Specification |
Type: Customized;
Dielectric: FR-4;
Material: Aluminum Covered Copper Foil Layer;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Customized;
Processing Technology: Customized;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Brand: OEM/ODM;
PCBA-Testing: X-ray, Aoi;
Processing: Electrolytic Foil;
SMT Capacity: >2 Million Points/Day;
DIP Capacity: >100K Parts/Day;
Min. Space of BGA: +/- 0.3mm;
Min.Pin Space of IC: 0.3mm;
Max.Precision of IC Assembly: 0.03mm;
Surface Finishing: Lead-Free HASL;
Number of Layers: 4-10 Layer;
Board Thickness: 1.6mm;
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Type: Rigid Circuit Board;
Material: Fr4;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Hl-PCB;
Surface Treatment: Lead Free HASL;
Mini Hole Diameter: 0.3mm;
Borad Thickness: 1.0mm;
Count Layer: 4;
Inner/Outer Copper Thickness: 3oz/3oz;
Min Trace Width/Spacing: 20mil / 20mil;
Special: High Reliable Withstand Voltage Heavy Copper PCB;
Certifications: ISO9001, ISO14001, CE, UL, RoHS, IATF16949 etc.;
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Type: Rigid Circuit Board;
Material: Fr4;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Hl-PCB;
Surface Treatment: OSP;
Mini Hole Diameter: 0.3mm;
Borad Thickness: 1.6mm;
Count Layer: 4;
Inner/Outer Copper Thickness: 1oz/1oz;
Min Trace Width/Spacing: 12mil/12mil;
Special: High Reliability;
Certificated: ISO9001, ISO14001, CQC, IATF16949, UL, RoHS etc.;
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Type: Rigid Circuit Board;
Material: Fr4;
Application: Comsumer;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Hl-PCB;
Surface Treatment: OSP;
Mini Hole Diameter: 0.2mm;
Borad Thickness: 1.6mm;
Count Layer: 4;
Inner/Outer Copper Thickness: 1oz/1oz;
Min Trace Width/Spacing: 4mil/4mil;
Special: High Tg Pcbs, Resin Plug Vias;
Certificated: ISO9001, ISO14001, CQC, IATF16949, UL, RoHS etc.;
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Type: Rigid Circuit Board;
Material: Fr4;
Application: Security Engineer;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Hl-PCB;
Surface Treatment: Immersion Au;
Mini Hole Diameter: 0.2mm;
Borad Thickness: 1.6mm;
Count Layer: 2;
Inner/Outer Copper Thickness: 1oz/1oz;
Min Trace Width/Spacing: 5mil/4mil;
Special: Balck Printing Ink, Impedance;
Certificated: ISO9001, ISO14001, CQC, IATF16949, UL, RoHS etc.;
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