy Resin;
Final Foil External: 1 Oz;
Final Height of PCB: 1.6 mm ±10%;
Surface Finish: OSP;
Minimum Trace and Space: 10 Mil/15 Mil;
Minimum / Maximum Holes: 0.5/2.0mm;
Test: 100% Electrical Test Prior Shipment;
Via: UL 94-V0 Approval Min;
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Type: Rigid Circuit Board;
Dielectric: RO4350b;
Material: Hydrocarbon;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: PTFE;
Final Foil External: 1.5 Oz;
Final Foil Internal: 0 Oz;
Final Height of PCB: 1.6mm &Plus0.1mm;
Surface Finish: Immersion Gold;
Via: Plated Through Hole(Pth);
Test: 100% Electrical Test Prior Shipment;
Flamibility Rating: UL 94-V0 Approval Min.;
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Type: Rigid Circuit Board;
Dielectric: Rogers 3006 25mil;
Material: PTFE;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Final Foil External: 1 Oz;
Final Height of PCB: 0.8 mm ±0.1mm;
Surface Finish: Immersion Gold;
Solder Mask Color: Green, Psr-2000gt600d, Taiyo Supplied.;
Minimum Trace and Space: 4 Mil / 4 Mil;
Minimum / Maximum Holes: 0.4mm / 1.0mm;
Test: 100% Electrical Test Prior Shipment;
Colour of Component Legend: White, Ijr-4000 MW300, Taiyo Brand;
Flamibility Rating: UL 94-V0 Approval Min.;
Board Plating: 0.0029";
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