Integrated Multi-Functional Patch Solidifying Machine/Die Bonder Chip Bonding Machine pictures & photos

Integrated Multi-Functional Patch Solidifying Machine/Die Bonder Chip Bonding Machine

Contact Now

Get Latest Price

About this Item

Price

Min. Order Reference FOB Price

1 Piece US$100,000.00-1,000,000.00 / Piece

Sepcifications

After-sales Service Provided
Condition New
Speed High Speed
Precision High Precision
Certification ISO
Warranty 12 Months
Automatic Grade Automatic
Transport Package Customized or Wooden Box Packaging
Specification Standard Specifications
Trademark Himalaya
Origin China
Product Name Semiconductor Equipment
Feature 1 Guaranteed Quality
Feature 2 Customized According to Needs
After-Sale Service Provided

Product Description

Product Description Clip Bonder High-speed Clip Bonding System placement accuracy: ±50µm @3σ, theta placement accuracy: ±3°@3σ; Up to 20Clips / Cycle; Prebond &Posbond function; Solder patch &solder paste inspection function; High precision linear ...

Learn More

Jiangsu Himalaya Semiconductor Co., Ltd.

Diamond Member Since 2023

Audited Supplier

Business Type Trading Company
Main Products Die Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment
Number of Employees 11
Year of Establishment 2019-09-12
Management System Certification ISO 9001
Average Lead Time Peak Season Lead Time: 3-6 months
Off Season Lead Time: 1-3 months

Die Bonder Comparison

	Integrated Multi-Functional Patch Solidifying Machine/Die Bonder Chip Bonding Machine Contact Now	Quick View Electronic Components Pick and Place Machine LED Production Machine Assembly SMT Assembly Pick and Place Contact Now	Quick View Electronic Components Making Wtih 48 Feeders and 4 Heads SMD Pick and Place Machine Contact Now	Quick View 2-Mount-Head Low Cost Pick and Place Machine for Electronic Engineering Contact Now	Quick View SMD SMT High Precision Pick and Place Machine PCB Mounting Machine Contact Now

Transaction Info
	Integrated Multi-Functional Patch Solidifying Machine/Die Bonder Chip Bonding Machine Contact Now	Quick View Electronic Components Pick and Place Machine LED Production Machine Assembly SMT Assembly Pick and Place Contact Now	Quick View Electronic Components Making Wtih 48 Feeders and 4 Heads SMD Pick and Place Machine Contact Now	Quick View 2-Mount-Head Low Cost Pick and Place Machine for Electronic Engineering Contact Now	Quick View SMD SMT High Precision Pick and Place Machine PCB Mounting Machine Contact Now
Price	US $ 100,000.00-1,000,000.00/ Piece	US $ 14999/ Piece	US $ 6,499.00-7,499.00/ Set	US $ 2899/ Piece	US $ 7499/ Piece
Min Order	1 Pieces	1 Pieces	1 Sets	1 Pieces	1 Pieces
Payment Terms	T/T	L/C, T/T, Paypal	T/T, Paypal, Money Gram	T/T, Western Union, Paypal	T/T, Paypal
Quality Control
Product Certification	ISO	ISO, CE	CE	CE	ISO, CE
Management System Certification	ISO 9001	ISO 9001, ISO 9000, ISO 20000, ISO 14064, QC 080000	ISO 9001, ISO 9000, ISO 20000, ISO 14064, QC 080000	ISO 9001, ISO 9000, ISO 20000, ISO 14064, QC 080000	ISO 9001, ISO 9000, ISO 20000, ISO 14064, QC 080000
Trade Capacity
Export Markets	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue	Above US$100 Million	US$5 Million - US$10 Million	US$5 Million - US$10 Million	US$5 Million - US$10 Million	US$5 Million - US$10 Million
Business Model	-	ODM, Own Brand(NeoDen)	ODM, Own Brand(NeoDen)	ODM, Own Brand(NeoDen)	ODM, Own Brand(NeoDen)
Average Lead Time	Off Season Lead Time: 1-3 months Peak Season Lead Time: 1-3 months	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays
Product Attributes
Specification	After-sales Service: Provided; Condition: New; Speed: High Speed; Precision: High Precision; Warranty: 12 Months; Automatic Grade: Automatic; Product Name: Semiconductor Equipment; Feature 1: Guaranteed Quality; Feature 2: Customized According to Needs; After-Sale Service: Provided;	After-sales Service: Two Years of Online After-Sales Service; Condition: New; Speed: High Speed; Precision: High Precision; Warranty: 24 Months; Automatic Grade: Automatic; Type: High-speed Chip Mounter; Model: Neoden K1830; Max Speed: 16,000cph for LED Assembly; Average Speed: 8500cph for Drive Board; Nozzle Head: 8; Vision: Flying Vision System; Feeder Qty: 66PCS (If 8mm/ 12mm); Packing Size: 142122166.5cm; Smallest Component: Imperial 0201; Max IC: 4040mm;*	After-sales Service: Two Years of Online After-Sales Service; Condition: New; Precision: Precision; Warranty: 24 Months; Automatic Grade: Automatic; Placement Head Qty: 4PCS; Tape Reel Feeders Qty: 48, If All Are 8mm Feeders; Applicable Components: 0201,LED; Max Height: 5mm; Support Tube Packed IC Feeder: 5; Tray IC Feeder Qty: 5; Placement Area: 310X400mm Without Tray, 140X400 with 1 Waffle; Power Supply: 110/220V, 50Hz, 180W; Tape Width: 8/12/16/24mm; Packing Size: 94X74X60cm;	After-sales Service: Spares, Warranty and Life-Long Customers Service; Condition: New; Speed: Medium Speed; Precision: High Precision; Warranty: 24 Months; Automatic Grade: Automatic; Type: Medium-speed Chip Mounter; Application: SMT Assembly; Nozzle-Head Qty: 2; Nozzle Changer: Yes; Vibration Feeder: Yes; Support: Reel Tape, Bulk Components, IC, LED, 0201; Displace: 3; Smallest Size: 0201; Largest Size: 18X 18mm; Max Height: 12mm, Support Big Cap; PCB Size Max.: (249-315)Mmx 350mm; Power: 50W; N.W.: 35.5kgs;	After-sales Service: Two Years of Online After-Sales Service; Condition: New; Speed: High Speed; Precision: High Precision; Warranty: 24 Months; Automatic Grade: Automatic; Pick Nozzle Qty: 4; Tape Reel Feeder Qty: 48 (on Condition All Are 8mm Feeders); Vibrating Feeder Qty: 5; Tray IC Capacity: 5; Component Size with Vision: 0201 The Smallest; Placement Speed: 5000cph/H with Vision; Components' Height: 5mm; Positioning Accuracy: +/-0.02mm; PCB Area: 310X1500mm with Internal Rails; Placement Area: 140X1500mm with 1 Waffle Tray;
Supplier Name	Jiangsu Himalaya Semiconductor Co., Ltd.	Zhejiang NeoDen Technology Co., Ltd.	Zhejiang NeoDen Technology Co., Ltd.	Zhejiang NeoDen Technology Co., Ltd.	Zhejiang NeoDen Technology Co., Ltd.
Select All

Contact Now

Hot Search