Educational Robot Assembly SMT PCBA for Stem Learning Kits with Customization Options pictures & photos

Educational Robot Assembly SMT PCBA for Stem Learning Kits with Customization Options

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About this Item

Price

Min. Order Reference FOB Price

1 Piece US$0.10-1.00 / Piece

Sepcifications

Type Rigid Circuit Board
Dielectric FR-4
Material Fiberglass Epoxy
Application Consumer Electronics
Flame Retardant Properties V0
Mechanical Rigid Rigid
Processing Technology Immersion Gold
Base Material Fr4
Insulation Materials Epoxy Resin
Transport Package Box
Trademark hemeixin
Origin China
Copper Thickness 3oz -105oz
Surface Finish Gold Finger
Special Teck Metal Edging
Special 1 Blind Hole
Special 2 Buried Vias
Special 3 Flex-Rigid PCB

Product Description

Product Description This PCB are 6mm thickness Metal edging Copper thickness is 8oz Our advantages 1)Thickness copper PCB Max Single side PCB copper thickness is 8.0mm/0.035=228oz (Quantity produces) Max Double side pcb copper thickness is 3.0mm/0.035=85oz (Quantity produces) 2) ...

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Shenzhen Hemeixin Electronic Co., Limited

Gold Member Since 2024

Audited Supplier

Rating & Reviews: 5.0/5.0

(2 Reviews)

Business Type Manufacturer/Factory
Main Products PCB, All Kinds Cables, PCBA, Electronic Components, Relay, IC Chips, Sensors, Connectors
Registered Capital 1000000 RMB
Plant Area >2000 square meters
Management System Certification ISO 9001, ISO 9000, ISO 14001
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays

PCB Assembly Comparison

	Educational Robot Assembly SMT PCBA for Stem Learning Kits with Customization Options Contact Now	Low Cost PCB Board Gold Finger Circuit Board and PCBA Factory Contact Now	Multilayer PCB Supplier Gold Finger Circuit Board Manufacturing Contact Now	Quick View High Quality PCB Gold Finger Circuit Board with PCB Assembly Contact Now	Gold Finger Circuit Board with Fr4 Material PCB Manufacturer Contact Now

Transaction Info
	Educational Robot Assembly SMT PCBA for Stem Learning Kits with Customization Options Contact Now	Low Cost PCB Board Gold Finger Circuit Board and PCBA Factory Contact Now	Multilayer PCB Supplier Gold Finger Circuit Board Manufacturing Contact Now	Quick View High Quality PCB Gold Finger Circuit Board with PCB Assembly Contact Now	Gold Finger Circuit Board with Fr4 Material PCB Manufacturer Contact Now
Price	US $ 0.10-1.00/ Piece	US $ 4.11-5.50/ Piece	US $ 4.21-5.72/ Piece	US $ 4.26-6.33/ Piece	US $ 5.20-6.99/ Piece
Min Order	1 Pieces	1 Pieces	1 Pieces	1 Pieces	1 Pieces
Payment Terms	L/C, T/T, Western Union	L/C, T/T, D/P, Western Union, Paypal	L/C, T/T, D/P, Western Union, Paypal	L/C, T/T, D/P, Western Union, Paypal	L/C, T/T, D/P, Western Union, Paypal
Quality Control
Management System Certification	ISO 9001, ISO 9000, ISO 14001	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 14001, IATF16949
Trade Capacity
Export Markets	South America, Eastern Europe, Southeast Asia, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue	US$50 Million - US$100 Million	-	-	-	-
Business Model	OEM, ODM	OEM, ODM	OEM, ODM	OEM, ODM	OEM, ODM
Average Lead Time	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays
Product Attributes
Specification	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Immersion Gold; Base Material: Fr4; Insulation Materials: Epoxy Resin; Copper Thickness: 3oz -105oz; Surface Finish: Gold Finger; Special Teck: Metal Edging; Special 1: Blind Hole; Special 2: Buried Vias; Special 3: Flex-Rigid PCB;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Communication; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Fr4; Insulation Materials: Epoxy Resin; Board Material: Fr4, Rogers; Board Layer: 1-26; Board Thickness: 0.8mm-3.0mm; Copper Thickness: 0.5 Oz-6 Oz; Max PCB Size: 650650mm;* Min Hole: 0.15mm; Min Trace: 0.15mm; Surface Finishing: HASL-Lf; Solder Mask: Any; Lead Time: 4-5 Working Days;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Communication; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Fr4; Insulation Materials: Epoxy Resin; Board Material: Fr4, Rogers; Board Layer: 1-26; Board Thickness: 0.8mm-3.0mm; Copper Thickness: 0.5 Oz-6 Oz; Max PCB Size: 650650mm;* Min Hole: 0.15mm; Min Trace: 0.15mm; Surface Finishing: HASL-Lf; Solder Mask: Any; Lead Time: 4-5 Working Days;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Communication; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Fr4; Insulation Materials: Epoxy Resin; Board Material: Fr4, Rogers; Board Layer: 1-26; Board Thickness: 0.8mm-3.0mm; Copper Thickness: 0.5 Oz-6 Oz; Max PCB Size: 650650mm;* Min Hole: 0.15mm; Min Trace: 0.15mm; Surface Finishing: HASL-Lf; Solder Mask: Any; Lead Time: 4-5 Working Days;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Communication; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Fr4; Insulation Materials: Epoxy Resin; Board Material: Fr4, Rogers; Board Layer: 1-26; Board Thickness: 0.8mm-3.0mm; Copper Thickness: 0.5 Oz-6 Oz; Max PCB Size: 650650mm;* Min Hole: 0.15mm; Min Trace: 0.15mm; Surface Finishing: HASL-Lf; Solder Mask: Any; Lead Time: 4-5 Working Days;
Supplier Name	Shenzhen Hemeixin Electronic Co., Limited	Fastline Circuits Co., Limited	Fastline Circuits Co., Limited	Fastline Circuits Co., Limited	Fastline Circuits Co., Limited
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