Die Bonder

US$100,000.00-1,000,000.00 / Piece

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What is Highly Automated IC Chip Packaging Die Bonder Machine Customized Based on Customer Requirements

Name: Highly Automated IC Chip Packaging Die Bonder Machine Customized Based on Customer Requirements
Uploaded: 2025-02-25T15:16:06+08:00
Description: Product Description DA1201FC Flip Chip and Die Attach X/Y placement accuracy: Flip-chip/high-precision die attach mode: ±10-15μm@3σ; Die attach mode: ±10-25μm@3σ; Spe

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About this Item

Price

Min. Order Reference FOB Price

1 Piece US$100,000.00-1,000,000.00 / Piece

Sepcifications

After-sales Service Provided
Condition New
Speed High Speed
Precision High Precision
Certification ISO
Warranty 12 Months
Automatic Grade Automatic
Transport Package Customized or Wooden Box Packaging
Specification Standard Specifications
Trademark Himalaya
Origin China
Product Name Semiconductor Equipment
Feature 1 Guaranteed Quality
Feature 2 Customized According to Needs
After-Sale Service Provided

Product Description

Product Description DA1201FC Flip Chip and Die Attach X/Y placement accuracy: Flip-chip/high-precision die attach mode: ±10-15μm@3σ; Die attach mode: ±10-25μm@3σ; Specially designed for flip chip devices with low pin count, DA1201FC provides a fully automatic ...

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Jiangsu Himalaya Semiconductor Co., Ltd.

Diamond Member Since 2023

Audited Supplier

Business Type Trading Company
Main Products Die Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment
Number of Employees 11
Year of Establishment 2019-09-12
Management System Certification ISO 9001
Average Lead Time Peak Season Lead Time: 3-6 months
Off Season Lead Time: 1-3 months

Die Bonder Comparison

	Highly Automated IC Chip Packaging Die Bonder Machine Customized Based on Customer Requirements Contact Now	Quick View High Precision SMD Juki Lx-8 Automated Pick and Place Machine Contact Now	Quick View 8 Head SMT Pick and Place Machine (NeoDenK1830) for PCB Assembly Machine Chip Mounter with 66 YAMAHA Cl Type Feeders Fly Vision Auto Rails BGA 0201 Qfn Contact Now	Quick View Achieves High-Efficiency Production Pick and Place Machine Contact Now	Quick View Component Height up to 25 mm SMT Pick and Place Machine Contact Now

Transaction Info
	Highly Automated IC Chip Packaging Die Bonder Machine Customized Based on Customer Requirements Contact Now	Quick View High Precision SMD Juki Lx-8 Automated Pick and Place Machine Contact Now	Quick View 8 Head SMT Pick and Place Machine (NeoDenK1830) for PCB Assembly Machine Chip Mounter with 66 YAMAHA Cl Type Feeders Fly Vision Auto Rails BGA 0201 Qfn Contact Now	Quick View Achieves High-Efficiency Production Pick and Place Machine Contact Now	Quick View Component Height up to 25 mm SMT Pick and Place Machine Contact Now
Price	US $ 100,000.00-1,000,000.00/ Piece	US $ 140,000.00-160,000.00/ Piece	US $ 14999/ Set	US $ 140,000.00-160,000.00/ Piece	US $ 140,000.00-160,000.00/ Piece
Min Order	1 Pieces	1 Pieces	1 Sets	1 Pieces	1 Pieces
Payment Terms	T/T	L/C, T/T, D/P, Western Union, Paypal, Money Gram	T/T, Western Union, Paypal	L/C, T/T, D/P, Western Union, Paypal, Money Gram	L/C, T/T, D/P, Western Union, Paypal, Money Gram
Quality Control
Product Certification	ISO	ISO	CE	ISO	ISO
Management System Certification	ISO 9001	ISO 9001	ISO 9001, ISO 9000, ISO 20000, ISO 14064, QC 080000	ISO 9001	ISO 9001
Trade Capacity
Export Markets	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	-	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	-	-
Annual Export Revenue	Above US$100 Million	-	US$5 Million - US$10 Million	-	-
Business Model	-	-	ODM, Own Brand(NeoDen)	-	-
Average Lead Time	Off Season Lead Time: 1-3 months Peak Season Lead Time: 1-3 months	-	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	-	-
Product Attributes
Specification	After-sales Service: Provided; Condition: New; Speed: High Speed; Precision: High Precision; Warranty: 12 Months; Automatic Grade: Automatic; Product Name: Semiconductor Equipment; Feature 1: Guaranteed Quality; Feature 2: Customized According to Needs; After-Sale Service: Provided;	After-sales Service: One Year Warranty; Condition: New; Speed: High Speed; Precision: High Precision; Warranty: 12 Months; Automatic Grade: Semiautomatic; Type: High-speed Chip Mounter; Identification System: Pattern Recognition Camera (Field of View 54mm); Check Function: Coplanar Detection Function; Power Source: AC200V-AC415V; Weight: 2400kg;	After-sales Service: 2 Years Warranty; Condition: New; Speed: High Speed; Precision: High Precision; Warranty: 24 Months; Automatic Grade: Automatic; Type: High-speed Chip Mounter; Head Qty: 8; Feeder Qty: 65; Component Range: 0201, 0402, BGA, Qfn, Tqfp; Max. PCB Size: 540300mm (Under Single Phase);* Accuracy: 0.01mm; Power: 500W; Air Supply: >0.6MPa;	After-sales Service: One Year Warranty; Condition: New; Speed: High Speed; Precision: High Precision; Warranty: 12 Months; Automatic Grade: Semiautomatic; Type: High-speed Chip Mounter; Identification System: Pattern Recognition Camera (Field of View 54mm); Check Function: Coplanar Detection Function; Power Source: AC200V-AC415V; Weight: 2400kg;	After-sales Service: One Year Warranty; Condition: New; Speed: High Speed; Precision: High Precision; Warranty: 12 Months; Automatic Grade: Semiautomatic; Type: High-speed Chip Mounter; Identification System: Pattern Recognition Camera (Field of View 54mm); Check Function: Coplanar Detection Function; Power Source: AC200V-AC415V; Weight: 2400kg;
Supplier Name	Jiangsu Himalaya Semiconductor Co., Ltd.	Shenzhen Eastson Electronic Technology Co., Ltd.	Zhejiang NeoDen Technology Co., Ltd.	Shenzhen Eastson Electronic Technology Co., Ltd.	Shenzhen Eastson Electronic Technology Co., Ltd.
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