Wafer Die Bonder Dispenser Machine with Intelligent Dispensing Control System to Realize Precision Glue Volume Control

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$100,000.00-1,000,000.00 / Piece

Sepcifications

  • After-sales Service Provided
  • Condition New
  • Speed High Speed
  • Precision High Precision
  • Certification ISO
  • Warranty 12 Months
  • Automatic Grade Automatic
  • Transport Package Customized or Wooden Box Packaging
  • Specification Standard Specifications
  • Trademark Himalaya
  • Origin China
  • Product Name Semiconductor Equipment
  • Feature 1 Guaranteed Quality
  • Feature 2 Customized According to Needs
  • After-Sale Service Provided

Product Description

Product Description DA801 IC Linear High-speed Die Attach Wafer size: 6"- 8"; Dual dispensing system; High-precision linear driven bond head; Support DAF function; Multifunction work table, suitable for different kinds of lead frames &substrates; High-precision wafer table with highly ...

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Die Bonder Comparison
Transaction Info
Price US $ 100,000.00-1,000,000.00/ Piece US $ 24.00-30.00/ Piece US $ 14.00-20.00/ Piece US $ 500.00-800.00/ Piece US $ 563.00-633.00/ Piece
Min Order 1 Pieces 1 Pieces 1 Pieces 1 Pieces 1 Pieces
Payment Terms T/T T/T, D/P, Western Union, Paypal, Money Gram L/C, T/T, D/P, Western Union, Paypal, Money Gram L/C, T/T, D/P, Western Union, Paypal, Money Gram T/T, D/P, Western Union, Paypal, Money Gram
Quality Control
Product Certification ISO CCC, PSE, ISO, CE CCC, PSE, ISO, CE CCC, PSE, FDA, RoHS, ISO, CE CCC, PSE, ISO, CE
Management System Certification ISO 9001 ISO 9001, ISO 9000 ISO 9001, ISO 9000 BSCI, ASME ISO 9001, ISO 9000
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe - - - -
Annual Export Revenue Above US$100 Million US$2.5 Million - US$5 Million US$2.5 Million - US$5 Million US$2.5 Million - US$5 Million US$2.5 Million - US$5 Million
Business Model - ODM ODM - ODM
Average Lead Time Off Season Lead Time: 1-3 months
Peak Season Lead Time: 1-3 months
- - - -
Product Attributes
Specification
After-sales Service: Provided;
Condition: New;
Speed: High Speed;
Precision: High Precision;
Warranty: 12 Months;
Automatic Grade: Automatic;
Product Name: Semiconductor Equipment;
Feature 1: Guaranteed Quality;
Feature 2: Customized According to Needs;
After-Sale Service: Provided;
After-sales Service: Technical Support;
Condition: New;
Speed: High Speed;
Precision: High Precision;
Warranty: 6 Months;
Automatic Grade: Automatic;
Type: High-speed Chip Mounter;
Quality: 100% Tested;
Express: DHL/TNT/FedEx/UPS;
Delivery: by Air/Sea/Land;
Lead Time: 3 Days;
After-sales Service: Technical Support;
Condition: New;
Speed: High Speed;
Precision: High Precision;
Warranty: 6 Months;
Automatic Grade: Automatic;
Type: High-speed Chip Mounter;
Delivery: DHL,UPS ,FedEx or Other;
Lead Time: Within 3 Days;
After-sales Service: Video Technical Support;
Condition: New;
Speed: High Speed;
Precision: High Precision;
Warranty: 6 Months;
Automatic Grade: Automatic;
Type: High-speed Chip Mounter;
Delivery: 1-7 Days;
MOQ: 1 Set;
Quality: 100% Tested;
Adaptation: Laser Machine;
Inventory: Availability;
After-sales Service: Technical Support;
Condition: New;
Speed: High Speed;
Precision: High Precision;
Warranty: 12 Months;
Automatic Grade: Automatic;
Type: High-speed Chip Mounter;
Quality: 100% Tested;
Express: UPS/DHL/TNT/FedEx;
Delivery: by Air/Sea/Land;
Lead Time: 3 Days;
Supplier Name

Jiangsu Himalaya Semiconductor Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Wenzhan Electronic Technology Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Wenzhan Electronic Technology Co., Ltd.

Diamond Member Audited Supplier

Guangdong Xinling Industrial Co., Ltd

Diamond Member Audited Supplier

Shenzhen Wenzhan Electronic Technology Co., Ltd.

Diamond Member Audited Supplier