Bom List with Components Printed Circuit Board PCBA Manufacturing with Competitive Price for Electronics

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$6.00 / Piece

Sepcifications

  • Metal Coating Tin
  • Mode of Production SMT
  • Layers Multilayer
  • Base Material FR-4
  • Certification RoHS, ISO
  • Customized Customized
  • Condition New
  • Transport Package Box
  • Trademark hemeixin
  • Origin China

Product Description

Product Description Detailed Photos Our advantages Thickness copper PCB Max Single side copper thickness is 8.0mm/0.035=228oz (Quantity produces) Max Double side copper thickness is 3.0mm/0.035=85oz (Quantity produces) This Produces are 3mm thickness and Copper is also 3mm 3mm=105OZ ...

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PCB Assembly Comparison
Transaction Info
Price US $ 6/ Piece Negotiable US $ 1.00-100.00/ Piece US $ 1.00-100.00/ Piece Negotiable
Min Order 1 Pieces 1 Pieces 1 Pieces 1 Pieces 1 Pieces
Payment Terms L/C, T/T, Western Union T/T, Western Union, Paypal, Money Gram L/C, T/T, Western Union, Paypal, Money Gram L/C, T/T, Western Union, Paypal, Money Gram T/T, Western Union, Paypal, Money Gram
Quality Control
Product Certification RoHS, ISO RoHS, CCC RoHS, CCC, ISO RoHS, CCC, ISO RoHS, CCC
Management System Certification ISO 9001, ISO 9000, ISO 14001 ISO 9001 ISO 9001, IATF16949, QC 080000 ISO 9001, IATF16949, QC 080000 ISO 9001
Trade Capacity
Export Markets South America, Eastern Europe, Southeast Asia, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue US$50 Million - US$100 Million - US$10 Million - US$50 Million US$10 Million - US$50 Million -
Business Model OEM, ODM - OEM, ODM OEM, ODM -
Average Lead Time Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Product Attributes
Specification
Metal Coating: Tin;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Metal Coating: Tin;
Mode of Production: SMT;
Layers: Single-Layer;
Customized: Non-Customized;
Condition: New;
Processor: Broadcom Bcm2711;
Memory: 4GB;
Connectivity: 2.4 GHz and 5.0 GHz IEEE 802.11b/G/N/AC Wireless L;
Coo: UK;
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: Used;
Functional Testing: Spi, X-ray, Aoi, Ict, Fct, RoHS and Aging;
Type: Rigid Circuit Board;
PCBA Min. IC Pitch: 0.30mm(12mil);
Processing Technology: Electrolytic Foil;
Insulation Materials: Organic Resin;
BGA Minimum Dia: 01015;
PCBA Foot Pin: So, Sop, Soj, Tsop, Tssop, Qfp, BGA and U-BGA;
Small Order: Acceptable;
IP Protection: Strong Believe in IP Protection with Proven Record;
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: Used;
Functional Testing: Spi, X-ray, Aoi, Ict, Fct, RoHS and Aging;
Type: Rigid Circuit Board;
PCBA Min. IC Pitch: 0.30mm(12mil);
Processing Technology: Electrolytic Foil;
Insulation Materials: Organic Resin;
BGA Minimum Dia: 01015;
PCBA Foot Pin: So, Sop, Soj, Tsop, Tssop, Qfp, BGA and U-BGA;
Small Order: Acceptable;
IP Protection: Strong Believe in IP Protection with Proven Record;
Metal Coating: Tin;
Mode of Production: SMT;
Layers: Single-Layer;
Base Material: PCB;
Customized: Non-Customized;
Condition: New;
Form Factor: 55mm * 40mm;
Processor: Broadcom Bcm2711;
Input Power: DC 5V;
Operating Temperature: 0 ~ 80ºC;
Supplier Name

Shenzhen Hemeixin Electronic Co., Limited

Gold Member Audited Supplier

CENTURY SOLUTIONS LIMITED

Gold Member Audited Supplier

Shenzhen Zhendatech Co., Ltd.

Gold Member Audited Supplier

Shenzhen Zhendatech Co., Ltd.

Gold Member Audited Supplier

CENTURY SOLUTIONS LIMITED

Gold Member Audited Supplier