Advanced PCBA Services for IoT Gateway Devices with Gold Finger Connectors Integrated Circuit

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$0.30-2.00 / Piece

Sepcifications

  • Metal Coating Copper
  • Mode of Production DIP
  • Layers Multilayer
  • Base Material FR-4
  • Certification RoHS, ISO
  • Customized Customized
  • Condition New
  • Transport Package Box
  • Trademark hemeixin
  • Origin China
  • Type Rigid Circuit Board
  • Dielectric Fr-4
  • Material Fiberglass Epoxy
  • Application Consumer Electronics
  • Flame Retardant Properties V0
  • Mechanical Rigid Rigid
  • Insulation Materials Epoxy Resin
  • Processing Technology Immersion Gold
  • Copper Thickness 3oz -105oz
  • Surface Finish Gold Finger
  • Special Technology Metal Edging
  • Special 1 Blind Hole
  • Special 2 Buried Vias
  • Special 3 Flex-Rigid PCB
  • Surface Finish 1 Immersion Gold Immersion Tin Hal Lead Free

Product Description

Product Description This PCB are 6mm thickness Metal edging Copper thickness is 8oz Our advantages 1)Thickness copper PCB Max Single side PCB copper thickness is 8.0mm/0.035=228oz (Quantity produces) Max Double side pcb copper thickness is 3.0mm/0.035=85oz (Quantity produces) 2) ...

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PCB Assembly Comparison
Transaction Info
Price US $ 0.30-2.00/ Piece US $ 5.00-16.00/ Piece US $ 5.00-16.00/ Piece US $ 5.00-16.00/ Piece US $ 4.12-7.02/ Piece
Min Order 1 Pieces 5 Pieces 5 Pieces 5 Pieces 10 Pieces
Payment Terms L/C, T/T, Western Union L/C, T/T, D/P, Western Union, Paypal, Money Gram L/C, T/T, D/P, Western Union, Paypal, Money Gram L/C, T/T, D/P, Western Union, Paypal, Money Gram L/C, T/T, D/P, Paypal
Quality Control
Product Certification RoHS, ISO RoHS RoHS RoHS RoHS, ISO
Management System Certification ISO 9001, ISO 9000, ISO 14001 ISO 9001, IATF16949 ISO 9001, IATF16949 ISO 9001, IATF16949 ISO 9001, BSCI
Trade Capacity
Export Markets South America, Eastern Europe, Southeast Asia, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue US$50 Million - US$100 Million US$2.5 Million - US$5 Million US$2.5 Million - US$5 Million US$2.5 Million - US$5 Million US$2.5 Million - US$5 Million
Business Model OEM, ODM OEM, ODM OEM, ODM OEM, ODM OEM, ODM
Average Lead Time Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Product Attributes
Specification
Metal Coating: Copper;
Mode of Production: DIP;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Type: Rigid Circuit Board;
Dielectric: Fr-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Insulation Materials: Epoxy Resin;
Processing Technology: Immersion Gold;
Copper Thickness: 3oz -105oz;
Surface Finish: Gold Finger;
Special Technology: Metal Edging;
Special 1: Blind Hole;
Special 2: Buried Vias;
Special 3: Flex-Rigid PCB;
Surface Finish 1: Immersion Gold Immersion Tin Hal Lead Free;
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: Used;
PCBA-Testing: X-ray, Aoi;
Type: Rigid Circuit Board;
Processing Technology: Electrolytic Foil;
Insulation Materials: Organic Resin;
Flame Retardant Properties: V0;
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: Used;
PCBA-Testing: X-ray, Aoi;
Type: Rigid Circuit Board;
Processing Technology: Electrolytic Foil;
Insulation Materials: Organic Resin;
Flame Retardant Properties: V0;
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: Used;
PCBA-Testing: X-ray, Aoi;
Type: Rigid Circuit Board;
Processing Technology: Electrolytic Foil;
Insulation Materials: Organic Resin;
Flame Retardant Properties: V0;
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Overcharge Protection: Yes;
Ovediscahrge Protection: Yes;
Over Current Protection: Yes;
Balance Function: Yes;
Usage: Lithium Battery Packs, LiFePO4 etc;
Application: Digital,Lighting, Wheel Chair, E-Bike, RC Toys;
Delivery Time: 7-15 Days After Payment for Small Order;
Supplier Name

Shenzhen Hemeixin Electronic Co., Limited

Gold Member Audited Supplier

Shenzhen Jia Cheng Electric Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Jia Cheng Electric Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Jia Cheng Electric Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Li-ion Battery Bodyguard Technology Co., Limited

Diamond Member Audited Supplier