High-Density Interconnect PCB Assembly and PCB for Data Centers pictures & photos

High-Density Interconnect PCB Assembly and PCB for Data Centers

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Price

Min. Order Reference FOB Price

1 Piece US$0.10-1.00 / Piece

Sepcifications

Type Rigid Circuit Board
Dielectric FR-4
Material Fiberglass Epoxy
Application Consumer Electronics
Flame Retardant Properties V0
Mechanical Rigid Rigid
Processing Technology Immersion Gold
Base Material Fr4
Insulation Materials Epoxy Resin
Transport Package Box
Trademark hemeixin
Origin China
Copper Thickness 3oz -105oz
Surface Finish Gold Finger
Special Teck Metal Edging
Special 1 Blind Hole
Special 2 Buried Vias
Special 3 Flex-Rigid PCB

Product Description

Product Description This PCB are 6mm thickness Metal edging Copper thickness is 8oz Our advantages 1)Thickness copper PCB Max Single side PCB copper thickness is 8.0mm/0.035=228oz (Quantity produces) Max Double side pcb copper thickness is 3.0mm/0.035=85oz (Quantity produces) 2) ...

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Shenzhen Hemeixin Electronic Co., Limited

Gold Member Since 2024

Audited Supplier

Rating & Reviews: 5.0/5.0

(1 Reviews)

Business Type Manufacturer/Factory
Main Products PCB, All Kinds Cables, PCBA, Electronic Components, Relay, IC Chips, Sensors, Connectors
Registered Capital 1000000 RMB
Plant Area >2000 square meters
Management System Certification ISO 9001, ISO 9000, ISO 14001
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays

PCB Assembly Comparison

	High-Density Interconnect PCB Assembly and PCB for Data Centers Contact Now	Multilayer PCB High Quality 4 Layer PCB Black PCB Contact Now	Multilayer PCB 4 Layer Circuit Board 2.0mm PCB Circuits Contact Now	Multilayer PCB Board 4 Layer 1.6mm Thick White Solder Mask Contact Now	Quick View Rogers PCB Tmm4 Printed Circuit Board with Immersion Gold Contact Now

Transaction Info
	High-Density Interconnect PCB Assembly and PCB for Data Centers Contact Now	Multilayer PCB High Quality 4 Layer PCB Black PCB Contact Now	Multilayer PCB 4 Layer Circuit Board 2.0mm PCB Circuits Contact Now	Multilayer PCB Board 4 Layer 1.6mm Thick White Solder Mask Contact Now	Quick View Rogers PCB Tmm4 Printed Circuit Board with Immersion Gold Contact Now
Price	US $ 0.10-1.00/ Piece	US $ 1.55/ Piece	US $ 2.13/ Piece	US $ 2.16/ Piece	US $ 2.05/ Piece
Min Order	1 Pieces	1 Pieces	1 Pieces	1 Pieces	1 Pieces
Payment Terms	L/C, T/T, Western Union	T/T, Western Union, Paypal	T/T, Western Union, Paypal	T/T, Western Union, Paypal	T/T, Western Union, Paypal
Quality Control
Management System Certification	ISO 9001, ISO 9000, ISO 14001	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 14001, IATF16949
Trade Capacity
Export Markets	South America, Eastern Europe, Southeast Asia, Mid East, Eastern Asia, Western Europe	North America, Eastern Europe, Southeast Asia, Africa, Oceania, Western Europe	North America, Eastern Europe, Southeast Asia, Africa, Oceania, Western Europe	North America, Eastern Europe, Southeast Asia, Africa, Oceania, Western Europe	North America, Eastern Europe, Southeast Asia, Africa, Oceania, Western Europe
Annual Export Revenue	US$50 Million - US$100 Million	US$10 Million - US$50 Million	US$10 Million - US$50 Million	US$10 Million - US$50 Million	US$10 Million - US$50 Million
Business Model	OEM, ODM	OEM, Own Brand(Bicheng)	OEM, Own Brand(Bicheng)	OEM, Own Brand(Bicheng)	OEM, Own Brand(Bicheng)
Average Lead Time	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays
Product Attributes
Specification	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Immersion Gold; Base Material: Fr4; Insulation Materials: Epoxy Resin; Copper Thickness: 3oz -105oz; Surface Finish: Gold Finger; Special Teck: Metal Edging; Special 1: Blind Hole; Special 2: Buried Vias; Special 3: Flex-Rigid PCB;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Modem WiFi; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Enig; Base Material: Copper Clad Laminate; Insulation Materials: Epoxy Resin; Brand: Bicheng;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Wireless Signal Booster; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Enig; Base Material: Copper Clad Laminate; Insulation Materials: Epoxy Resin; Brand: Bicheng;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Security Equipment; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: HASL Lf; Base Material: Copper Clad Laminate; Insulation Materials: Epoxy Resin; Brand: Bicheng;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Hydrocarbon/Ceramic; Application: Dielectric Polarizers and Lenses; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: HASL; Base Material: Tmm4; Insulation Materials: Glass Reinforced Hydrocarbon; Brand: Rogers; Surface Finish: Bare Copper, HASL, Enig, Immersion Tin, Immersion; Solder Mask Color: Green, Black, Blue, Yellow, Red etc; Copper Weight: 1oz (35µm), 2oz (70µm); Service Area: Worldwide, Globally;
Supplier Name	Shenzhen Hemeixin Electronic Co., Limited	Shenzhen Bicheng Electronic Technology Co., Ltd	Shenzhen Bicheng Electronic Technology Co., Ltd	Shenzhen Bicheng Electronic Technology Co., Ltd	Shenzhen Bicheng Electronic Technology Co., Ltd
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