Bluetooth Amplifier PCB
US$0.10-10.00 / Piece
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About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

10-99 Pieces US$0.10

100+ Pieces US$10.00

Sepcifications

  • Type Rigid Circuit Board
  • Dielectric FR-4
  • Material Fiberglass Epoxy
  • Application Consumer Electronics
  • Flame Retardant Properties V0
  • Mechanical Rigid Rigid
  • Processing Technology Electrolytic Foil
  • Base Material Copper
  • Insulation Materials Organic Resin
  • Brand Haizhanni
  • Transport Package Customized, ESD Bag/Vacuumpackaging+Bubble Bag.
  • Specification 102mm*100mm
  • Trademark haizhanni
  • Origin China
  • MOQ 0
  • Test 100% E-Test
  • Copper Thickness 0.5-120z(18-420um)
  • Board Thickness 1.0-2.0mm
  • HS 8534009
  • Annual Production Capacity 500000PCS/Year
  • Solder Mask Color Green/Black/White/Red/Blue/Y Ellow
  • Layers 1-24layers
  • Certification IATF16949, UL, ISO
  • Surface Treatment Gold Finger/Hard Gold/HASL/Haslfree

Product Description

Welcome to Haizhanni Product Parameters Certifications Company Profile Our company offers variety of products which can meet your multifarious demands. We adhere to the management principles of "quality first, customer first and credit-based" since the establishment ...

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Bluetooth Amplifier PCB Comparison
Transaction Info
Price US $ 0.10-10.00/ Piece US $ 0.10-80.00/ Piece US $ 10.75/ Piece US $ 12.5/ Piece US $ 22.5/ Piece
Min Order 10 Pieces 1 Pieces 1 Pieces 1 Pieces 1 Pieces
Payment Terms T/T, Paypal L/C, T/T, D/P, Western Union, Paypal, Money Gram L/C, T/T, D/P, Western Union, Paypal L/C, T/T, D/P, Western Union, Paypal L/C, T/T, D/P, Western Union, Paypal
Quality Control
Product Certification IATF16949, UL, ISO UL,ISO9001&ISO14001,SGS,RoHS,Ts16949 - - -
Management System Certification ISO 9001, ISO 14001, OHSAS/ OHSMS 18001, IATF16949, QC 080000 ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949
Trade Capacity
Export Markets North America, South America, Southeast Asia, Mid East, Eastern Asia North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue Above US$100 Million US$50 Million - US$100 Million US$10 Million - US$50 Million US$10 Million - US$50 Million US$10 Million - US$50 Million
Business Model OEM, ODM OEM OEM, ODM, Own Brand(KMC) OEM, ODM, Own Brand(KMC) OEM, ODM, Own Brand(KMC)
Average Lead Time Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Product Attributes
Specification
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Haizhanni;
MOQ: 0;
Test: 100% E-Test;
Copper Thickness: 0.5-120z(18-420um);
Board Thickness: 1.0-2.0mm;
HS: 8534009;
Annual Production Capacity: 500000PCS/Year;
Solder Mask Color: Green/Black/White/Red/Blue/Y Ellow;
Layers: 1-24layers;
Surface Treatment: Gold Finger/Hard Gold/HASL/Haslfree;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Kb;
Insulation Materials: Epoxy Resin;
Brand: Abis;
Enig Thickness: 1-3u'';
Holes Specification: Buried/Blind Vias, Via in Pads, Counter Sink Hole;
Hard Gold Thickness: 5-50u'';
Board Thickness: 0.2-6mm;
Copper Thickness: 0.5-8oz;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: HASL Lead-Free;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Material Type: Fr4, High Tg, Cem1, Cem3, Aluminiaum Base, Arlon, Roger;
Layer Counts: 1--30;
Board Thickness: 0.2mm--6.0mm;
Fished Outer Copper: 1oz--5oz;
Minimum Trace Width: 0.003'';
Surface Treatment Type: HASL;HASL+Lead Free;Immersion Gold; Immersion Tin;;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: HASL Lead-Free;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Material Type: Fr4, High Tg, Cem1, Cem3, Aluminiaum Base, Arlon, Roger;
Layer Counts: 1--30;
Board Thickness: 0.2mm--6.0mm;
Fished Outer Copper: 1oz--5oz;
Minimum Trace Width: 0.003'';
Surface Treatment Type: HASL;HASL+Lead Free;Immersion Gold; Immersion Tin;;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: HASL Lead-Free;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Material Type: Fr4, High Tg, Cem1, Cem3, Aluminiaum Base, Arlon, Roger;
Layer Counts: 1--30;
Board Thickness: 0.2mm--6.0mm;
Fished Outer Copper: 1oz--5oz;
Minimum Trace Width: 0.003'';
Surface Treatment Type: HASL;HASL+Lead Free;Immersion Gold; Immersion Tin;;
Supplier Name

Zhejiang Haizhanni Electronic Circuit Co., Ltd.

Diamond Member Audited Supplier

Abis Circuits Co., Ltd.

Diamond Member Audited Supplier

Keep Moving Circuits Co., Ltd.

Diamond Member Audited Supplier

Keep Moving Circuits Co., Ltd.

Diamond Member Audited Supplier

Keep Moving Circuits Co., Ltd.

Diamond Member Audited Supplier