Die Bonder

US$100,000.00-1,000,000.00 / Piece

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What is Automatic Die Bonder Equipped with Fully Automatic Feeding and Discharging Magazine Processing System

Name: Automatic Die Bonder Equipped with Fully Automatic Feeding and Discharging Magazine Processing System
Uploaded: 2025-02-25T15:16:19+08:00
Description: Product Description DA1201 IC Linear High Precision Die Attach Wafer size: 6"- 12"; Dual dispensing system; High-precision linear driven bond head; Support DAF function; Multifunction work table, su

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Price

Min. Order Reference FOB Price

1 Piece US$100,000.00-1,000,000.00 / Piece

Sepcifications

After-sales Service Provided
Condition New
Precision High Precision
Certification ISO
Warranty 12 Months
Automatic Grade Automatic
Transport Package Customized or Wooden Box Packaging
Specification Standard Specifications
Trademark Himalaya
Origin China
Product Name Semiconductor Equipment
Feature 1 Guaranteed Quality
Feature 2 Customized According to Needs
After-Sale Service Provided

Product Description

Product Description DA1201 IC Linear High Precision Die Attach Wafer size: 6"- 12"; Dual dispensing system; High-precision linear driven bond head; Support DAF function; Multifunction work table, suitable for different kinds of lead frames &substrates; High-precision wafer table with ...

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Jiangsu Himalaya Semiconductor Co., Ltd.

Diamond Member Since 2023

Audited Supplier

Business Type Trading Company
Main Products Die Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment
Number of Employees 11
Year of Establishment 2019-09-12
Management System Certification ISO 9001
Average Lead Time Peak Season Lead Time: 3-6 months
Off Season Lead Time: 1-3 months

Die Bonder Comparison

	Automatic Die Bonder Equipped with Fully Automatic Feeding and Discharging Magazine Processing System Contact Now	Quick View Neoden N10p 8 Head SMT Pick and Place PCB Assembly Machine Servo Contact Now	Quick View Neoden High Accuracy SMT Production Line 6 Head PCB Machine SMT Chip Mounter Contact Now	Quick View Neoden Yy1 Pick and Place SMD Machine SMT Assembly Machine for Low Budget Contact Now	Quick View Automatic SMT Pick and Place Machine Lx-8 Chip Mounter Shooter Contact Now

Transaction Info
	Automatic Die Bonder Equipped with Fully Automatic Feeding and Discharging Magazine Processing System Contact Now	Quick View Neoden N10p 8 Head SMT Pick and Place PCB Assembly Machine Servo Contact Now	Quick View Neoden High Accuracy SMT Production Line 6 Head PCB Machine SMT Chip Mounter Contact Now	Quick View Neoden Yy1 Pick and Place SMD Machine SMT Assembly Machine for Low Budget Contact Now	Quick View Automatic SMT Pick and Place Machine Lx-8 Chip Mounter Shooter Contact Now
Price	US $ 100,000.00-1,000,000.00/ Piece	US $ 19999/ Set	US $ 13999/ Piece	US $ 2899/ Set	US $ 140,000.00-160,000.00/ Piece
Min Order	1 Pieces	1 Sets	1 Pieces	1 Sets	1 Pieces
Payment Terms	T/T	T/T, Western Union, Paypal	L/C, T/T, Paypal	T/T, Western Union, Paypal	L/C, T/T, D/P, Western Union, Paypal, Money Gram
Quality Control
Product Certification	ISO	CE	ISO	CE	ISO
Management System Certification	ISO 9001	ISO 9001, ISO 9000, ISO 20000, ISO 14064, QC 080000	ISO 9001, ISO 9000, ISO 20000, ISO 14064, QC 080000	ISO 9001, ISO 9000, ISO 20000, ISO 14064, QC 080000	ISO 9001
Trade Capacity
Export Markets	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	-
Annual Export Revenue	Above US$100 Million	US$5 Million - US$10 Million	US$5 Million - US$10 Million	US$5 Million - US$10 Million	-
Business Model	-	ODM, Own Brand(NeoDen)	ODM, Own Brand(NeoDen)	ODM, Own Brand(NeoDen)	-
Average Lead Time	Off Season Lead Time: 1-3 months Peak Season Lead Time: 1-3 months	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	-
Product Attributes
Specification	After-sales Service: Provided; Condition: New; Precision: High Precision; Warranty: 12 Months; Automatic Grade: Automatic; Product Name: Semiconductor Equipment; Feature 1: Guaranteed Quality; Feature 2: Customized According to Needs; After-Sale Service: Provided;	After-sales Service: 2 Years Warranty; Condition: New; Speed: High Speed; Precision: High Precision; Warranty: 24 Months; Automatic Grade: Automatic; Type: High-speed Chip Mounter; Head Qty: 8; Tape Feeder Qty: 80PCS(33 Front+47 Rear); Nozzle Automatic Change Slots: 39; Component Range: 0201, 0402, BGA, Sop, Qfn, Tqfp,; Max. PCB Size(with 1 IC Tray Holder): 395mm1500mm;* Max. PCB Size (Without IC Tray Holder): 450mm1500mm;* Accuracy: 0.01mm; PCB Thickness: 0.2mm-3.5mm; Air Supply: 0.6MPa-0.8MPa; Flow Rate: 37L/Min; Push up Table: Optional; Power: 600W; Xy Drive Type: Won Linear Guide/THK Grinding Screw C5-2040; Xy Drive Motor: Panasonic A6 750W Servo Motor;	After-sales Service: 2 Years; Condition: New; Speed: High Speed; Precision: High Precision; Warranty: 24 Months; Automatic Grade: Automatic; Type: High-speed Chip Mounter; Model: Neoden9; Max Speed: 1,4000cph; Average Speed: 9000cph for Drive Board; Nozzle Head: 6; Vision: Flying Vision System; Feeder Qty: 53PCS (If 8mm); Packing Size: 12419031562mm; Smallest Component: Imperial 0201; Max PCB Width: 300mm; Max PCB Length: 800mm;	After-sales Service: 2 Years Warranty; Condition: New; Speed: Medium Speed; Precision: High Precision; Warranty: 24 Months; Automatic Grade: Automatic; Type: Medium-speed Chip Mounter; Head Qty: 2; Feeder Qty: 52 (All 8mm); Nozzle Change Capacity: 3 Nozzle Slots; Placement Rate: 3,000cph (Vision on)-4,000cph (Vision off); Component Range: 0201, 0402, BGA, Qfn, Tqfp, Fpga; Max. PCB Size: 249X350mm(with 2 Sides Tape Feeders)); Alignment: Vision & Vacuum; Accuracy: +-0.02mm; Power: 50W; Air Supply: >0.6MPa; Max Component Height: 12mm; Z-Axis Max Movement Range: 28mm; Control System: One-Board Integration; Weight: 47kgs(Plywood Case); Packing Size: 700(L)X610(W)X620(H)mm;	After-sales Service: One Year Warranty; Condition: New; Speed: High Speed; Precision: High Precision; Warranty: 12 Months; Automatic Grade: Semiautomatic; Type: High-speed Chip Mounter; Identification System: Pattern Recognition Camera (Field of View 54mm); Check Function: Coplanar Detection Function; Power Source: AC200V-AC415V; Weight: 2400kg;
Supplier Name	Jiangsu Himalaya Semiconductor Co., Ltd.	Zhejiang NeoDen Technology Co., Ltd.	Zhejiang NeoDen Technology Co., Ltd.	Zhejiang NeoDen Technology Co., Ltd.	Shenzhen Eastson Electronic Technology Co., Ltd.
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