PCB Assembly

US$5.00 / Piece

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PCB PCBA PCB Board PCBA Manufacturing Assembly 8 Button Air Fryer Circuit Board pictures & photos

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What is PCB PCBA PCB Board PCBA Manufacturing Assembly 8 Button Air Fryer Circuit Board

Name: PCB PCBA PCB Board PCBA Manufacturing Assembly 8 Button Air Fryer Circuit Board
Uploaded: 2024-07-04T16:43:08+08:00
Description: Product Description Detailed Photos Our advantages Thickness copper PCB Max Single side copper thickness is 8.0mm/0.035=228oz (Quantity produces) Max Double side copper thickness is 3.0mm/0.035=8

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About this Item

Price

Min. Order Reference FOB Price

1 Piece US$5.00 / Piece

Sepcifications

Metal Coating Tin
Mode of Production SMT
Layers Multilayer
Base Material FR-4
Certification RoHS, ISO
Customized Customized
Condition New
Transport Package Box
Trademark hemeixin
Origin China

Product Description

Product Description Detailed Photos Our advantages Thickness copper PCB Max Single side copper thickness is 8.0mm/0.035=228oz (Quantity produces) Max Double side copper thickness is 3.0mm/0.035=85oz (Quantity produces) This Produces are 3mm thickness and Copper is also 3mm 3mm=105OZ ...

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Shenzhen Hemeixin Electronic Co., Limited

Gold Member Since 2024

Audited Supplier

Business Type Manufacturer/Factory
Main Products PCB, All Kinds Cables, PCBA, Electronic Components, Relay, IC Chips, Sensors, Connectors
Registered Capital 1000000 RMB
Plant Area >2000 square meters
Management System Certification ISO 9001, ISO 9000, ISO 14001
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays

PCB Assembly Comparison

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Transaction Info
	PCB PCBA PCB Board PCBA Manufacturing Assembly 8 Button Air Fryer Circuit Board Contact Now	Quick View Drones Remote Controls PCB Assemblies with One Stop Service Contact Now	Quick View High-Precise Drones Remote Controls PCB Assemblies Motherboard PCBA Consumer Electronics Contact Now	Quick View Multilayer Rigid PCB / Fr-4 PCB Motherboard PCBA Turnkey Service Contact Now	Quick View Professional Immersion Gold PCB Assembly Multi Layer Printed Circuit Board Bluetooth Module Contact Now
Price	US $ 5/ Piece	US $ 1.01-2.09/ Piece	US $ 1.01-2.09/ Piece	US $ 1.01-2.09/ Piece	US $ 1.01-2.09/ Piece
Min Order	1 Pieces	100 Pieces	100 Pieces	100 Pieces	100 Pieces
Payment Terms	L/C, T/T, Western Union	T/T	T/T	T/T	T/T
Quality Control
Product Certification	RoHS, ISO	RoHS, CCC, ISO	RoHS, CCC, ISO	RoHS, CCC, ISO	RoHS, CCC, ISO
Management System Certification	ISO 9001, ISO 9000, ISO 14001	ISO 9001, IATF16949, QC 080000	ISO 9001, IATF16949, QC 080000	ISO 9001, IATF16949, QC 080000	ISO 9001, IATF16949, QC 080000
Trade Capacity
Export Markets	South America, Eastern Europe, Southeast Asia, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue	US$50 Million - US$100 Million	US$10 Million - US$50 Million	US$10 Million - US$50 Million	US$10 Million - US$50 Million	US$10 Million - US$50 Million
Business Model	OEM, ODM	OEM, ODM	OEM, ODM	OEM, ODM	OEM, ODM
Average Lead Time	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays
Product Attributes
Specification	Metal Coating: Tin; Mode of Production: SMT; Layers: Multilayer; Base Material: FR-4; Customized: Customized; Condition: New;	Metal Coating: Tin; Mode of Production: SMT; Layers: Multilayer; Base Material: FR-6; Customized: Customized; Condition: New; PCBA-Testing: X-ray, Aoi; Type: Rigid Circuit Board; Processing Technology: Electrolytic Foil; Insulation Materials: Organic Resin; Flame Retardant Properties: V0;	Metal Coating: Tin; Mode of Production: SMT; Layers: Multilayer; Base Material: FR-6; Customized: Customized; Condition: New; PCBA-Testing: X-ray, Aoi; Type: Rigid Circuit Board; Processing Technology: Electrolytic Foil; Insulation Materials: Organic Resin; Flame Retardant Properties: V0;	Metal Coating: Tin; Mode of Production: SMT; Layers: Multilayer; Base Material: FR-6; Customized: Customized; Condition: New; PCBA-Testing: X-ray, Aoi; Type: Rigid Circuit Board; Processing Technology: Electrolytic Foil; Insulation Materials: Organic Resin; Flame Retardant Properties: V0;	Metal Coating: Tin; Mode of Production: SMT; Layers: Multilayer; Base Material: FR-6; Customized: Customized; Condition: New; PCBA-Testing: X-ray, Aoi; Type: Rigid Circuit Board; Processing Technology: Electrolytic Foil; Insulation Materials: Organic Resin; Flame Retardant Properties: V0;
Supplier Name	Shenzhen Hemeixin Electronic Co., Limited	Shenzhen Zhendatech Co., Ltd.	Shenzhen Zhendatech Co., Ltd.	Shenzhen Zhendatech Co., Ltd.	Shenzhen Zhendatech Co., Ltd.
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