High-Precision Die Bonder Integrated Multi-Functional Patch Solidifying Machine

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece Negotiable

Sepcifications

  • After-sales Service Provided
  • Condition New
  • Speed High Speed
  • Precision High Precision
  • Certification RoHS, ISO, CE
  • Warranty 12 Months
  • Automatic Grade Automatic
  • Transport Package Customized or Wooden Box Packaging
  • Specification Standard Specifications
  • Trademark Himalaya
  • Origin China
  • Product Name Semiconductor Equipment
  • Feature 1 High Precision
  • Feature 2 High Efficiency
  • After-Sale Service Provided

Product Description

High-Precision Die Bonder Integrated Multi-Functional Patch Solidifying Machine Product Description Equipment Specifications DIE BONDER SHD8120S Loading method Wafer stacking and tray Frame size L:110-300mm W:12-100mm H:0.1-1mm Chip size 0.5X0.5-14X14mm Wafer ...

Learn More

Die Bonder Comparison
Transaction Info
Price Negotiable Negotiable US $ 19,999.00-21,999.00/ Piece US $ 9,999.00-9,999,999.00/ Piece US $ 100.00-120.00/ Piece
Min Order 1 Pieces 1 Pieces 1 Pieces 1 Pieces 1 Pieces
Payment Terms T/T T/T, Western Union, Paypal L/C, T/T L/C, T/T, D/P, Western Union, Paypal, Money Gram L/C, T/T, D/P, Western Union, Paypal, Money Gram
Quality Control
Product Certification RoHS, ISO, CE - ISO, CE CE CCC, PSE, FDA, RoHS, ISO, CE
Management System Certification ISO 9001 ISO 9001, ISO 9000, ISO 14001 ISO 9001, ISO 14001 - BSCI, ASME
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe - North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe -
Annual Export Revenue Above US$100 Million US$1 Million - US$2.5 Million US$2.5 Million - US$5 Million US$1 Million - US$2.5 Million US$2.5 Million - US$5 Million
Business Model - OEM Own Brand(TORCH) Own Brand(minder-hightech) -
Average Lead Time Off Season Lead Time: 1-3 months
Peak Season Lead Time: 1-3 months
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
- Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
-
Product Attributes
Specification
After-sales Service: Provided;
Condition: New;
Speed: High Speed;
Precision: High Precision;
Warranty: 12 Months;
Automatic Grade: Automatic;
Product Name: Semiconductor Equipment;
Feature 1: High Precision;
Feature 2: High Efficiency;
After-Sale Service: Provided;
Condition: New;
Automatic Grade: Automatic;
After-sales Service: All Life;
Condition: New;
Speed: High Speed;
Precision: High Precision;
Warranty: 18 Months;
Automatic Grade: Automatic;
Type: High-speed Chip Mounter;
Accuracy: 0.05mm;
Max PCB Size: 400*350mm;
Placing Speed: 3500cph;
Max Printing Size: 400*350mm;
Max Moving Range: 400*630mm;
Z Axis Max Moving Range: 70mm;
Typical Mounting Speed: 2000-2800cph;
Power Supply: 220V, 50Hz, 3kw;
Mounting Accuracy: +/-0.05mm;
Weight: 310kg;
After-sales Service: 1 Year;
Condition: New;
Speed: High Speed;
Precision: Precision;
Warranty: 12 Months;
Automatic Grade: Automatic;
After-sales Service: Video Technical Support;
Condition: New;
Speed: High Speed;
Precision: High Precision;
Warranty: 6 Months;
Automatic Grade: Automatic;
Type: High-speed Chip Mounter;
Delivery: 1-7 Days;
MOQ: 1 PC;
Quality: 100% Tested;
Adaptation: SMT Placement Machine;
Inventory: Availability;
Supplier Name

Jiangsu Himalaya Semiconductor Co., Ltd.

Diamond Member Audited Supplier

SMT PARTS SUPPLY LTD

Gold Member Audited Supplier

Termway (Beijing) Precision Technology Co., Ltd.

Diamond Member Audited Supplier

Guangzhou Minder-Hightech co.,Ltd

Diamond Member Audited Supplier

Guangdong Xinling Industrial Co., Ltd

Diamond Member Audited Supplier