Advanced Multilayer PCB Board Designed for Asic Performance Video

Name: Advanced Multilayer PCB Board Designed for Asic Performance
Uploaded: 2025-03-02T17:29:58+08:00
Description: Batch FR4 processing, PCB processing, fiberglass processing 1.6 mm plate thickness Shenzhen Hemilin Technology Co., Ltd. Was established on July 14, 2009, and is a professional circuit board R&D and

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Price

Min. Order Reference FOB Price

1 Square Meter US$0.11-9.90 / Square Meter

Sepcifications

Type Rigid Circuit Board
Dielectric FR-4
Material Fiberglass Epoxy
Application Aerospace
Flame Retardant Properties V0
Mechanical Rigid Rigid
Processing Technology Electrolytic Foil
Base Material Aluminum
Insulation Materials Organic Resin
Brand Hemeil
Transport Package Vacuum Packaging
Specification 20*20
Trademark hemeil
Origin Dongguan

Product Description

Batch FR4 processing, PCB processing, fiberglass processing 1.6 mm plate thickness Shenzhen Hemilin Technology Co., Ltd. Was established on July 14, 2009, and is a professional circuit board R&D and mass production enterprise, dedicated to the production of high-precision double-sided multi-layer ...

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Shenzhen Hemeilin Technology Co., Ltd.

Gold Member Since 2025

Audited Supplier

Business Type Trading Company
Main Products PCB, PCBA
Number of Employees 3
Year of Establishment 2020-12-18
Management System Certification ISO 9001
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays

Complex PCB Layout Comparison

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Transaction Info
	Advanced Multilayer PCB Board Designed for Asic Performance Contact Now	OEM Home Appliance Electronic Industry Control PCB & PCBA Best PCBA Circuit Board PCB Customized PCBA Assembly Manufacturer Contact Now	OEM ODM Electronics Factory Multilayer Printed Circuit Board PCBA PCB Manufacturer Provide Electronic PCB Design Contact Now	Electronics Circuit Board PCBA PCB Circuit Boards Custom OEM ODM PCBA for Electronics Circuit Board Contact Now	High Frequency UPS PCB Board CFL Inverter Circuit Board Contact Now
Price	US $ 0.11-9.90/ Square Meter	US $ 0.25-1.35/ Piece	US $ 0.25-1.35/ Piece	US $ 0.25-1.35/ Piece	US $ 0.25-1.35/ Piece
Min Order	1 Square Meters	1 Pieces	1 Pieces	1 Pieces	1 Pieces
Payment Terms	L/C, Paypal	T/T, D/P, Western Union	T/T, D/P, Western Union	T/T, D/P, Western Union	T/T, D/P, Western Union
Quality Control
Management System Certification	ISO 9001	ISO 9001, IATF16949	ISO 9001, IATF16949	ISO 9001, IATF16949	ISO 9001, IATF16949
Trade Capacity
Export Markets	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe
Annual Export Revenue	US$50 Million - US$100 Million	US$1 Million - US$2.5 Million	US$1 Million - US$2.5 Million	US$1 Million - US$2.5 Million	US$1 Million - US$2.5 Million
Business Model	OEM, ODM, Own Brand()	OEM, ODM	OEM, ODM	OEM, ODM	OEM, ODM
Average Lead Time	Off Season Lead Time: 1-3 months Peak Season Lead Time: 1-3 months	-	-	-	-
Product Attributes
Specification	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Aerospace; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Aluminum; Insulation Materials: Organic Resin; Brand: Hemeil;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Communication; Flame Retardant Properties: V2; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: New Chip; Layer: 1-32 Layers; Service: OEM/ODM; OEM/ODM: Available; Test: 100%E-Testing; Layer Count: 1-20 Layers; Shipping: DHL/UPS/FedEx/Air/Sea; Surface Treatmen: OSP, Enig, HASL, AG Immersion; Certificate Gurantee: Yes;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Communication; Flame Retardant Properties: V2; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: New Chip; Layer: 1-32 Layers; Service: OEM/ODM; OEM/ODM: Available; Test: 100%E-Testing; Layer Count: 1-20 Layers; Shipping: DHL/UPS/FedEx/Air/Sea; Surface Treatmen: OSP, Enig, HASL, AG Immersion; Certificate Gurantee: Yes;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Communication; Flame Retardant Properties: V2; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: New Chip; Layer: 1-32 Layers; Service: OEM/ODM; OEM/ODM: Available; Test: 100%E-Testing; Layer Count: 1-20 Layers; Shipping: DHL/UPS/FedEx/Air/Sea; Surface Treatmen: OSP, Enig, HASL, AG Immersion; Certificate Gurantee: Yes;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Communication; Flame Retardant Properties: V2; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: New Chip; Layer: 1-32 Layers; Service: OEM/ODM; OEM/ODM: Available; Test: 100%E-Testing; Layer Count: 1-20 Layers; Shipping: DHL/UPS/FedEx/Air/Sea; Surface Treatmen: OSP, Enig, HASL, AG Immersion; Certificate Gurantee: Yes;
Supplier Name	Shenzhen Hemeilin Technology Co., Ltd.	Shenzhen New Chip international Ltd	Shenzhen New Chip international Ltd	Shenzhen New Chip international Ltd	Shenzhen New Chip international Ltd
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