Durable Using Various Ice Maker PCB Assembly Circuit Board for Designing

About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

100-999 Pieces US$1.00

1,000-4,999 Pieces US$0.80

5,000+ Pieces US$0.60

Sepcifications

  • Type Rigid Circuit Board
  • Flame Retardant Properties V0
  • Dielectric FR-4
  • Base Material Copper
  • Insulation Materials Organic Resin
  • Processing Technology Electrolytic Foil
  • Application Consumer Electronics
  • Mechanical Rigid Rigid
  • Material Copper-Based
  • Brand Hometech
  • Transport Package Carton Box with Bubble Pack,Vacuum Packing/Blister
  • Trademark OEM
  • Origin Ningbo China
  • Delivery 2 Weeks
  • PCBA QC X-ray,Aoi Test,Function Test(100% Test)

Product Description

Product Description Product Parameters Max panel size 32" x 20.5"(800mm x 520mm) Min trace width/ space (inner layer) 4mil/4mil(0.1mm/0.1mm) Min PAD (inner layer) 5 mil(0.13mm) Min thickness(inner layer) 4 mil(0.1mm) Inner copper thickness 1~4 oz Outer copper thickness 0.5~6 oz ...

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PCB Comparison
Transaction Info
Price US $ 0.60-1.00/ Piece US $ 45.00-60.00/ Square Meter US $ 0.1/ PCS US $ 2.50-3.50/ PCS US $ 1.80-2.30/ PCS
Min Order 100 Pieces 5 Square Meters 1 PCS 1 PCS 1 PCS
Payment Terms L/C, T/T, Western Union, Paypal T/T L/C, T/T, Paypal L/C, T/T, Paypal L/C, T/T, Paypal
Quality Control
Management System Certification ISO 9001, BSCI ISO 9001 ISO 9001, ISO 9000, ISO 14001, ISO 14000, ISO 20000, OHSAS/ OHSMS 18001, IATF16949 ISO 9001, ISO 9000, ISO 14001, ISO 14000, ISO 20000, OHSAS/ OHSMS 18001, IATF16949 ISO 9001, ISO 9000, ISO 14001, ISO 14000, ISO 20000, OHSAS/ OHSMS 18001, IATF16949
Trade Capacity
Export Markets North America, Eastern Europe, Africa, Mid East, Western Europe North America, South America, Eastern Europe, Western Europe North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe
Annual Export Revenue Above US$100 Million - Above US$100 Million Above US$100 Million Above US$100 Million
Business Model OEM, ODM, Own Brand() OEM OEM OEM OEM
Average Lead Time - Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Product Attributes
Specification
Type: Rigid Circuit Board;
Flame Retardant Properties: V0;
Dielectric: FR-4;
Base Material: Copper;
Insulation Materials: Organic Resin;
Processing Technology: Electrolytic Foil;
Application: Consumer Electronics;
Mechanical Rigid: Rigid;
Material: Copper-Based;
Brand: Hometech;
Delivery: 2 Weeks;
PCBA QC: X-ray,Aoi Test,Function Test(100% Test);
Type: Rigid Circuit Board;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Surface: OSP,Immersion Gold,Hal Lead Free,Hal;
Solder Mask: Green,Red,Yellow,White,Black,Blue,etc;
Shipment: Air,Sea,Express(DHL TNT FedEx EMS UPS);
Sample Date: 3-5days;
Type: Flexible Circuit Board;
Flame Retardant Properties: V0;
Dielectric: Pi;
Base Material: Copper;
Insulation Materials: Organic Resin;
Processing Technology: Electrolytic Foil;
Application: Medical Instruments;
Mechanical Rigid: Fexible;
Material: Paper Phenolic Copper Foil Substrate;
Brand: Uc;
Copper Thickness: 1oz;
Surface Finihsing: Immersion Gold;
Lead Time: 6-8 Working Days;
Type: Flexible Circuit Board;
Flame Retardant Properties: V0;
Dielectric: Pi;
Base Material: Copper;
Insulation Materials: Organic Resin;
Processing Technology: Electrolytic Foil;
Application: Medical Instruments;
Mechanical Rigid: Fexible;
Material: Paper Phenolic Copper Foil Substrate;
Brand: Uc;
Copper Thickness: 1oz;
Surface Finihsing: Immersion Gold;
Lead Time: 6-8 Working Days;
Type: Flexible Circuit Board;
Flame Retardant Properties: V0;
Dielectric: Pi;
Base Material: Copper;
Insulation Materials: Organic Resin;
Processing Technology: Electrolytic Foil;
Application: Medical Instruments;
Mechanical Rigid: Fexible;
Material: Paper Phenolic Copper Foil Substrate;
Brand: Uc;
Copper Thickness: 1oz;
Surface Finihsing: Immersion Gold;
Lead Time: 6-8 Working Days;
Supplier Name

Ningbo Hometech Technology Co., Ltd.

Gold Member Audited Supplier

Zhejiang Dejia Electronics Technology Co.,Ltd.

Gold Member Audited Supplier

Ucreate PCB Co., Ltd.

Diamond Member Audited Supplier

Ucreate PCB Co., Ltd.

Diamond Member Audited Supplier

Ucreate PCB Co., Ltd.

Diamond Member Audited Supplier