PCBA Assembly
US$0.10-1.00 / Piece
  • Recommend for you
  • What is OEM PCBA Manufacturer Printed Circuit Board Assembly Multilayer PCB
  • What is PCBA Assembly Factory PCBA Printed Medical Equipment Circuit Board Multilayer Electronic Board PCB & PCBA OEM Manufacturers PCB
  • What is PCB Reverse Engineering Service PCBA Assembly Electronic Board Manufacturer Multilayer PCB

What is SMT PCBA Fabrication Electronics Module Board Circuit PCBA Assembly Manufacturer OEM PCB

About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

1-99 Pieces US$1.00

100-499 Pieces US$0.50

500+ Pieces US$0.10

Sepcifications

  • Type Rigid Circuit Board
  • Dielectric FR-4
  • Material Fiberglass Epoxy
  • Application Consumer Electronics
  • Flame Retardant Properties V0
  • Mechanical Rigid Rigid
  • Processing Technology Electrolytic Foil
  • Base Material Copper
  • Insulation Materials Organic Resin
  • Brand Kevis
  • Transport Package Individual Packaging
  • Specification 20*18*1
  • Trademark KAIVESIN
  • Origin Guangzhou
  • Products Name PCBA Assembly PCB Electronic Motherboard
  • Layer Single / Double Sided / Multilayer
  • Service PCB/PCBA/PCB Assembly/Electronic Parts
  • Other Service Layout Design,Engineering Support,Testing
  • Specialised Medical,Industrial,Communication,Controlboard,LED
  • PCBA QC X-ray, Aoi Test, Function Test(100% Test),40X Om
  • Certificate ISO9001,ISO14001,ISO13485,Ts-16949,etc
  • Surface Finishing HASL, Enig, OSP, Lmmersion Au, AG,Sn
  • Copper Thickness 0.5oz/1oz/2oz/3oz/4oz
  • Min.Hole Size 0.1mm (4 Mil)
  • Board Thickness 0.2mm-7mm
  • Min.Line Spacing 0.1mm (4 Mil)
  • Solder Color Green, Red, White, Black,Yellow,Blue
  • SMT Assembly Line 10 Lines
  • Delivery PCB: 1-5 Days; PCB Assembly: 1-10 Days

Product Description

Title SMT Pcba Fabrication Electronics Module Board Circuit PCBA Assembly Manufacturer Oem Pcb Product Parameters ltem Value Product name Kevis Manufacturer OEM PCB Circuit Board SMT PCB Assembly Model Number Printed Circuit Board , Development Board , Motherboard Type PCB , PCBA Place of ...

Learn More

PCBA Assembly Comparison
Transaction Info
Price US $ 0.10-1.00/ Piece US $ 1.00-50.00/ Piece US $ 1.00-50.00/ Piece US $ 1.00-50.00/ Piece US $ 1.00-50.00/ Piece
Min Order 1 Pieces 1 Pieces 1 Pieces 1 Pieces 1 Pieces
Payment Terms L/C, T/T, D/P, Western Union, Paypal, Money Gram L/C, T/T, D/P, Paypal L/C, T/T, D/P, Paypal L/C, T/T, D/P, Paypal L/C, T/T, D/P, Paypal
Quality Control
Product Certification ISO9001,ISO14001,ISO13485,Ts-16949,etc - - - -
Management System Certification ISO 9001, ISO 14001 - - - -
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue Above US$100 Million US$5 Million - US$10 Million US$5 Million - US$10 Million US$5 Million - US$10 Million US$5 Million - US$10 Million
Business Model OEM, ODM OEM, ODM OEM, ODM OEM, ODM OEM, ODM
Average Lead Time Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Product Attributes
Specification
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Kevis;
Products Name: PCBA Assembly PCB Electronic Motherboard;
Layer: Single / Double Sided / Multilayer;
Service: PCB/PCBA/PCB Assembly/Electronic Parts;
Other Service: Layout Design,Engineering Support,Testing;
Specialised: Medical,Industrial,Communication,Controlboard,LED;
PCBA QC: X-ray, Aoi Test, Function Test(100% Test),40X Om;
Surface Finishing: HASL, Enig, OSP, Lmmersion Au, AG,Sn;
Copper Thickness: 0.5oz/1oz/2oz/3oz/4oz;
Min.Hole Size: 0.1mm (4 Mil);
Board Thickness: 0.2mm-7mm;
Min.Line Spacing: 0.1mm (4 Mil);
Solder Color: Green, Red, White, Black,Yellow,Blue;
SMT Assembly Line: 10 Lines;
Delivery: PCB: 1-5 Days; PCB Assembly: 1-10 Days;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Delay Pressure Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Customized;
Surface Finished: HASL, Gold Finger, OSP, Enig, Peelable Mask;
Layer: 1-32;
Outline Profile: Rout/ V-Cut Bridge/ Stamp Hole;
Max Production Size: 600*800mm;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Delay Pressure Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Customized;
Surface Finished: HASL, Gold Finger, OSP, Enig, Peelable Mask;
Layer: 1-32;
Outline Profile: Rout/ V-Cut Bridge/ Stamp Hole;
Max Production Size: 600*800mm;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Delay Pressure Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Customized;
Surface Finished: HASL, Gold Finger, OSP, Enig, Peelable Mask;
Layer: 1-32;
Outline Profile: Rout/ V-Cut Bridge/ Stamp Hole;
Max Production Size: 600*800mm;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Delay Pressure Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Customized;
Surface Finished: HASL, Gold Finger, OSP, Enig, Peelable Mask;
Layer: 1-32;
Outline Profile: Rout/ V-Cut Bridge/ Stamp Hole;
Max Production Size: 600*800mm;
Supplier Name

Guangzhou Kevis Electronic Technology Co., Ltd.

Diamond Member Audited Supplier

KTB Jilin Technology Co., Ltd.

Gold Member

KTB Jilin Technology Co., Ltd.

Gold Member

KTB Jilin Technology Co., Ltd.

Gold Member

KTB Jilin Technology Co., Ltd.

Gold Member

Find more xxx Articles