OEM Printed Circuit Board SMT & DIP PCB Assembly Video

Name: OEM Printed Circuit Board SMT & DIP PCB Assembly
Uploaded: 2024-03-18T12:37:00+08:00
Description: OEM Printed Circuit Board SMT & DIP PCB Assembly Files and Requirment for PCB,PCBA quotation: A BOM (Bill of Materials) with reference designators: component description, manufacturer's name and par

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Price

Purchase Qty. Reference FOB Price

10-99 Pieces US$5.00

100-999 Pieces US$3.50

1,000-4,999 Pieces US$1.20

5,000+ Pieces US$0.67

Sepcifications

Type Flexible Circuit Board
Dielectric FR-4
Material Aluminum Covered Copper Foil Layer
Application Communication
Flame Retardant Properties V0
Mechanical Rigid Fexible
Processing Technology Customized
Base Material Aluminum
Insulation Materials Epoxy Resin
Brand OEM/ODM
Transport Package Antistatic Package+Plastic Box and Carton Box
Specification Customized
Trademark Customized
Origin Shenzhen China
PCBA-Testing X-ray, Aoi
Processing Electrolytic Foil
SMT Capacity >2 Million Points/Day
DIP Capacity >100K Parts/Day
Certification RoHS, CCC, ISO
Min. Space of BGA +/- 0.3mm
Min.Pin Space of IC 0.3mm
Max.Precision of IC Assembly 0.03mm
Surface Finishing Lead-Free HASL
Number of Layers 4-10 Layer
Board Thickness 1.6mm

Product Description

OEM Printed Circuit Board SMT &DIP PCB Assembly Files and Requirment for PCB,PCBA quotation: A BOM (Bill of Materials) with reference designators: component description, manufacturer's name and part number. PCB Gerber files. A PCB fabrication drawing and PCBA assembly drawing. Test ...

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Shenzhen Hongzhou Smart Technology Co., Ltd.

Diamond Member Since 2020

Audited Supplier

Business Type Manufacturer/Factory & Trading Company
Main Products Self Service KIOSK
Registered Capital 147802.18 USD
Plant Area 3200 square meters
Management System Certification ISO9001:2015
OEM/ODM Availability Yes

PCB Assembly Services Comparison

	Quick View OEM Printed Circuit Board SMT & DIP PCB Assembly Contact Now	PCB PCBA, Electronic Components PCB Board Assembly Contact Now	Trusted Valued PCBA Factory Injection Molding and Box Assembly Bare PCB Manufacturing Board Circuit Contact Now	PCBA PCB PCBA Service Electronics Manufacturer Assembly Printed Circuit Boar Contact Now	PCB One-Stop Service Design Circuit Board PCB Factory Customized PCB Board Manufacture Contact Now

Transaction Info
	Quick View OEM Printed Circuit Board SMT & DIP PCB Assembly Contact Now	PCB PCBA, Electronic Components PCB Board Assembly Contact Now	Trusted Valued PCBA Factory Injection Molding and Box Assembly Bare PCB Manufacturing Board Circuit Contact Now	PCBA PCB PCBA Service Electronics Manufacturer Assembly Printed Circuit Boar Contact Now	PCB One-Stop Service Design Circuit Board PCB Factory Customized PCB Board Manufacture Contact Now
Price	US $ 0.67-5.00/ Piece	US $ 2.00-4.50/ Piece	US $ 2.00-4.50/ Piece	US $ 2.00-4.50/ Piece	US $ 0.25-2.80/ Piece
Min Order	10 Pieces	2 Pieces	2 Pieces	2 Pieces	2 Pieces
Trade Terms	-	-	-	-	-
Payment Terms	T/T, Paypal, Money Gram	T/T, D/P, Western Union	T/T, D/P, Western Union	T/T, D/P, Western Union	T/T, D/P, Western Union
Quality Control
Product Certification	RoHS, CCC, ISO	-	-	-	-
Management System Certification	ISO 9001, IATF16949, ISO 13485	ISO 9001, IATF16949	ISO 9001, IATF16949	ISO 9001, IATF16949	ISO 9001, IATF16949
Trade Capacity
Export Markets	Domestic	North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia	North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia	North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia	North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia
Annual Export Revenue	-	-	-	-	-
Business Model	OEM, ODM	OEM, ODM	OEM, ODM	OEM, ODM	OEM, ODM
Average Lead Time	Off-season: 1 Month(s) Peak-season: 1-3 Month(s)	-	-	-	-
Product Attributes
Specification	Type: Flexible Circuit Board; Dielectric: FR-4; Material: Aluminum Covered Copper Foil Layer; Application: Communication; Flame Retardant Properties: V0; Mechanical Rigid: Fexible; Processing Technology: Customized; Base Material: Aluminum; Insulation Materials: Epoxy Resin; Brand: OEM/ODM; PCBA-Testing: X-ray, Aoi; Processing: Electrolytic Foil; SMT Capacity: >2 Million Points/Day; DIP Capacity: >100K Parts/Day; Min. Space of BGA: +/- 0.3mm; Min.Pin Space of IC: 0.3mm; Max.Precision of IC Assembly: 0.03mm; Surface Finishing: Lead-Free HASL; Number of Layers: 4-10 Layer; Board Thickness: 1.6mm;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Communication; Flame Retardant Properties: V2; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: New Chip; Layer: 1-32 Layers; Service: OEM/ODM; OEM/ODM: Available; Test: 100%E-Testing; Layer Count: 1-20 Layers; Shipping: DHL/UPS/FedEx/Air/Sea; Surface Treatmen: OSP, Enig, HASL, AG Immersion; Certificate Gurantee: Yes;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Communication; Flame Retardant Properties: V2; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: New Chip; Layer: 1-32 Layers; Service: OEM/ODM; OEM/ODM: Available; Test: 100%E-Testing; Layer Count: 1-20 Layers; Shipping: DHL/UPS/FedEx/Air/Sea; Surface Treatmen: OSP, Enig, HASL, AG Immersion; Certificate Gurantee: Yes;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Communication; Flame Retardant Properties: V2; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: New Chip; Layer: 1-32 Layers; Service: OEM/ODM; OEM/ODM: Available; Test: 100%E-Testing; Layer Count: 1-20 Layers; Shipping: DHL/UPS/FedEx/Air/Sea; Surface Treatmen: OSP, Enig, HASL, AG Immersion; Certificate Gurantee: Yes;	Type: Rigid Circuit Board; Dielectric: CEM-3; Material: Fiberglass Epoxy Resin + Polyimide Resin; Application: Medical Instruments; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Metal Composite Materials; Brand: New Chip; Soldermask Color: Green, Yellow, Blue, Black, White...; Sample: Available; OEM/ODM: Available; Certificate Gurantee: Yes; Test: 100%E-Testing; Color of Silk Screen: Green, Purple, Black; Service: OEM / Dfm;
Supplier Name	Shenzhen Hongzhou Smart Technology Co., Ltd.	Shenzhen New Chip international Ltd	Shenzhen New Chip international Ltd	Shenzhen New Chip international Ltd	Shenzhen New Chip international Ltd
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