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US$0.01-0.02 / Piece
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High Quality Fr-4 Circuit Board Factory SMT PCBA PCB Assembly Video

About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

100-499 Pieces US$0.02

500+ Pieces US$0.01

Sepcifications

  • Type Rigid Circuit Board
  • Dielectric FR-4
  • Material Fiberglass Epoxy
  • Application Aerospace
  • Flame Retardant Properties V1
  • Mechanical Rigid Rigid
  • Processing Technology Electrolytic Foil
  • Base Material Copper
  • Insulation Materials Metal Composite Materials
  • Transport Package Anti-Static
  • Specification 55.5*66.7*1.2mm
  • Origin China
  • PCB Layers 2-20layers
  • OEM Assembly Supply
  • DIP Assembly Flowflow Welding+Hand Welding
  • SMT Assembly 01005-Qfp64,BGA
  • Test QC,Aoi,Fct,X-ray
  • The Fastest Delivery Time Sample(3-5/Day)
  • Electronic Components Keep a Large Stock of Goods
  • IC Program Burning Supply
  • Design Supply
  • Resistor-Capacitor 01005-1206
  • Electrostatic Comprehensive Protection

Product Description

Printing Accuracy 0.01mm SMT Components 01005-BGA Screen Stencil Size/Max 737*737mm SMT Precision 0.01mm PCB size/max 500*500mm SMT Line 3 pressure 0.5-10eg DIP Line 1 air source 4-6kgf/cm2 SMT Capacity 360000CPH PCB Weight 0-3kg DIP Capacity 100000CPH QC Personnel 5 AOI ...

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PCB Comparison
Transaction Info
Price US $ 0.01-0.02/ Piece US $ 2.00-9.00/ Piece US $ 1.20-10.50/ pcs US $ 45.00-55.00/ Set US $ 0.20-1.60/ pcs
Min Order 100 Pieces 1 Pieces 1 pcs 10 Sets 1 pcs
Trade Terms - - - - -
Payment Terms T/T T/T L/C, T/T, Paypal T/T, Western Union L/C, T/T, Paypal
Quality Control
Management System Certification ISO 9001 ISO 9001, ISO 14000, IATF16949, GMP ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 9000, ISO 14001, ISO 14000, ISO 20000, OHSAS/ OHSMS 18001, IATF16949, HSE, ISO 14064, QC 080000, GMP, BSCI, BRC, SA 8000, QHSE, HACCP, BS 25999-2, ISO 13485, EICC, ANSI/ESD, SEDEX, ISO 22000, AIB, WRAP, GAP, ASME, ISO 29001, BREEAM, HQE, SHE Audits, IFS, QSR, ISO 50001, LEED, PAS 28000, FSC, ISO 10012, ISO 17025 ISO 9001, ISO 14001, IATF16949
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Eastern Asia, Western Europe North America, Eastern Europe, Africa, Mid East, Western Europe North America, Eastern Europe, Southeast Asia, Mid East, Eastern Asia, Western Europe North America, Eastern Europe, Africa, Mid East, Western Europe North America, Eastern Europe, Southeast Asia, Mid East, Eastern Asia, Western Europe
Annual Export Revenue - - - - -
Business Model OEM, ODM OEM, ODM, Others OEM OEM, ODM, Own Brand OEM
Average Lead Time - Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: 1 Month(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Product Attributes
Specification
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Aerospace;
Flame Retardant Properties: V1;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
PCB Layers: 2-20layers;
OEM Assembly: Supply;
DIP Assembly: Flowflow Welding+Hand Welding;
SMT Assembly: 01005-Qfp64,BGA;
Test: QC,Aoi,Fct,X-ray;
The Fastest Delivery Time: Sample(3-5/Day);
Electronic Components: Keep a Large Stock of Goods;
IC Program Burning: Supply;
Design: Supply;
Resistor-Capacitor: 01005-1206;
Electrostatic: Comprehensive Protection;
Type: Flexible Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Medical Instruments;
Flame Retardant Properties: V2;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Jingxin;
PCB: Green Solder Mask;
Silkscreen: White;
Copper: 1oz;
PCB Surface: Enig;
PCB Layers: 8 Layers;
PCBA: Medical Projects;
PCB Thickness: 1.6mm;
SMT: 16 Lines;
DIP: 6 Lines;
Spi: 100% Passed;
Aoi: 100% Passed;
X-ray: 100% Passed;
Programming: Yes;
Function Testing: 100% Passed;
Assembly: Yes;
Type: Rigid-Flex Board;
Dielectric: Fr4+Pi;
Material: Fiberglass Epoxy Resin + Polyimide Resin;
Application: Medical Instruments;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid Fexible;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Hspcb;
Customized: Yes;
Type: Flexible Circuit Board;
Dielectric: CEM-5;
Material: Aluminum Covered Copper Foil Layer;
Application: Consumer Electronics;
Flame Retardant Properties: V2;
Mechanical Rigid: Fexible;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
Voltage: 110-220VAC;
Current: 0.1-20A;
Purity Range: 21%-95.6%;
Flow Range: 0-100lpm;
Mode: Single and Dual Mode;
Usage: Oxygen Concentrator;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Hspcb;
Customized: Yes;
Supplier Name

Shenzhen Haodley Technology Co., Ltd.

China Supplier - Gold Member Audited Supplier

Shenzhen Jingxin Electronic Technology Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Shenzhen Hesheng Circuit Technology Limited

China Supplier - Diamond Member Audited Supplier

Shanghai Teli Industries Co., Ltd.

China Supplier - Gold Member Audited Supplier

Shenzhen Hesheng Circuit Technology Limited

China Supplier - Diamond Member Audited Supplier