Printed Circuit Board Assembly
US$0.76-5.00 / Piece
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PCB Manufacture Mobile Phone Circuit Board OEM Circuit Board 2 Layer Fr4 Assembled PCBA Video

About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

10-999 Pieces US$5.00

1,000-4,999 Pieces US$2.10

5,000+ Pieces US$0.76

Sepcifications

  • Dielectric FR-4
  • Material Aluminum Covered Copper Foil Layer
  • Application Consumer Electronics
  • Flame Retardant Properties V0
  • Base Material Aluminum
  • Insulation Materials Organic Resin
  • Brand OEM/ODM
  • Transport Package Antistatic Package+Plastic Box and Carton Box
  • Specification Customized
  • Trademark Customized
  • Origin Shenzhen China
  • PCBA-Testing X-ray, Aoi
  • Processing Electrolytic Foil
  • SMT Capacity >2 Million Points/Day
  • DIP Capacity >100K Parts/Day
  • Certification RoHS, CCC, ISO
  • Min. Space of BGA +/- 0.3mm
  • Min.Pin Space of IC 0.3mm
  • Max.Precision of IC Assembly 0.03mm
  • Surface Finishing Lead-Free HASL
  • Number of Layers 4-10 Layer
  • Board Thickness 1.6mm

Product Description

PCB Manufacture Mobile Phone Circuit Board Oem Circuit Board 2 Layer Fr4 Assembled PCBA Files and Requirment for PCB,PCBA quotation: A BOM (Bill of Materials) with reference designators: component description, manufacturer's name and part number. PCB Gerber files. A PCB fabrication drawing and ...

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Printed Circuit Board Assembly Comparison
Transaction Info
Price US $ 0.76-5.00/ Piece US $ 0.18-1.88/ Piece US $ 0.18-1.88/ Piece US $ 0.20-1.20/ Piece US $ 0.20-1.20/ Piece
Min Order 10 Pieces 1 Pieces 1 Pieces 1 Pieces 1 Pieces
Trade Terms - - - - -
Payment Terms T/T T/T, Western Union, Paypal, Money Gram T/T, Western Union, Paypal, Money Gram T/T, Western Union, Paypal, Money Gram T/T, Western Union, Paypal, Money Gram
Quality Control
Product Certification RoHS, CCC, ISO - - - -
Management System Certification ISO 9001, IATF16949, ISO 13485 ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949
Trade Capacity
Export Markets Domestic North America, South America, Eastern Europe, Southeast Asia, Africa, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Mid East, Eastern Asia, Western Europe
Annual Export Revenue - - - - -
Business Model OEM, ODM OEM, ODM OEM, ODM OEM, ODM OEM, ODM
Average Lead Time Off-season: 1 Month(s)
Peak-season: 1-3 Month(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Product Attributes
Specification
Dielectric: FR-4;
Material: Aluminum Covered Copper Foil Layer;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Brand: OEM/ODM;
PCBA-Testing: X-ray, Aoi;
Processing: Electrolytic Foil;
SMT Capacity: >2 Million Points/Day;
DIP Capacity: >100K Parts/Day;
Min. Space of BGA: +/- 0.3mm;
Min.Pin Space of IC: 0.3mm;
Max.Precision of IC Assembly: 0.03mm;
Surface Finishing: Lead-Free HASL;
Number of Layers: 4-10 Layer;
Board Thickness: 1.6mm;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Szx;
Layers: Multilayer;
Surface Treatment: HASL, Immersion Gold, OSP, etc.;
Service Providing: PCB Production, PCB Assembly, Components Sourcing;
Solder Marsk: Green, Black, Blue, Red, Yellow, White etc.;
Hole: Mechanical Hole, Laser Hole;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Szx;
Layers: Multilayer;
Surface Treatment: HASL, Immersion Gold, OSP, etc.;
Service Providing: PCB Production, PCB Assembly, Components Sourcing;
Solder Marsk: Green, Black, Blue, Red, Yellow, White etc.;
Hole: Mechanical Hole, Laser Hole;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Szx;
Layers: Multilayer;
Solder Marsk: Green,Black,Blue,Red,Yellow,White;
Hole: Mechanical Hole, Laser Hole;
Assembly: Components;
Processing: SMT and DIP;
Surface Treatment: HASL, Immersion Gold, OSP;
Service Providing: PCB Production,PCB Assembly,Components Sourcing;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Szx;
Layers: Multilayer;
Solder Marsk: Green,Black,Blue,Red,Yellow,White;
Hole: Mechanical Hole, Laser Hole;
Assembly: Components;
Processing: SMT and DIP;
Surface Treatment: HASL, Immersion Gold, OSP;
Service Providing: PCB Production,PCB Assembly,Components Sourcing;
Supplier Name

Shenzhen Hongzhou Smart Technology Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Shenzexin Electronic (Hongkong) Co., Ltd.

China Supplier - Gold Member Audited Supplier

Shenzexin Electronic (Hongkong) Co., Ltd.

China Supplier - Gold Member Audited Supplier

Shenzexin Electronic (Hongkong) Co., Ltd.

China Supplier - Gold Member Audited Supplier

Shenzexin Electronic (Hongkong) Co., Ltd.

China Supplier - Gold Member Audited Supplier