| Specification |
Structure: Metal Base Rigid PCB;
Dielectric: FR-4;
Material: Epoxide Woven Glass Fabric Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Haizhanni;
MOQ: 0;
Test: 100% E-Test;
Copper Thickness: 0.5-120z(18-420um);
Board Thickness: 1.0-2.0mm;
HS: 8534009;
Annual Production Capacity: 500000PCS/Year;
Solder Mask Color: Green/Black/White/Red/Blue/Y Ellow;
Layers: 1-24layers;
Surface Treatment: Gold Finger/Hard Gold/HASL/Haslfree;
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Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Epoxide Woven Glass Fabric Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: HB;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Aluminum;
Insulation Materials: Epoxy Resin;
Brand: Jxpcba;
Layer: 1-32 Layers;
Board Thickness: 0.2-8.0mm;
PCBA Testing: PCB: Ict Testing and Flying Probe Testing, PCBA: a;
PCBA Packaging: Static Packaging, Shockproof Packaging, Anti-Drop;
Qualified: Ipc-a-610cclass 2 Standard;
Service: OEM/ODM, EMS;
PCB Material: Fr-4, Cem-1, Cem-3, Aluminum, Copper;
Copper Thickness: 18um-210um(6oz);
PCB Shape: Rectangular, Round, Slots, Cutouts, Complex, Irreg;
Surface Finish/Treatment: HASL/RoHS, Immersion Silver/Gold, OSP, Gold Platin;
Solder Mask: Green/Black/White/Red/Blue/Yellow, etc;
Profiling Punching: Routing, V-Cut, Beveling;
Placement Precision: Qfp, Sop, Plcc, BGA;
Assembly Service: PCB Prototype, Components Sourcing and in-House;
|
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Epoxide Woven Glass Fabric Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: HB;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Aluminum;
Insulation Materials: Epoxy Resin;
Brand: Jxpcba;
Layer: 1-32 Layers;
Board Thickness: 0.2-8.0mm;
PCBA Testing: PCB: Ict Testing and Flying Probe Testing, PCBA: a;
PCBA Packaging: Static Packaging, Shockproof Packaging, Anti-Drop;
Qualified: Ipc-a-610cclass 2 Standard;
Thick Copper: 18um-140um(4oz);
Service: OEM/ODM, EMS;
|
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Epoxide Woven Glass Fabric Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: HB;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Aluminum;
Insulation Materials: Epoxy Resin;
Brand: Jxpcba;
Layer: 1-32 Layers;
Board Thickness: 0.2-8.0mm;
PCBA Testing: PCB: Ict Testing and Flying Probe Testing, PCBA: a;
PCBA Packaging: Static Packaging, Shockproof Packaging, Anti-Drop;
Qualified: Ipc-a-610cclass 2 Standard;
Thick Copper: 18um-140um(4oz);
Service: OEM/ODM, EMS;
|
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Epoxide Woven Glass Fabric Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: HB;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Aluminum;
Insulation Materials: Epoxy Resin;
Brand: Jxpcba;
Layer: 1-32 Layers;
Board Thickness: 0.2-8.0mm;
PCBA Testing: PCB: Ict Testing and Flying Probe Testing, PCBA: a;
PCBA Packaging: Static Packaging, Shockproof Packaging, Anti-Drop;
Qualified: Ipc-a-610cclass 2 Standard;
Thick Copper: 18um-140um(4oz);
Service: OEM/ODM, EMS;
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